Issued Patents All Time
Showing 1–25 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424446 | Silicon (Si) dry etch for die-to-wafer thinning | ChangBum YONG, Prayudi Lianto, Cheng-ko J. Sun, Arvind Sundarrajan | 2025-09-23 |
| 12417998 | Procedure to enable die rework for hybrid bonding | Ying Wang | 2025-09-16 |
| 12374586 | Methods of TSV formation for advanced packaging | Peng Suo, Ying Wang, Chang Bum Yong, Arvind Sundarrajan | 2025-07-29 |
| 12354968 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Giorgio Cellere, Diego Tonini +2 more | 2025-07-08 |
| 12237186 | On-board cleaning of tooling parts in hybrid bonding tool | Ruiping Wang, Ying Wang, Ananthkrishna Jupudi, Praveen Kumar Choragudi | 2025-02-25 |
| 12138742 | Methods and apparatus for processing a substrate | Prayudi Lianto, Arvind Sundarrajan, Andrivo RUSYDI, Muhammad Avicenna Naradipa | 2024-11-12 |
| 12087571 | Methods, systems, and apparatus for tape-frame substrate cleaning and drying | Ying Wang, Gregory J. Wilson | 2024-09-10 |
| 12048948 | Methods for forming microwave tunable composited thin-film dielectric layer | Yueh Sheng Ow, Yue Cui, Arvind Sundarrajan, Nuno Yen-Chu Chen, Felix Deng | 2024-07-30 |
| 12051653 | Reconstituted substrate for radio frequency applications | Ramesh Chidambaram | 2024-07-30 |
| 12020992 | Methods and apparatus for processing a substrate | Prayudi Lianto, Arvind Sundarrajan, Muhammad Avicenna Naradipa, Andrivo RUSYDI | 2024-06-25 |
| 12001193 | Apparatus for environmental control of dies and substrates for hybrid bonding | Ying Wang, Xundong Dai, Ruiping Wang, Michael R. Rice, Hari Ponnekanti +1 more | 2024-06-04 |
| 11899376 | Methods for forming alignment marks | Prayudi Lianto, Liu Jiang, Marvin L. Bernt, El Mehdi Bazizi | 2024-02-13 |
| 11854886 | Methods of TSV formation for advanced packaging | Peng Suo, Ying Wang, Chang Bum Yong, Arvind Sundarrajan | 2023-12-26 |
| 11837464 | Methods, systems, and apparatus for tape-frame substrate cleaning and drying | Ying Wang, Gregory J. Wilson | 2023-12-05 |
| 11791094 | Semiconductor substrate having magnetic core inductor | Peng Suo, Yu Gu, Arvind Sundarrajan | 2023-10-17 |
| 11715700 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Giorgio Cellere, Diego Tonini +2 more | 2023-08-01 |
| 11476202 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Giorgio Cellere, Diego Tonini +2 more | 2022-10-18 |
| 11421316 | Methods and apparatus for controlling warpage in wafer level packaging processes | Prayudi Lianto, Mohamed Rafi, Muhammad Azim Bin Syed Sulaiman, Ang Yu Xin Kristy, Karthik Elumalai +2 more | 2022-08-23 |
| 11417605 | Reconstituted substrate for radio frequency applications | Ramesh Chidambaram | 2022-08-16 |
| 11404318 | Methods of forming through-silicon vias in substrates for advanced packaging | Peng Suo, Ying Wang, Chang Bum Yong, Arvind Sundarrajan | 2022-08-02 |
| 11398433 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Giorgio Cellere, Diego Tonini +2 more | 2022-07-26 |
| 11373803 | Method of forming a magnetic core on a substrate | Peng Suo, Yu Gu, Arvind Sundarrajan | 2022-06-28 |
| 11355358 | Methods of thinning silicon on epoxy mold compound for radio frequency (RF) applications | Prayudi Lianto, Yu Gu | 2022-06-07 |
| 11342256 | Method of fine redistribution interconnect formation for advanced packaging applications | Han-Wen Chen, Steven Verhaverbeke, Kyuil Cho, Prayudi Lianto, Vincent DiCaprio | 2022-05-24 |
| 11309278 | Methods for bonding substrates | Prayudi Lianto, Sriskantharajah Thirunavukarasu, Arvind Sundarrajan, Xundong Dai, Peter Khai Mum Fung | 2022-04-19 |