Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824317 | Wire nut electrical connector | Tammy Graham | 2023-11-21 |
| 7462269 | Method for low temperature annealing of metallization micro-structures in the production of a microelectronic device | Thomas Ritzdorf, E. Henry Stevens, Linlin Chen, Curt Dundas | 2008-12-09 |
| 7300562 | Platinum alloy using electrochemical deposition | Zhongmin Hu, Thomas Ritzdorf | 2007-11-27 |
| 7244677 | Method for filling recessed micro-structures with metallization in the production of a microelectronic device | Thomas Ritzdorf | 2007-07-17 |
| 7229543 | Apparatus for controlling and/or measuring additive concentration in an electroplating bath | Thomas C. Taylor, Thomas Ritzdorf, Fredrick A. Lindberg, Bradley C. Carpenter | 2007-06-12 |
| 7144805 | Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density | Linlin Chen, Thomas Ritzdorf, Dakin Fulton, Robert W. Batz, Jr. | 2006-12-05 |
| 7135404 | Method for applying metal features onto barrier layers using electrochemical deposition | Rajesh Baskaran, Bioh Kim, Linlin Chen | 2006-11-14 |
| 7001471 | Method and apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device | Thomas Ritzdorf, E. Henry Stevens, Linlin Chen, Curt Dundas | 2006-02-21 |
| 6994776 | Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic device | Thomas Ritzdorf, E. Henry Stevens, Linlin Chen, Curt Dundas | 2006-02-07 |
| RE38931 | Methods for controlling and/or measuring additive concentration in an electroplating bath | Thomas C. Taylor, Thomas Ritzdorf, Fredrick A. Lindberg, Bradley C. Carpenter | 2006-01-10 |
| 6921468 | Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations | Kyle M. Hanson, Thomas Ritzdorf, Jeffrey I. Turner | 2005-07-26 |
| 6899805 | Automated chemical management system executing improved electrolyte analysis method | Linlin Chen | 2005-05-31 |
| 6814855 | Automated chemical management system having improved analysis unit | Dakin Fulton | 2004-11-09 |
| 6806186 | Submicron metallization using electrochemical deposition | Linlin Chen, Thomas Ritzdorf, Dakin Fulton, Robert W. Batz, Jr. | 2004-10-19 |
| 6753251 | Method for filling recessed micro-structures with metallization in the production of a microelectronic device | Thomas Ritzdorf | 2004-06-22 |
| 6663762 | Plating system workpiece support having workpiece engaging electrode | Martin Bleck, Kyle M. Hanson | 2003-12-16 |
| 6599412 | In-situ cleaning processes for semiconductor electroplating electrodes | Thomas Ritzdorf, Jeffrey I. Turner | 2003-07-29 |
| 6551479 | Apparatus for controlling and/or measuring additive concentration in an electroplating bath | Thomas C. Taylor, Thomas Ritzdorf, Fredrick A. Lindberg, Bradley C. Carpenter | 2003-04-22 |
| 6508920 | Apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device | Thomas Ritzdorf, E. Henry Stevens, Linlin Chen, Curt Dundas | 2003-01-21 |
| 6365033 | Methods for controlling and/or measuring additive concentration in an electroplating bath | Thomas C. Taylor, Thomas Ritzdorf, Fredrick A. Lindberg, Bradley C. Carpenter | 2002-04-02 |
| 6358388 | Plating system workpiece support having workpiece-engaging electrodes with distal contact-part and dielectric cover | Martin Bleck, Kyle M. Hanson | 2002-03-19 |
| 6270647 | Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations | Kyle M. Hanson, Thomas Ritzdorf, Jeffrey I. Turner | 2001-08-07 |
| 6099712 | Semiconductor plating bowl and method using anode shield | Thomas Ritzdorf, Jeffrey I. Turner | 2000-08-08 |
| 5985126 | Semiconductor plating system workpiece support having workpiece engaging electrodes with distal contact part and dielectric cover | Martin Bleck, Kyle M. Hanson | 1999-11-16 |