Issued Patents All Time
Showing 25 most recent of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9326489 | Training devices for domestic animals | — | 2016-05-03 |
| 9234293 | Electrolytic copper process using anion permeable barrier | Rajesh Baskaran, Robert W. Batz, Jr., Bioh Kim, John L. Klocke, Kyle M. Hanson | 2016-01-12 |
| 7462269 | Method for low temperature annealing of metallization micro-structures in the production of a microelectronic device | E. Henry Stevens, Linlin Chen, Lyndon Graham, Curt Dundas | 2008-12-09 |
| 7438788 | Apparatus and methods for electrochemical processing of microelectronic workpieces | Kyle M. Hanson, Gregory J. Wilson, Paul R. McHugh | 2008-10-21 |
| 7332066 | Apparatus and method for electrochemically depositing metal on a semiconductor workpiece | Linlin Chen, Gregory J. Wilson, Paul R. McHugh, Robert A. Weaver | 2008-02-19 |
| 7300562 | Platinum alloy using electrochemical deposition | Zhongmin Hu, Lyndon Graham | 2007-11-27 |
| 7264698 | Apparatus and methods for electrochemical processing of microelectronic workpieces | Kyle M. Hanson, Gregory J. Wilson, Paul R. McHugh | 2007-09-04 |
| 7244677 | Method for filling recessed micro-structures with metallization in the production of a microelectronic device | Lyndon Graham | 2007-07-17 |
| 7229543 | Apparatus for controlling and/or measuring additive concentration in an electroplating bath | Lyndon Graham, Thomas C. Taylor, Fredrick A. Lindberg, Bradley C. Carpenter | 2007-06-12 |
| 7189318 | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece | Gregory J. Wilson, Paul R. McHugh, Robert A. Weaver | 2007-03-13 |
| 7161689 | Apparatus and method for processing a microelectronic workpiece using metrology | Steve Eudy, Gregory J. Wilson, Paul R. McHugh | 2007-01-09 |
| 7160421 | Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece | Gregory J. Wilson, Paul R. McHugh, Robert A. Weaver | 2007-01-09 |
| 7144805 | Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density | Linlin Chen, Lyndon Graham, Dakin Fulton, Robert W. Batz, Jr. | 2006-12-05 |
| 7115196 | Apparatus and method for electrochemically depositing metal on a semiconductor workpiece | Linlin Chen, Gregory J. Wilson, Paul R. McHugh, Robert A. Weaver | 2006-10-03 |
| 7102763 | Methods and apparatus for processing microelectronic workpieces using metrology | Steve Eudy, Gregory J. Wilson, Paul R. McHugh, Robert A. Weaver, Brian Aegerter +2 more | 2006-09-05 |
| 7020537 | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece | Gregory J. Wilson, Paul R. McHugh, Robert A. Weaver | 2006-03-28 |
| 7001471 | Method and apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device | E. Henry Stevens, Linlin Chen, Lyndon Graham, Curt Dundas | 2006-02-21 |
| 6994776 | Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic device | E. Henry Stevens, Linlin Chen, Lyndon Graham, Curt Dundas | 2006-02-07 |
| RE38931 | Methods for controlling and/or measuring additive concentration in an electroplating bath | Lyndon Graham, Thomas C. Taylor, Fredrick A. Lindberg, Bradley C. Carpenter | 2006-01-10 |
| 6936153 | Semiconductor plating system workpiece support having workpiece-engaging electrode with pre-conditioned contact face | — | 2005-08-30 |
| 6921467 | Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces | Kyle M. Hanson, Steve Eudy, Gregory J. Wilson, Daniel J. Woodruff, Randy Harris +4 more | 2005-07-26 |
| 6921468 | Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations | Lyndon Graham, Kyle M. Hanson, Jeffrey I. Turner | 2005-07-26 |
| 6806186 | Submicron metallization using electrochemical deposition | Linlin Chen, Lyndon Graham, Dakin Fulton, Robert W. Batz, Jr. | 2004-10-19 |
| 6776892 | Semiconductor plating system workpiece support having workpiece engaging electrode with pre-conditioned contact face | Jeffrey I. Turner | 2004-08-17 |
| 6753251 | Method for filling recessed micro-structures with metallization in the production of a microelectronic device | Lyndon Graham | 2004-06-22 |