| 12500562 |
RF amplifier devices and methods of manufacturing including modularized designs with flip chip interconnections |
Basim Noori, Marvin Marbell, Scott Sheppard, Kwang-taek Lim, Qinghui MU +1 more |
2025-12-16 |
|
| 12470185 |
Semiconductor device packages with exposed heat dissipating surfaces and methods of fabricating the same |
Eng Wah Woo, Soon Lee Liew, Kok Meng Kam |
2025-11-11 |
|
| 12451413 |
Packaged semiconductor devices with leadframes having tie bar with recessed cavity |
Soon Lee Liew, Eng Wah Woo |
2025-10-21 |
|
| 12392821 |
Thermal and electrical conductivity between metal contacts utilizing spring pin connectors |
Jason R. Fender, Eric Jacob Palsgaard, Douglas John Kroon, Matthew Kirke Mellor, Donald Fowlkes |
2025-08-19 |
|
| 12166003 |
RF amplifier devices including top side contacts and methods of manufacturing |
Basim Noori, Marvin Marbell, Scott Sheppard, Kwangmo Chris Lim, Qianli Mu |
2024-12-10 |
$77,393,000 |
| 12119239 |
Packaged semiconductor devices, and package molds for forming packaged semiconductor devices |
Soon Lee Liew, Eng Wah Woo, Kok Meng Kam, Samantha Cheang |
2024-10-15 |
$37,918,000 |
| 12100630 |
Packaged RF power device with PCB routing outside protective member |
Marvin Marbell, Melvin Nava, Jeremy Fisher |
2024-09-24 |
$58,949,000 |
| 12080660 |
Package with different types of semiconductor dies attached to a flange |
Xikun Zhang, Dejiang Chang, Bill Agar, Michael Lefevre |
2024-09-03 |
$15,035,000 |
| 12051669 |
Contact and die attach metallization for silicon carbide based devices and related methods of sputtering eutectic alloys |
Kevin Shawne Schneider, Scott Sheppard |
2024-07-30 |
$36,413,000 |
| 12034419 |
RF amplifiers having shielded transmission line structures |
Kwangmo Chris Lim, Basim Noori, Qianli Mu, Marvin Marbell, Scott Sheppard |
2024-07-09 |
$28,228,000 |
| 12009286 |
Methods of forming packaged semiconductor devices and leadframes for semiconductor device packages |
Soon Lee Liew, Eng Wah Woo |
2024-06-11 |
$18,032,000 |
| 11935879 |
Integrated passive device (IPD) components and a package and processes implementing the same |
Eng Wah Woo, Samantha Cheang, Kok Meng Kam, Marvin Mabell, Haedong Jang |
2024-03-19 |
$28,109,000 |
| 11837457 |
Packaging for RF transistor amplifiers |
Basim Noori, Marvin Marbell, Scott Sheppard, Kwangmo Chris Lim, Qianli Mu |
2023-12-05 |
$18,968,000 |
| 11830810 |
Packaged transistor having die attach materials with channels and process of implementing the same |
Mitch Flowers, Erwin B. Cohen, Larry Wall |
2023-11-28 |
$34,492,000 |
| 11688673 |
Integrated passive device (IPD) components and a package and processes implementing the same |
Marvin Marbell, Arthur Fong-Yuen Pun, Jeremy Fisher, Ulf Hakan Andre |
2023-06-27 |
$101,074,000 |
| 11670605 |
RF amplifier devices including interconnect structures and methods of manufacturing |
Basim Noori, Marvin Marbell, Scott Sheppard, Kwangmo Chris Lim, Qianli Mu |
2023-06-06 |
$99,581,000 |
| 11581859 |
Radio frequency (RF) transistor amplifier packages with improved isolation and lead configurations |
Qianli Mu, Kun-Chih Wang, Eng Wah Woo |
2023-02-14 |
$76,953,000 |
| 11533024 |
Multi-zone radio frequency transistor amplifiers |
Kwangmo Chris Lim, Basim Noori, Qianli Mu, Marvin Marbell, Scott Sheppard |
2022-12-20 |
$68,804,000 |
| 11488923 |
High reliability semiconductor devices and methods of fabricating the same |
Sung Chul Joo, Brian Condie, Benjamin P. Law, Jae Hyung Park |
2022-11-01 |
$70,679,000 |
| 11437362 |
Multi-cavity package having single metal flange |
Saurabh Goel, Cynthia Blair, Cristian Gozzi |
2022-09-06 |
$216,978,000 |
| 11430744 |
Die-attach method to compensate for thermal expansion |
David Seebacher, Christian Schuberth, Peter Singerl |
2022-08-30 |
$112,716,000 |
| 11424177 |
Integrated circuit having die attach materials with channels and process of implementing the same |
Mitch Flowers, Erwin B. Cohen |
2022-08-23 |
$115,768,000 |
| 11367696 |
Radio frequency amplifiers having improved shunt matching circuits |
Simon Ward, Richard Wilson |
2022-06-21 |
$103,430,000 |
| 11356070 |
RF amplifiers having shielded transmission line structures |
Kwangmo Chris Lim, Basim Noori, Qianli Mu, Marvin Marbell, Scott Sheppard |
2022-06-07 |
$41,992,000 |
| 11289378 |
Methods for dicing semiconductor wafers and semiconductor devices made by the methods |
Kevin Shawne Schneider |
2022-03-29 |
$91,689,000 |
