| 12500562 |
RF amplifier devices and methods of manufacturing including modularized designs with flip chip interconnections |
Basim Noori, Scott Sheppard, Kwang-taek Lim, Alexander Komposch, Qinghui MU +1 more |
2025-12-16 |
|
| 12417966 |
IPD components having SiC substrates and devices and processes implementing the same |
Donald Farrell, Jeremy Fisher, Dan Namishia, Scott Sheppard, Dan Etter |
2025-09-16 |
|
| 12402240 |
Silicon carbide thermal bridge integrated on a low thermal conductivity substrate and processes implementing the same |
Haedong Jang, Jeremy Fisher |
2025-08-26 |
|
| 12394733 |
Stacked RF circuit topology |
Basim Noori, Kwangmo Chris Lim, Qianli Mu |
2025-08-19 |
|
| 12230614 |
Multi-typed integrated passive device (IPD) components and devices and processes implementing the same |
Haedong Jang, Jeremy Fisher, Basim Noori |
2025-02-18 |
|
| 12166003 |
RF amplifier devices including top side contacts and methods of manufacturing |
Basim Noori, Scott Sheppard, Kwangmo Chris Lim, Alexander Komposch, Qianli Mu |
2024-12-10 |
$77,393,000 |
| 12113490 |
Group III nitride-based radio frequency transistor amplifiers having source, gate and/or drain conductive vias |
Basim Noori, Qianli Mu, Kwangmo Chris Lim, Michael E. Watts, Mario M. Bokatius +1 more |
2024-10-08 |
$11,666,000 |
| 12100630 |
Packaged RF power device with PCB routing outside protective member |
Melvin Nava, Jeremy Fisher, Alexander Komposch |
2024-09-24 |
$58,949,000 |
| 12068265 |
Device having a coupled interstage transformer and process implementing the same |
— |
2024-08-20 |
$50,289,000 |
| 12034419 |
RF amplifiers having shielded transmission line structures |
Kwangmo Chris Lim, Basim Noori, Qianli Mu, Scott Sheppard, Alexander Komposch |
2024-07-09 |
$28,228,000 |
| 11967936 |
Output-integrated transistor device packages |
Jonathan Chang |
2024-04-23 |
$55,152,000 |
| 11936342 |
Output-integrated transistor amplifier device packages incorporating internal connections |
Jonathan Chang, Haedong Jang, Qianli Mu, Michael Lefevre, Jeremy Fisher +1 more |
2024-03-19 |
$53,452,000 |
| 11881464 |
Stacked RF circuit topology using transistor die with through silicon carbide vias on gate and/or drain |
Basim Noori, Kwangmo Chris Lim, Qianli Mu |
2024-01-23 |
$68,002,000 |
| 11863130 |
Group III nitride-based radio frequency transistor amplifiers having source, gate and/or drain conductive vias |
Basim Noori, Qianli Mu, Kwangmo Chris Lim, Michael E. Watts, Mario M. Bokatius +1 more |
2024-01-02 |
$40,258,000 |
| 11837457 |
Packaging for RF transistor amplifiers |
Basim Noori, Scott Sheppard, Kwangmo Chris Lim, Alexander Komposch, Qianli Mu |
2023-12-05 |
$18,968,000 |
| 11837559 |
Group III nitride-based radio frequency amplifiers having back side source, gate and/or drain terminals |
Michael E. Watts, Mario M. Bokatius, Jangheon Kim, Basim Noori, Qianli Mu +1 more |
2023-12-05 |
$18,968,000 |
| 11688673 |
Integrated passive device (IPD) components and a package and processes implementing the same |
Arthur Fong-Yuen Pun, Jeremy Fisher, Ulf Hakan Andre, Alexander Komposch |
2023-06-27 |
$101,074,000 |
| 11677362 |
Radio frequency transistor amplifiers having multi-layer encapsulations that include functional electrical circuits |
Kenneth P. Brewer, Basim Noori |
2023-06-13 |
$102,640,000 |
| 11670605 |
RF amplifier devices including interconnect structures and methods of manufacturing |
Basim Noori, Scott Sheppard, Kwangmo Chris Lim, Alexander Komposch, Qianli Mu |
2023-06-06 |
$99,581,000 |
| 11552597 |
Radio frequency amplifier implementing an input baseband enhancement circuit and a process of implementing the same |
Richard Wilson, Michael Lefevre |
2023-01-10 |
$141,637,000 |
| 11533024 |
Multi-zone radio frequency transistor amplifiers |
Kwangmo Chris Lim, Basim Noori, Qianli Mu, Scott Sheppard, Alexander Komposch |
2022-12-20 |
$68,804,000 |
| 11356070 |
RF amplifiers having shielded transmission line structures |
Kwangmo Chris Lim, Basim Noori, Qianli Mu, Scott Sheppard, Alexander Komposch |
2022-06-07 |
$41,992,000 |
| 11228287 |
Multi-stage decoupling networks integrated with on-package impedance matching networks for RF power amplifiers |
Madhu Chidurala, Niklas Thulin |
2022-01-18 |
$157,825,000 |
| 11201591 |
Asymmetric Doherty amplifier circuit with shunt reactances |
Haedong Jang, Sonoko Aristud, Madhu Chidurala |
2021-12-14 |
$170,140,000 |
| 11031913 |
Bias voltage connections in RF power amplifier packaging |
Madhu Chidurala, Simon Ward |
2021-06-08 |
$137,521,000 |
