| 7462269 |
Method for low temperature annealing of metallization micro-structures in the production of a microelectronic device |
Thomas Ritzdorf, Linlin Chen, Lyndon Graham, Curt Dundas |
2008-12-09 |
| 7001471 |
Method and apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device |
Thomas Ritzdorf, Linlin Chen, Lyndon Graham, Curt Dundas |
2006-02-21 |
| 6994776 |
Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic device |
Thomas Ritzdorf, Linlin Chen, Lyndon Graham, Curt Dundas |
2006-02-07 |
| 6887789 |
Process and manufacturing tool architecture for use in the manufacture of one or more protected metallization structures on a workpiece |
— |
2005-05-03 |
| 6664197 |
Process for etching thin-film layers of a workpiece used to form microelectronic circuits or components |
Richard Pfeiffer |
2003-12-16 |
| 6508920 |
Apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device |
Thomas Ritzdorf, Linlin Chen, Lyndon Graham, Curt Dundas |
2003-01-21 |
| 6451114 |
Apparatus for application of chemical process to a workpiece |
— |
2002-09-17 |
| 6376374 |
Process and manufacturing tool architecture for use in the manufacturing of one or more protected metallization structures on a workpiece |
— |
2002-04-23 |
| 6331490 |
Process for etching thin-film layers of a workpiece used to form microelectric circuits or components |
Richard Pfeiffer |
2001-12-18 |
| 6143126 |
Process and manufacturing tool architecture for use in the manufacture of one or more metallization levels on an integrated circuit |
— |
2000-11-07 |
| 6120641 |
Process architecture and manufacturing tool sets employing hard mask patterning for use in the manufacture of one or more metallization levels on a workpiece |
Robert W. Berner |
2000-09-19 |
| 5741721 |
Method of forming capacitors and interconnect lines |
— |
1998-04-21 |
| 5610099 |
Process for fabricating transistors using composite nitride structure |
Richard A. Bailey, Thomas C. Taylor |
1997-03-11 |
| 5508881 |
Capacitors and interconnect lines for use with integrated circuits |
— |
1996-04-16 |
| 5385634 |
Sealed self aligned contact process |
Douglas Butler, Richard A. Bailey, Thomas C. Taylor |
1995-01-31 |
| 5170242 |
Reaction barrier for a multilayer structure in an integrated circuit |
Masahiro Maekawa |
1992-12-08 |
| 5070036 |
Process for contacting and interconnecting semiconductor devices within an integrated circuit |
— |
1991-12-03 |
| 4977440 |
Structure and process for contacting and interconnecting semiconductor devices within an integrated circuit |
— |
1990-12-11 |
| 4784973 |
Semiconductor contact silicide/nitride process with control for silicide thickness |
Paul J. McClure, Christopher W. Hill |
1988-11-15 |