| 10260855 |
Electroplating tool with feedback of metal thickness distribution and correction |
Todd Egan, Edward W. Budiarto, Robert O. Miller, Abraham Ravid, Bridger Earl HOERNER +1 more |
2019-04-16 |
$29,421,000 |
| 9234293 |
Electrolytic copper process using anion permeable barrier |
Rajesh Baskaran, Bioh Kim, Thomas Ritzdorf, John L. Klocke, Kyle M. Hanson |
2016-01-12 |
$9,921,000 |
| 8961771 |
Electrolytic process using cation permeable barrier |
Rajesh Baskaran, Bioh Kim, Tom Ritzdorf, John L. Klocke, Kyle M. Hanson |
2015-02-24 |
$19,887,000 |
| 8852417 |
Electrolytic process using anion permeable barrier |
Rajesh Baskaran, Bioh Kim, Tom Ritzdorf, John L. Klocke, Kyle M. Hanson |
2014-10-07 |
$14,828,000 |
| 8236159 |
Electrolytic process using cation permeable barrier |
Rajesh Baskaran, Bioh Kim, Tom Ritzdorf, John L. Klocke, Kyle M. Hanson |
2012-08-07 |
$10,850,000 |
| 8123926 |
Electrolytic copper process using anion permeable barrier |
Rajesh Baskaran, Bioh Kim, Tom Ritzdorf, John L. Klocke, Kyle M. Hanson |
2012-02-28 |
$8,688,000 |
| 7252714 |
Apparatus and method for thermally controlled processing of microelectronic workpieces |
Kyle M. Hanson, Rajesh Baskaran, Nolan L. Zimmerman, Zhongmin Hu, Gregory J. Wilson +1 more |
2007-08-07 |
$3,355,000 |
| 7144805 |
Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density |
Linlin Chen, Lyndon Graham, Thomas Ritzdorf, Dakin Fulton |
2006-12-05 |
$1,506,000 |
| 7048841 |
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces |
John M. Pedersen, John L. Klocke, Linlin Chen |
2006-05-23 |
$2,702,000 |
| 6939448 |
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces |
John M. Pedersen, John L. Klocke, Linlin Chen |
2005-09-06 |
$2,545,000 |
| 6911127 |
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces |
John M. Pedersen, John L. Klocke, Linlin Chen |
2005-06-28 |
$3,338,000 |
| 6849167 |
Electroplating reactor including back-side electrical contact apparatus |
Daniel J. Woodruff, Kyle M. Hanson, James T. Kuechmann |
2005-02-01 |
$4,057,000 |
| 6805778 |
Contact assembly for supplying power to workpieces during electrochemical processing |
Kenneth C. Haugan, Harry J. Geyer, Robert W. Berner |
2004-10-19 |
$1,078,000 |
| 6806186 |
Submicron metallization using electrochemical deposition |
Linlin Chen, Lyndon Graham, Thomas Ritzdorf, Dakin Fulton |
2004-10-19 |
$1,078,000 |
| 6669834 |
Method for high deposition rate solder electroplating on a microelectronic workpiece |
Scot Conrady, Thomas Ritzdorf |
2003-12-30 |
$2,613,000 |
| 6602383 |
Apparatus and methods for controlling workpiece surface exposure to processing liquids during the fabrication of microelectronic components |
Reed A. Blackburn, Steven Edward Kelly, James Doolittle |
2003-08-05 |
$1,679,000 |
| 6527926 |
Electroplating reactor including back-side electrical contact apparatus |
Daniel J. Woodruff, Kyle M. Hanson, James T. Kuechmann |
2003-03-04 |
$1,262,000 |
| 6527925 |
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces |
John M. Pedersen, John L. Klocke, Linlin Chen |
2003-03-04 |
$1,262,000 |
| 6461494 |
Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot |
Kenneth C. Haugan, Harry J. Geyer, Robert W. Berner |
2002-10-08 |
$1,997,000 |
| 6334937 |
Apparatus for high deposition rate solder electroplating on a microelectronic workpiece |
Scot Conrady, Thomas Ritzdorf |
2002-01-01 |
|
| 6090711 |
Methods for controlling semiconductor workpiece surface exposure to processing liquids |
Reed A. Blackburn, Steven Edward Kelly |
2000-07-18 |
$5,532,000 |
| 6001234 |
Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot |
Kenneth C. Haugan, Harry J. Geyer, Robert W. Berner |
1999-12-14 |
$3,296,000 |
