Issued Patents All Time
Showing 1–25 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300613 | Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate | Robert Alan May, Kristof Darmawikarta | 2025-05-13 |
| 12253722 | Magneto-optical Kerr effect interconnects for photonic packaging | Hiroki Tanaka, Kristof Darmawikarta, Brandon C. Marin, Robert Alan May | 2025-03-18 |
| 12218069 | Multi-chip package with high density interconnects | Aleksandar Aleksov, Adel A. Elsherbini, Kristof Darmawikarta, Robert Alan May | 2025-02-04 |
| 12218071 | Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers | Srinivas V. Pietambaram, Robert Alan May, Kristof Darmawikarta, Javier Soto Gonzalez, Kwangmo Chris Lim | 2025-02-04 |
| 12176223 | Integrated circuit package supports | Kristof Darmawikarta, Robert Alan May, Srinivas V. Pietambaram, Chung Kwang Christopher Tan, Aleksandar Aleksov | 2024-12-24 |
| 12046560 | Microelectronic device with embedded die substrate on interposer | Robert Alan May, Islam A. Salama, Sheng Li, Kristof Darmawikarta, Robert L. Sankman +1 more | 2024-07-23 |
| 11935857 | Surface finishes with low RBTV for fine and mixed bump pitch architectures | Kristof Darmawaikarta, Robert Alan May, Sashi S. Kandanur, Srinivas V. Pietambaram, Steve Cho +7 more | 2024-03-19 |
| 11923307 | Microelectronic structures including bridges | Bai Nie, Gang Duan, Omkar G. Karhade, Nitin A. Deshpande, Yikang Deng +6 more | 2024-03-05 |
| 11908821 | Sacrificial dielectric for lithographic via formation to enable via scaling in high density interconnect packaging | Kristof Darmawikarta, Hiroki Tanaka, Robert Alan May | 2024-02-20 |
| 11908802 | Multi-chip package with high density interconnects | Aleksandar Aleksov, Adel A. Elsherbini, Kristof Darmawikarta, Robert Alan May | 2024-02-20 |
| 11901296 | Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate | Robert Alan May, Kristof Darmawikarta | 2024-02-13 |
| 11894311 | Microelectronic device with embedded die substrate on interposer | Robert Alan May, Islam A. Salama, Sheng Li, Kristof Darmawikarta, Robert L. Sankman +1 more | 2024-02-06 |
| 11894324 | In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same | Aleksandar Aleksov, Telesphor Kamgaing, Kristof Darmawikarta, Eyal Fayneh, Ofir Degani +2 more | 2024-02-06 |
| 11862619 | Patch accommodating embedded dies having different thicknesses | Srinivas V. Pietambaram, Robert Alan May, Kristof Darmawikarta, Hiroki Tanaka, Rahul N. Manepalli | 2024-01-02 |
| 11854834 | Integrated circuit package supports | Kristof Darmawikarta, Robert Alan May, Srinivas V. Pietambaram, Chung Kwang Christopher Tan, Aleksandar Aleksov | 2023-12-26 |
| 11837534 | Substrate with variable height conductive and dielectric elements | Aleksandar Aleksov, Kristof Darmawikarta, Haobo Chen, Changhua Liu, Bai Nie | 2023-12-05 |
| 11784128 | Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate | Robert Alan May, Kristof Darmawikarta | 2023-10-10 |
| 11764158 | Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same | Amruthavalli Pallavi Alur, Robert Alan May, Islam A. Salama, Robert L. Sankman | 2023-09-19 |
| 11735531 | Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers | Srinivas V. Pietambaram, Robert Alan May, Kristof Darmawikarta, Javier Soto Gonzalez, Kwangmo Chris Lim | 2023-08-22 |
| 11699648 | Electromigration resistant and profile consistent contact arrays | Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Steve Cho, Thomas HEATON +3 more | 2023-07-11 |
| 11574874 | Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch | Robert Alan May, Kristof Darmawikarta, Hiroki Tanaka, Srinivas V. Pietambaram, Frank Truong +4 more | 2023-02-07 |
| 11552010 | Dielectric for high density substrate interconnects | Robert Alan May, Andrew J. Brown, Kristof Darmawikarta | 2023-01-10 |
| 11532584 | Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling | Robert Alan May, Kristof Darmawikarta, Srinivas V. Pietambaram, Javier Soto Gonzalez, Kwangmo Chris Lim +1 more | 2022-12-20 |
| 11488918 | Surface finishes with low rBTV for fine and mixed bump pitch architectures | Kristof Darmawaikarta, Robert Alan May, Sashi S. Kandanur, Srinivas V. Pietambaram, Steve Cho +7 more | 2022-11-01 |
| 11443885 | Thin film barrier seed metallization in magnetic-plugged through hole inductor | Kristof Darmawikarta, Srinivas V. Pietambaram, Sandeep Gaan, Prithwish Chatterjee, Sameer Paital +2 more | 2022-09-13 |