Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355412 | Stacked silicon package assembly having thermal management | Jaspreet S. Gandhi, Gamal Refai-Ahmed, Henley Liu, Myongseob Kim, Suresh Ramalingam +1 more | 2022-06-07 |
| 11315858 | Chip package assembly with enhanced solder resist crack resistance | Yu-Hsiang Sun, Suresh Ramalingam, Jaspreet S. Gandhi | 2022-04-26 |
| 11257795 | Chip-scale LED package structure | Chih-Yuan Chen, Wei-Lun Tsai, Chien-Tung Huang, Wei-Hsun Hsu, Wei-Chien HUNG | 2022-02-22 |
| 10930611 | Solder joints for board level reliability | Jaspreet S. Gandhi | 2021-02-23 |
| 10527670 | Testing system for lid-less integrated circuit packages | Gamal Refai-Ahmed, Ivor G. Barber, Suresh Ramalingam, Jaspreet S. Gandhi, Henley Liu +2 more | 2020-01-07 |
| 10529645 | Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management | Jaspreet S. Gandhi, Henley Liu, Gamal Refai-Ahmed, Myongseob Kim, Ferdinand F. Fernandez +2 more | 2020-01-07 |
| 10319606 | Chip package assembly with enhanced interconnects and method for fabricating the same | Jaspreet S. Gandhi, Henley Liu, Ivor G. Barber, Suresh Ramalingam | 2019-06-11 |
| 10096502 | Method and apparatus for assembling and testing a multi-integrated circuit package | Gamal Refai-Ahmed, Suresh Ramalingam, Mohsen H. Mardi, Ivor G. Barber, Cheang-Whang Chang +1 more | 2018-10-09 |
| 10043730 | Stacked silicon package assembly having an enhanced lid | Gamal Refai-Ahmed, Ferdinand F. Fernandez, Suresh Ramalingam, Ivor G. Barber, Inderjit Singh +1 more | 2018-08-07 |
| 9653669 | LED package structure | Chih-Yuan Chen | 2017-05-16 |
| 9455387 | LED package structure and manufacturing method thereof | Chih-Yuan Chen | 2016-09-27 |
| 9204542 | Multi-use package substrate | Rafael C. Camarota | 2015-12-01 |
| 8530346 | Process of forming an electronic device including a conductive stud over a bonding pad region | Lakshmi N. Ramanathan, Jinbang Tang | 2013-09-10 |
| 8216864 | LED device and packaging method thereof | Chia-Hao Wu | 2012-07-10 |
| 8217511 | Redistributed chip packaging with thermal contact to device backside | Neil T. Tracht, Darrel R. Frear, James R. Griffiths, Lizabeth Keser, Elie A. Maalouf | 2012-07-10 |
| 7892882 | Methods and apparatus for a semiconductor device package with improved thermal performance | George R. Leal, Victor A. Chiriac, Marc Alan Mangrum, Robert J. Wenzel | 2011-02-22 |
| 7812448 | Electronic device including a conductive stud over a bonding pad region | Lakshmi N. Ramanathan, Jinbang Tang | 2010-10-12 |
| 7741651 | Light emitting diode | Chia-Hao Wu | 2010-06-22 |
| 7405102 | Methods and apparatus for thermal management in a multi-layer embedded chip structure | Craig Amrine, Victor A. Chiriac, Lizabeth Keser, George R. Leal, Robert J. Wenzel | 2008-07-29 |
| 6906900 | Structure and method of thermally protecting power devices for airbag deployment | Paul T. Bennett, Victor A. Chiriac, David Domenic Putti, William E. Edwards | 2005-06-14 |
| 6897562 | Electronic component and method of manufacturing same | Lei Mercado, Jay Liu | 2005-05-24 |
| 6440318 | Printed circuit board with a multilayer integral thin-film metal resistor and method therefor | Lawrence E. Lach, Gregory J. Dunn | 2002-08-27 |
| 6418016 | System and method for cooling using an oscillatory impinging jet | Victor A. Chiriac | 2002-07-09 |
| 6352192 | System and method to control solder reflow furnace with wafer surface characterization | James Vernon Hause, Li Li | 2002-03-05 |
| 6194990 | Printed circuit board with a multilayer integral thin-film metal resistor and method therefor | Lawrence E. Lach, Gregory J. Dunn | 2001-02-27 |