Issued Patents All Time
Showing 25 most recent of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12404597 | Electrochemical depositions of nanotwin copper materials | Jing Xu, Marvin L. Bernt, Eric J. Bergman, Kwan Wook Roh | 2025-09-02 |
| 12344955 | Electroplating co-planarity improvement by die shielding | Charles Sharbono, Paul R. McHugh, Gregory J. Wilson, Nolan L. Zimmerman | 2025-07-01 |
| 12209325 | Nanofiltration for wafer rinsing | — | 2025-01-28 |
| 12188144 | Wafer immersion in semiconductor processing chambers | John Igo | 2025-01-07 |
| 12146235 | Plating and deplating currents for material co-planarity in semiconductor plating processes | Paul R. McHugh, Charles Sharbono, Jing Xu, Sam Lee, Keith E. Ypma | 2024-11-19 |
| 12116686 | Parameter adjustment model for semiconductor processing chambers | Eric J. Bergman, Adam Marc McClure, Paul R. McHugh, Gregory J. Wilson | 2024-10-15 |
| 11982008 | Electroplating system | Paul R. McHugh, Gregory J. Wilson, Kyle M. Hanson, Paul Van Valkenburg, Eric J. Bergman +5 more | 2024-05-14 |
| 11973034 | Nanotwin copper materials in semiconductor devices | Eric J. Bergman, Marvin L. Bernt, Jing Xu, Kwan Wook Roh | 2024-04-30 |
| 11901225 | Diffusion layers in metal interconnects | Eric J. Bergman, Marvin L. Bernt, Prayudi Lianto | 2024-02-13 |
| 11634830 | Electrochemical depositions of nanotwin copper materials | Jing Xu, Marvin L. Bernt, Eric J. Bergman, Kwan Wook Roh | 2023-04-25 |
| 11578422 | Electroplating system | Paul R. McHugh, Gregory J. Wilson, Kyle M. Hanson, Paul Van Valkenburg, Eric J. Bergman +5 more | 2023-02-14 |
| 11268208 | Electroplating system | Paul R. McHugh, Gregory J. Wilson, Kyle M. Hanson, Paul Van Valkenburg, Eric J. Bergman +5 more | 2022-03-08 |
| 11211252 | Systems and methods for copper (I) suppression in electrochemical deposition | Eric J. Bergman, You Wang | 2021-12-28 |
| 10971354 | Drying high aspect ratio features | Eric J. Bergman, Paul R. McHugh, Stuart Crane, Richard W. Plavidal | 2021-04-06 |
| 10840104 | Controlled etch of nitride features | Eric J. Bergman, Charles Sharbono, Kyle M. Hanson, Paul R. McHugh | 2020-11-17 |
| 10546762 | Drying high aspect ratio features | Eric J. Bergman, Paul R. McHugh, Stuart Crane, Richard W. Plavidal | 2020-01-28 |
| 10354875 | Techniques for improved removal of sacrificial mask | Rajesh Prasad, Ning Zhan, Tzu-Yu Liu, James Cournoyer, Kyu-Ha Shim +4 more | 2019-07-16 |
| 10240248 | Adaptive electric field shielding in an electroplating processor using agitator geometry and motion control | Paul Van Valkenburg, Robert Mikkola, Paul R. McHugh, Gregory J. Wilson, Kyle M. Hanson +1 more | 2019-03-26 |
| 10227707 | Inert anode electroplating processor and replenisher | Gregory J. Wilson, Paul R. McHugh | 2019-03-12 |
| 10191379 | Removing photoresist from a wafer | Paul R. McHugh, Kyle M. Hanson, Eric J. Bergman, Stuart Crane, Gregory J. Wilson | 2019-01-29 |
| 10002771 | Methods for chemical mechanical polishing (CMP) processing with ozone | Prayudi Lianto, Kuma Hsiung, Eric J. Bergman, Mohamed Rafi, MUHAMMAD AZIM +2 more | 2018-06-19 |
| 9234293 | Electrolytic copper process using anion permeable barrier | Rajesh Baskaran, Robert W. Batz, Jr., Bioh Kim, Thomas Ritzdorf, Kyle M. Hanson | 2016-01-12 |
| 8961771 | Electrolytic process using cation permeable barrier | Rajesh Baskaran, Robert W. Batz, Jr., Bioh Kim, Tom Ritzdorf, Kyle M. Hanson | 2015-02-24 |
| 8852417 | Electrolytic process using anion permeable barrier | Rajesh Baskaran, Robert W. Batz, Jr., Bioh Kim, Tom Ritzdorf, Kyle M. Hanson | 2014-10-07 |
| 8500968 | Deplating contacts in an electrochemical plating apparatus | Daniel J. Woodruff, Nolan L. Zimmerman, Klaus H. Pfeifer, Kyle M. Hanson, Matthew Herset | 2013-08-06 |