| 11824317 |
Wire nut electrical connector |
Tammy Graham |
2023-11-21 |
|
| 7462269 |
Method for low temperature annealing of metallization micro-structures in the production of a microelectronic device |
Thomas Ritzdorf, E. Henry Stevens, Linlin Chen, Curt Dundas |
2008-12-09 |
$1,766,000 |
| 7300562 |
Platinum alloy using electrochemical deposition |
Zhongmin Hu, Thomas Ritzdorf |
2007-11-27 |
$2,457,000 |
| 7244677 |
Method for filling recessed micro-structures with metallization in the production of a microelectronic device |
Thomas Ritzdorf |
2007-07-17 |
$2,684,000 |
| 7229543 |
Apparatus for controlling and/or measuring additive concentration in an electroplating bath |
Thomas C. Taylor, Thomas Ritzdorf, Fredrick A. Lindberg, Bradley C. Carpenter |
2007-06-12 |
$2,890,000 |
| 7144805 |
Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density |
Linlin Chen, Thomas Ritzdorf, Dakin Fulton, Robert W. Batz, Jr. |
2006-12-05 |
$1,506,000 |
| 7135404 |
Method for applying metal features onto barrier layers using electrochemical deposition |
Rajesh Baskaran, Bioh Kim, Linlin Chen |
2006-11-14 |
$4,531,000 |
| 7001471 |
Method and apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device |
Thomas Ritzdorf, E. Henry Stevens, Linlin Chen, Curt Dundas |
2006-02-21 |
$1,432,000 |
| 6994776 |
Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic device |
Thomas Ritzdorf, E. Henry Stevens, Linlin Chen, Curt Dundas |
2006-02-07 |
$3,397,000 |
| RE38931 |
Methods for controlling and/or measuring additive concentration in an electroplating bath |
Thomas C. Taylor, Thomas Ritzdorf, Fredrick A. Lindberg, Bradley C. Carpenter |
2006-01-10 |
|
| 6921468 |
Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
Kyle M. Hanson, Thomas Ritzdorf, Jeffrey I. Turner |
2005-07-26 |
$1,524,000 |
| 6899805 |
Automated chemical management system executing improved electrolyte analysis method |
Linlin Chen |
2005-05-31 |
$1,672,000 |
| 6814855 |
Automated chemical management system having improved analysis unit |
Dakin Fulton |
2004-11-09 |
$3,605,000 |
| 6806186 |
Submicron metallization using electrochemical deposition |
Linlin Chen, Thomas Ritzdorf, Dakin Fulton, Robert W. Batz, Jr. |
2004-10-19 |
$1,078,000 |
| 6753251 |
Method for filling recessed micro-structures with metallization in the production of a microelectronic device |
Thomas Ritzdorf |
2004-06-22 |
$2,344,000 |
| 6663762 |
Plating system workpiece support having workpiece engaging electrode |
Martin Bleck, Kyle M. Hanson |
2003-12-16 |
$2,508,000 |
| 6599412 |
In-situ cleaning processes for semiconductor electroplating electrodes |
Thomas Ritzdorf, Jeffrey I. Turner |
2003-07-29 |
$1,636,000 |
| 6551479 |
Apparatus for controlling and/or measuring additive concentration in an electroplating bath |
Thomas C. Taylor, Thomas Ritzdorf, Fredrick A. Lindberg, Bradley C. Carpenter |
2003-04-22 |
$2,466,000 |
| 6508920 |
Apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device |
Thomas Ritzdorf, E. Henry Stevens, Linlin Chen, Curt Dundas |
2003-01-21 |
$2,863,000 |
| 6365033 |
Methods for controlling and/or measuring additive concentration in an electroplating bath |
Thomas C. Taylor, Thomas Ritzdorf, Fredrick A. Lindberg, Bradley C. Carpenter |
2002-04-02 |
$5,598,000 |
| 6358388 |
Plating system workpiece support having workpiece-engaging electrodes with distal contact-part and dielectric cover |
Martin Bleck, Kyle M. Hanson |
2002-03-19 |
$2,685,000 |
| 6270647 |
Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
Kyle M. Hanson, Thomas Ritzdorf, Jeffrey I. Turner |
2001-08-07 |
$7,606,000 |
| 6099712 |
Semiconductor plating bowl and method using anode shield |
Thomas Ritzdorf, Jeffrey I. Turner |
2000-08-08 |
$3,286,000 |
| 5985126 |
Semiconductor plating system workpiece support having workpiece engaging electrodes with distal contact part and dielectric cover |
Martin Bleck, Kyle M. Hanson |
1999-11-16 |
$1,516,000 |