Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5391285 | Adjustable plating cell for uniform bump plating of semiconductor wafers | William H. Lytle, Tien-Yu Lee | 1995-02-21 |
| 4946376 | Backside metallization scheme for semiconductor devices | Ravinder K. Sharma, William H. Lytle, Angela Rogona | 1990-08-07 |