Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6805778 | Contact assembly for supplying power to workpieces during electrochemical processing | Robert W. Batz, Jr., Kenneth C. Haugan, Robert W. Berner | 2004-10-19 |
| 6733649 | Electrochemical processing method | Martin Bleck, Kenneth C. Haugan, Larry R. Radloff | 2004-05-11 |
| 6461494 | Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot | Robert W. Batz, Jr., Kenneth C. Haugan, Robert W. Berner | 2002-10-08 |
| 6274013 | Electrode semiconductor workpiece holder | Martin Bleck, Kenneth C. Haugan, Larry R. Radloff | 2001-08-14 |
| 6001234 | Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot | Robert W. Batz, Jr., Kenneth C. Haugan, Robert W. Berner | 1999-12-14 |
| 5980706 | Electrode semiconductor workpiece holder | Martin Bleck, Kenneth C. Haugan, Larry R. Radloff | 1999-11-09 |
| 5467253 | Semiconductor chip package and method of forming | James K. Heckman, Francis J. Carney | 1995-11-14 |
| 5240165 | Method and apparatus for controlled deformation bonding | Ronald M. Lahti | 1993-08-31 |
| 5232144 | Apparatus for tape automated bonding | Francis J. Carney, Renee M. Gregg | 1993-08-03 |
| 4943708 | Data device module having locking groove | Marion I. Simmons | 1990-07-24 |
| 4927505 | Metallization scheme providing adhesion and barrier properties | Ravinder K. Sharma, Douglas G. Mitchell | 1990-05-22 |
| 4880708 | Metallization scheme providing adhesion and barrier properties | Ravinder K. Sharma, Douglas G. Mitchell | 1989-11-14 |
| 4795077 | Bonding method and apparatus | James H. Knapp, Setsuko J. Cole | 1989-01-03 |