Issued Patents All Time
Showing 26–50 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430740 | Microelectronic device with embedded die substrate on interposer | Robert Alan May, Islam A. Salama, Sheng Li, Kristof Darmawikarta, Robert L. Sankman +1 more | 2022-08-30 |
| 11393766 | Multi-chip package with high density interconnects | Aleksandar Aleksov, Adel A. Elsherbini, Kristof Darmawikarta, Robert Alan May | 2022-07-19 |
| 11309239 | Electromigration resistant and profile consistent contact arrays | Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Steve Cho, Thomas HEATON +3 more | 2022-04-19 |
| 11309192 | Integrated circuit package supports | Kristof Darmawikarta, Robert Alan May, Srinivas V. Pietambaram, Chung Kwang Christopher Tan, Aleksandar Aleksov | 2022-04-19 |
| 11272619 | Apparatus with embedded fine line space in a cavity, and a method for forming the same | Kristof Darmawikarta, Robert Alan May, Yikang Deng, Ji-Yong Park, Maroun D. Moussallem +2 more | 2022-03-08 |
| 11270959 | Enabling magnetic films in inductors integrated into semiconductor packages | Kirstof Darmawikarta, Srinivas V. Pietambaram, Prithwish Chatterjee, Wei-Lun Kane Jen | 2022-03-08 |
| 11264239 | Polarization defined zero misalignment vias for semiconductor packaging | Hiroki Tanaka, Aleksandar Aleksov, Robert Alan May, Kristof Darmawikarta | 2022-03-01 |
| 11264346 | Sacrificial dielectric for lithographic via formation to enable via scaling in high density interconnect packaging | Kristof Darmawikarta, Hiroki Tanaka, Robert Alan May | 2022-03-01 |
| 11264307 | Dual-damascene zero-misalignment-via process for semiconductor packaging | Aleksandar Aleksov, Hiroki Tanaka, Robert Alan May, Kristof Darmawikarta, Changhua Liu +2 more | 2022-03-01 |
| 11244912 | Semiconductor package having a coaxial first layer interconnect | Sai Vadlamani, Aleksandar Aleksov, Rahul Jain, Kyu Oh Lee, Kristof Darmawikarta +2 more | 2022-02-08 |
| 11211345 | In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same | Aleksandar Aleksov, Telesphor Kamgaing, Kristof Darmawikarta, Eyal Fayneh, Ofir Degani +2 more | 2021-12-28 |
| 11101222 | Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers | Srinivas V. Pietambaram, Robert Alan May, Kristof Darmawikarta, Javier Soto Gonzalez, Kwangmo Chris Lim | 2021-08-24 |
| 11075130 | Package substrate having polymer-derived ceramic core | Lisa Ying Ying Chen, Lauren A. Link, Robert Alan May, Amruthavalli Pallavi Alur, Kristof Darmawikarta +3 more | 2021-07-27 |
| 11069620 | Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate | Robert Alan May, Kristof Darmawikarta | 2021-07-20 |
| 11043457 | Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same | Amruthavalli Pallavi Alur, Robert Alan May, Islam A. Salama, Robert L. Sankman | 2021-06-22 |
| 11037802 | Package substrate having copper alloy sputter seed layer and high density interconnects | Robert Alan May, Kristof Darmawikarta, Sandeep Gaan, Srinivas V. Pietambaram | 2021-06-15 |
| 10978399 | Die interconnect substrate, an electrical device, and a method for forming a die interconnect substrate | Kristof Darmawikarta, Robert Alan May, Wei-Lun Kane Jen, Javier Soto Gonzalez | 2021-04-13 |
| 10872872 | Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling | Robert Alan May, Kristof Darmawikarta, Srinivas V. Pietambaram, Javier Soto Gonzalez, Kwangmo Chris Lim +1 more | 2020-12-22 |
| 10854541 | Electromigration resistant and profile consistent contact arrays | Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Steve Cho, Thomas HEATON +3 more | 2020-12-01 |
| 10856424 | Electronic assembly that includes void free holes | Amanda E. Schuckman, Sashi S. Kandanur, Srinivas V. Pietambaram, Mark S. Hlad, Kristof Darmawikarta | 2020-12-01 |
| 10790233 | Package substrates with integral devices | Robert Alan May, Kristof Darmawikarta | 2020-09-29 |
| 10741534 | Multi-die microelectronic device with integral heat spreader | Aleksandar Aleksov, Kristof Darmawikarta, Rahul N. Manepalli, Robert Alan May, Srinivas V. Pietambaram | 2020-08-11 |
| 10727185 | Multi-chip package with high density interconnects | Aleksandar Aleksov, Adel A. Elsherbini, Kristof Darmawikarta, Robert Alan May | 2020-07-28 |
| 10705293 | Substrate integrated waveguide | Robert Alan May, Kristof Darmawikarta, Rahul Jain, Maroun D. Moussallem, Rahul N. Manepalli +1 more | 2020-07-07 |
| 10707168 | Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same | Amruthavalli Pallavi Alur, Robert Alan May, Islam A. Salama, Robert L. Sankman | 2020-07-07 |