Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394733 | Stacked RF circuit topology | Basim Noori, Marvin Marbell, Qianli Mu | 2025-08-19 |
| 12218071 | Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers | Srinivas V. Pietambaram, Sri Ranga Sai Boyapati, Robert Alan May, Kristof Darmawikarta, Javier Soto Gonzalez | 2025-02-04 |
| 12166003 | RF amplifier devices including top side contacts and methods of manufacturing | Basim Noori, Marvin Marbell, Scott Sheppard, Alexander Komposch, Qianli Mu | 2024-12-10 |
| 12113490 | Group III nitride-based radio frequency transistor amplifiers having source, gate and/or drain conductive vias | Basim Noori, Marvin Marbell, Qianli Mu, Michael E. Watts, Mario M. Bokatius +1 more | 2024-10-08 |
| 12034419 | RF amplifiers having shielded transmission line structures | Basim Noori, Qianli Mu, Marvin Marbell, Scott Sheppard, Alexander Komposch | 2024-07-09 |
| 11881464 | Stacked RF circuit topology using transistor die with through silicon carbide vias on gate and/or drain | Basim Noori, Marvin Marbell, Qianli Mu | 2024-01-23 |
| 11863130 | Group III nitride-based radio frequency transistor amplifiers having source, gate and/or drain conductive vias | Basim Noori, Marvin Marbell, Qianli Mu, Michael E. Watts, Mario M. Bokatius +1 more | 2024-01-02 |
| 11837457 | Packaging for RF transistor amplifiers | Basim Noori, Marvin Marbell, Scott Sheppard, Alexander Komposch, Qianli Mu | 2023-12-05 |
| 11837559 | Group III nitride-based radio frequency amplifiers having back side source, gate and/or drain terminals | Michael E. Watts, Mario M. Bokatius, Jangheon Kim, Basim Noori, Qianli Mu +1 more | 2023-12-05 |
| 11735531 | Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers | Srinivas V. Pietambaram, Sri Ranga Sai Boyapati, Robert Alan May, Kristof Darmawikarta, Javier Soto Gonzalez | 2023-08-22 |
| 11670605 | RF amplifier devices including interconnect structures and methods of manufacturing | Basim Noori, Marvin Marbell, Scott Sheppard, Alexander Komposch, Qianli Mu | 2023-06-06 |
| 11594512 | Method of manufacturing an electronic device and electronic device manufactured thereby | Hwan Kyu Kim, Dae Gon Kim, Tae Kyeong Hwang, Ji Young Chung | 2023-02-28 |
| 11532584 | Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling | Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Srinivas V. Pietambaram, Javier Soto Gonzalez +1 more | 2022-12-20 |
| 11533024 | Multi-zone radio frequency transistor amplifiers | Basim Noori, Qianli Mu, Marvin Marbell, Scott Sheppard, Alexander Komposch | 2022-12-20 |
| 11356070 | RF amplifiers having shielded transmission line structures | Basim Noori, Qianli Mu, Marvin Marbell, Scott Sheppard, Alexander Komposch | 2022-06-07 |
| 11101222 | Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers | Srinivas V. Pietambaram, Sri Ranga Sai Boyapati, Robert Alan May, Kristof Darmawikarta, Javier Soto Gonzalez | 2021-08-24 |
| 10943884 | Method of manufacturing an electronic device and electronic device manufactured thereby | Hwan Kyu Kim, Dae Gon Kim, Tae Kyeong Hwang, Ji Young Chung | 2021-03-09 |
| 10872872 | Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling | Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Srinivas V. Pietambaram, Javier Soto Gonzalez +1 more | 2020-12-22 |
| 10600755 | Method of manufacturing an electronic device and electronic device manufactured thereby | Hwan Kyu Kim, Dae Gon Kim, Tae Kyeong Hwang, Ji Young Chung | 2020-03-24 |