Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11421316 | Methods and apparatus for controlling warpage in wafer level packaging processes | Prayudi Lianto, Muhammad Azim Bin Syed Sulaiman, Guan Huei See, Ang Yu Xin Kristy, Karthik Elumalai +2 more | 2022-08-23 |
| 10473712 | Integrated circuit device testing in an inert gas | Nam Teck Shannon Teo, Giji Hervias Juele, Teck Hui Wong, Ming Xue | 2019-11-12 |
| 10002771 | Methods for chemical mechanical polishing (CMP) processing with ozone | Prayudi Lianto, Kuma Hsiung, Eric J. Bergman, John L. Klocke, MUHAMMAD AZIM +2 more | 2018-06-19 |