Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10260855 | Electroplating tool with feedback of metal thickness distribution and correction | Todd Egan, Edward W. Budiarto, Robert O. Miller, Abraham Ravid, Bridger Earl HOERNER +1 more | 2019-04-16 |
| 9234293 | Electrolytic copper process using anion permeable barrier | Rajesh Baskaran, Bioh Kim, Thomas Ritzdorf, John L. Klocke, Kyle M. Hanson | 2016-01-12 |
| 8961771 | Electrolytic process using cation permeable barrier | Rajesh Baskaran, Bioh Kim, Tom Ritzdorf, John L. Klocke, Kyle M. Hanson | 2015-02-24 |
| 8852417 | Electrolytic process using anion permeable barrier | Rajesh Baskaran, Bioh Kim, Tom Ritzdorf, John L. Klocke, Kyle M. Hanson | 2014-10-07 |
| 8236159 | Electrolytic process using cation permeable barrier | Rajesh Baskaran, Bioh Kim, Tom Ritzdorf, John L. Klocke, Kyle M. Hanson | 2012-08-07 |
| 8123926 | Electrolytic copper process using anion permeable barrier | Rajesh Baskaran, Bioh Kim, Tom Ritzdorf, John L. Klocke, Kyle M. Hanson | 2012-02-28 |
| 7252714 | Apparatus and method for thermally controlled processing of microelectronic workpieces | Kyle M. Hanson, Rajesh Baskaran, Nolan L. Zimmerman, Zhongmin Hu, Gregory J. Wilson +1 more | 2007-08-07 |
| 7144805 | Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density | Linlin Chen, Lyndon Graham, Thomas Ritzdorf, Dakin Fulton | 2006-12-05 |
| 7048841 | Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces | John M. Pedersen, John L. Klocke, Linlin Chen | 2006-05-23 |
| 6939448 | Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces | John M. Pedersen, John L. Klocke, Linlin Chen | 2005-09-06 |
| 6911127 | Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces | John M. Pedersen, John L. Klocke, Linlin Chen | 2005-06-28 |
| 6849167 | Electroplating reactor including back-side electrical contact apparatus | Daniel J. Woodruff, Kyle M. Hanson, James T. Kuechmann | 2005-02-01 |
| 6805778 | Contact assembly for supplying power to workpieces during electrochemical processing | Kenneth C. Haugan, Harry J. Geyer, Robert W. Berner | 2004-10-19 |
| 6806186 | Submicron metallization using electrochemical deposition | Linlin Chen, Lyndon Graham, Thomas Ritzdorf, Dakin Fulton | 2004-10-19 |
| 6669834 | Method for high deposition rate solder electroplating on a microelectronic workpiece | Scot Conrady, Thomas Ritzdorf | 2003-12-30 |
| 6602383 | Apparatus and methods for controlling workpiece surface exposure to processing liquids during the fabrication of microelectronic components | Reed A. Blackburn, Steven Edward Kelly, James Doolittle | 2003-08-05 |
| 6527926 | Electroplating reactor including back-side electrical contact apparatus | Daniel J. Woodruff, Kyle M. Hanson, James T. Kuechmann | 2003-03-04 |
| 6527925 | Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces | John M. Pedersen, John L. Klocke, Linlin Chen | 2003-03-04 |
| 6461494 | Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot | Kenneth C. Haugan, Harry J. Geyer, Robert W. Berner | 2002-10-08 |
| 6334937 | Apparatus for high deposition rate solder electroplating on a microelectronic workpiece | Scot Conrady, Thomas Ritzdorf | 2002-01-01 |
| 6090711 | Methods for controlling semiconductor workpiece surface exposure to processing liquids | Reed A. Blackburn, Steven Edward Kelly | 2000-07-18 |
| 6001234 | Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot | Kenneth C. Haugan, Harry J. Geyer, Robert W. Berner | 1999-12-14 |