Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12392821 | Thermal and electrical conductivity between metal contacts utilizing spring pin connectors | Jason R. Fender, Eric Jacob Palsgaard, Douglas John Kroon, Matthew Kirke Mellor, Donald Fowlkes | 2025-08-19 |
| 12166003 | RF amplifier devices including top side contacts and methods of manufacturing | Basim Noori, Marvin Marbell, Scott Sheppard, Kwangmo Chris Lim, Qianli Mu | 2024-12-10 |
| 12119239 | Packaged semiconductor devices, and package molds for forming packaged semiconductor devices | Soon Lee Liew, Eng Wah Woo, Kok Meng Kam, Samantha Cheang | 2024-10-15 |
| 12100630 | Packaged RF power device with PCB routing outside protective member | Marvin Marbell, Melvin Nava, Jeremy Fisher | 2024-09-24 |
| 12080660 | Package with different types of semiconductor dies attached to a flange | Xikun Zhang, Dejiang Chang, Bill Agar, Michael Lefevre | 2024-09-03 |
| 12051669 | Contact and die attach metallization for silicon carbide based devices and related methods of sputtering eutectic alloys | Kevin Shawne Schneider, Scott Sheppard | 2024-07-30 |
| 12034419 | RF amplifiers having shielded transmission line structures | Kwangmo Chris Lim, Basim Noori, Qianli Mu, Marvin Marbell, Scott Sheppard | 2024-07-09 |
| 12009286 | Methods of forming packaged semiconductor devices and leadframes for semiconductor device packages | Soon Lee Liew, Eng Wah Woo | 2024-06-11 |
| 11935879 | Integrated passive device (IPD) components and a package and processes implementing the same | Eng Wah Woo, Samantha Cheang, Kok Meng Kam, Marvin Mabell, Haedong Jang | 2024-03-19 |
| 11837457 | Packaging for RF transistor amplifiers | Basim Noori, Marvin Marbell, Scott Sheppard, Kwangmo Chris Lim, Qianli Mu | 2023-12-05 |
| 11830810 | Packaged transistor having die attach materials with channels and process of implementing the same | Mitch Flowers, Erwin B. Cohen, Larry Wall | 2023-11-28 |
| 11688673 | Integrated passive device (IPD) components and a package and processes implementing the same | Marvin Marbell, Arthur Fong-Yuen Pun, Jeremy Fisher, Ulf Hakan Andre | 2023-06-27 |
| 11670605 | RF amplifier devices including interconnect structures and methods of manufacturing | Basim Noori, Marvin Marbell, Scott Sheppard, Kwangmo Chris Lim, Qianli Mu | 2023-06-06 |
| 11581859 | Radio frequency (RF) transistor amplifier packages with improved isolation and lead configurations | Qianli Mu, Kun-Chih Wang, Eng Wah Woo | 2023-02-14 |
| 11533024 | Multi-zone radio frequency transistor amplifiers | Kwangmo Chris Lim, Basim Noori, Qianli Mu, Marvin Marbell, Scott Sheppard | 2022-12-20 |
| 11488923 | High reliability semiconductor devices and methods of fabricating the same | Sung Chul Joo, Brian Condie, Benjamin P. Law, Jae Hyung Park | 2022-11-01 |
| 11437362 | Multi-cavity package having single metal flange | Saurabh Goel, Cynthia Blair, Cristian Gozzi | 2022-09-06 |
| 11430744 | Die-attach method to compensate for thermal expansion | David Seebacher, Christian Schuberth, Peter Singerl | 2022-08-30 |
| 11424177 | Integrated circuit having die attach materials with channels and process of implementing the same | Mitch Flowers, Erwin B. Cohen | 2022-08-23 |
| 11367696 | Radio frequency amplifiers having improved shunt matching circuits | Simon Ward, Richard Wilson | 2022-06-21 |
| 11356070 | RF amplifiers having shielded transmission line structures | Kwangmo Chris Lim, Basim Noori, Qianli Mu, Marvin Marbell, Scott Sheppard | 2022-06-07 |
| 11289378 | Methods for dicing semiconductor wafers and semiconductor devices made by the methods | Kevin Shawne Schneider | 2022-03-29 |
| 11257740 | Device carrier configured for interconnects, a package implementing a device carrier having interconnects, and processes of making the same | Simon Ward, Madhu Chidurala | 2022-02-22 |
| 11152325 | Contact and die attach metallization for silicon carbide based devices and related methods of sputtering eutectic alloys | Kevin Shawne Schneider, Scott Sheppard | 2021-10-19 |
| 11004808 | Package with different types of semiconductor dies attached to a flange | Xikun Zhang, Dejiang Chang, Bill Agar, Michael Lefevre | 2021-05-11 |