Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12392821 | Thermal and electrical conductivity between metal contacts utilizing spring pin connectors | Alexander Komposch, Eric Jacob Palsgaard, Douglas John Kroon, Matthew Kirke Mellor, Donald Fowlkes | 2025-08-19 |
| 10517755 | Methods and devices for brain cooling for treatment and/or prevention of epileptic seizures | Raimondo D'Ambrosio, Jeffrey G. Ojemann, John W. Miller, Matthew Smyth, Steven M. Rothman | 2019-12-31 |
| 10366986 | Integrated circuits and devices with interleaved transistor elements, and methods of their fabrication | Michael L. Fraser, Frank E. Danaher | 2019-07-30 |
| 10318447 | Universal SPI (Serial Peripheral Interface) | Nicholas Justin Mountford Spence, Michael L. Fraser | 2019-06-11 |
| 10283500 | Methods of fabricating integrated circuits and devices with interleaved transistor elements | Michael L. Fraser, Frank E. Danaher | 2019-05-07 |
| 9780090 | Integrated circuits and devices with interleaved transistor elements, and methods of their fabrication | Michael L. Fraser, Frank E. Danaher | 2017-10-03 |
| 9658971 | Universal SPI (serial peripheral interface) | Nicholas Justin Mountford Spence, Michael L. Fraser | 2017-05-23 |
| 9522081 | Methods and devices for brain cooling for treatment and/or prevention of epileptic seizures | Raimondo D'Ambrosio, Jeffrey G. Ojemann, John W. Miller, Matthew Smyth, Steven M. Rothman | 2016-12-20 |
| 9070683 | Die fracture detection and humidity protection with double guard ring arrangement | Ngai-Ming Lau | 2015-06-30 |
| 8591562 | Methods and devices for brain cooling for treatment and prevention of acquired epilepsy | Raimondo D'Ambrosio, Matthew Smyth, Steven M. Rothman, John W. Miller | 2013-11-26 |
| 7935607 | Integrated passive device with a high resistivity substrate and method for forming the same | Jonathan K. Abrokwah, Keri L. Costello, James G. Cotronakis, Terry Daly, Adolfo G. Reyes | 2011-05-03 |
| 7723224 | Microelectronic assembly with back side metallization and method for forming the same | Darrell G. Hill, Philip H. Bowles, Jan Campbell, Terry Daly, Lakshmi N. Ramanathan +1 more | 2010-05-25 |
| 7339267 | Semiconductor package and method for forming the same | Vasile Romega Thompson, Terry Daly, Jin-Wook Jang | 2008-03-04 |