Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5674780 | Method of forming an electrically conductive polymer bump over an aluminum electrode | William H. Lytle, Treliant Fang, Jong-Kai Lin, Naresh Saha | 1997-10-07 |
| 5555341 | Waveguide with an electrically conductive channel | Michael S. Lebby, Davis H. Hartman, Kent W. Hansen | 1996-09-10 |
| 5411400 | Interconnect system for a semiconductor chip and a substrate | Ravichandran Subrahmanyan, William H. Lytle, Barry C. Johnson | 1995-05-02 |
| 4946376 | Backside metallization scheme for semiconductor devices | William H. Lytle, Angela Rogona, Bennett L. Hileman | 1990-08-07 |
| 4927505 | Metallization scheme providing adhesion and barrier properties | Harry J. Geyer, Douglas G. Mitchell | 1990-05-22 |
| 4880708 | Metallization scheme providing adhesion and barrier properties | Harry J. Geyer, Douglas G. Mitchell | 1989-11-14 |