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Stacked RF circuit topology |
Basim Noori, Marvin Marbell, Qianli Mu |
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| 12218071 |
Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers |
Srinivas V. Pietambaram, Sri Ranga Sai Boyapati, Robert Alan May, Kristof Darmawikarta, Javier Soto Gonzalez |
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RF amplifier devices including top side contacts and methods of manufacturing |
Basim Noori, Marvin Marbell, Scott Sheppard, Alexander Komposch, Qianli Mu |
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| 12113490 |
Group III nitride-based radio frequency transistor amplifiers having source, gate and/or drain conductive vias |
Basim Noori, Marvin Marbell, Qianli Mu, Michael E. Watts, Mario M. Bokatius +1 more |
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| 12034419 |
RF amplifiers having shielded transmission line structures |
Basim Noori, Qianli Mu, Marvin Marbell, Scott Sheppard, Alexander Komposch |
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| 11881464 |
Stacked RF circuit topology using transistor die with through silicon carbide vias on gate and/or drain |
Basim Noori, Marvin Marbell, Qianli Mu |
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| 11863130 |
Group III nitride-based radio frequency transistor amplifiers having source, gate and/or drain conductive vias |
Basim Noori, Marvin Marbell, Qianli Mu, Michael E. Watts, Mario M. Bokatius +1 more |
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| 11837457 |
Packaging for RF transistor amplifiers |
Basim Noori, Marvin Marbell, Scott Sheppard, Alexander Komposch, Qianli Mu |
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| 11837559 |
Group III nitride-based radio frequency amplifiers having back side source, gate and/or drain terminals |
Michael E. Watts, Mario M. Bokatius, Jangheon Kim, Basim Noori, Qianli Mu +1 more |
2023-12-05 |
| 11735531 |
Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers |
Srinivas V. Pietambaram, Sri Ranga Sai Boyapati, Robert Alan May, Kristof Darmawikarta, Javier Soto Gonzalez |
2023-08-22 |
| 11670605 |
RF amplifier devices including interconnect structures and methods of manufacturing |
Basim Noori, Marvin Marbell, Scott Sheppard, Alexander Komposch, Qianli Mu |
2023-06-06 |
| 11594512 |
Method of manufacturing an electronic device and electronic device manufactured thereby |
Hwan Kyu Kim, Dae Gon Kim, Tae Kyeong Hwang, Ji Young Chung |
2023-02-28 |
| 11532584 |
Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling |
Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Srinivas V. Pietambaram, Javier Soto Gonzalez +1 more |
2022-12-20 |
| 11533024 |
Multi-zone radio frequency transistor amplifiers |
Basim Noori, Qianli Mu, Marvin Marbell, Scott Sheppard, Alexander Komposch |
2022-12-20 |
| 11356070 |
RF amplifiers having shielded transmission line structures |
Basim Noori, Qianli Mu, Marvin Marbell, Scott Sheppard, Alexander Komposch |
2022-06-07 |
| 11101222 |
Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers |
Srinivas V. Pietambaram, Sri Ranga Sai Boyapati, Robert Alan May, Kristof Darmawikarta, Javier Soto Gonzalez |
2021-08-24 |
| 10943884 |
Method of manufacturing an electronic device and electronic device manufactured thereby |
Hwan Kyu Kim, Dae Gon Kim, Tae Kyeong Hwang, Ji Young Chung |
2021-03-09 |
| 10872872 |
Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling |
Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Srinivas V. Pietambaram, Javier Soto Gonzalez +1 more |
2020-12-22 |
| 10600755 |
Method of manufacturing an electronic device and electronic device manufactured thereby |
Hwan Kyu Kim, Dae Gon Kim, Tae Kyeong Hwang, Ji Young Chung |
2020-03-24 |