Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224968 | Systems and methods for analyzing chatbot communication sessions to reduce escalation | Johncy Arul ANBUROSE | 2025-02-11 |
| 9263375 | System, method and apparatus for leadless surface mounted semiconductor package | Lakshminarayan Viswanathan, Audel A. Sanchez, Fernando A. Santos | 2016-02-16 |
| 8803302 | System, method and apparatus for leadless surface mounted semiconductor package | Lakshminarayan Viswanathan, Audel A. Sanchez, Fernando A. Santos | 2014-08-12 |
| 8530346 | Process of forming an electronic device including a conductive stud over a bonding pad region | Tien-Yu Lee, Jinbang Tang | 2013-09-10 |
| 8236609 | Packaging an integrated circuit die with backside metallization | Craig Amrine, Jianwen Xu | 2012-08-07 |
| 7950144 | Method for controlling warpage in redistributed chip packaging panels | George R. Leal, Douglas G. Mitchell, Betty Hill-Shan Yeung | 2011-05-31 |
| 7812448 | Electronic device including a conductive stud over a bonding pad region | Tien-Yu Lee, Jinbang Tang | 2010-10-12 |
| 7723224 | Microelectronic assembly with back side metallization and method for forming the same | Darrell G. Hill, Philip H. Bowles, Jan Campbell, Terry Daly, Jason R. Fender +1 more | 2010-05-25 |
| 6951801 | Metal reduction in wafer scribe area | Scott K. Pozder, Trent S. Uehling | 2005-10-04 |
| 6803323 | Method of forming a component overlying a semiconductor substrate | Douglas G. Mitchell, Varughese Mathew | 2004-10-12 |