Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12336197 | In-plane inductors in IC packages | Brandon C. Marin, Tarek A. Ibrahim, Haifa Hariri, Yikang Deng, Sheng Li +1 more | 2025-06-17 |
| 12272484 | Coreless electronic substrates having embedded inductors | Srinivas V. Pietambaram, Pooya Tadayon, Kristof Darmawikarta, Tarek A. Ibrahim | 2025-04-08 |
| 11881463 | Coreless organic packages with embedded die and magnetic inductor structures | Andrew J. Brown, Rahul Jain, Lauren A. Link, Sai Vadlamani | 2024-01-23 |
| 11862552 | Methods of embedding magnetic structures in substrates | Sai Vadlamani, Robert Alan May, Rahul Jain, Lauren A. Link, Andrew J. Brown +2 more | 2024-01-02 |
| 11804455 | Substrate integrated thin film capacitors using amorphous high-k dielectrics | Aleksandar Aleksov, Thomas L. Sounart, Kristof Darmawikarta, Henning Braunisch, Andrew J. Brown | 2023-10-31 |
| 11651902 | Patterning of thin film capacitors in organic substrate packages | Rahul Jain, Andrew J. Brown, Sai Vadlamani, Lauren A. Link | 2023-05-16 |
| 11610706 | Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates | Sai Vadlamani, Rahul Jain, Kyu Oh Lee, Sheng Li, Andrew J. Brown +1 more | 2023-03-21 |
| 11574874 | Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch | Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Hiroki Tanaka, Srinivas V. Pietambaram +4 more | 2023-02-07 |
| 11552008 | Asymmetric cored integrated circuit package supports | Lauren A. Link, Andrew J. Brown, Sai Vadlamani, Ying Wang, Chong Zhang | 2023-01-10 |
| 11495552 | Substrate integrated thin film capacitors using amorphous high-k dielectrics | Aleksandar Aleksov, Thomas L. Sounart, Kristof Darmawikarta, Henning Braunisch, Andrew J. Brown | 2022-11-08 |
| 11443885 | Thin film barrier seed metallization in magnetic-plugged through hole inductor | Kristof Darmawikarta, Srinivas V. Pietambaram, Sandeep Gaan, Sri Ranga Sai Boyapati, Sameer Paital +2 more | 2022-09-13 |
| 11432405 | Methods for attaching large components in a package substrate for advanced power delivery | Rahul Jain, Kyu Oh Lee | 2022-08-30 |
| 11335632 | Magnetic inductor structures for package devices | Junnan Zhao, Sai Vadlamani, Ying Wang, Rahul Jain, Andrew J. Brown +3 more | 2022-05-17 |
| 11289263 | Electronic substrates having embedded magnetic material using photo-imagable dielectric layers | Sai Vadlamani, Lauren A. Link, Andrew J. Brown | 2022-03-29 |
| 11270959 | Enabling magnetic films in inductors integrated into semiconductor packages | Kirstof Darmawikarta, Srinivas V. Pietambaram, Sri Ranga Sai Boyapati, Wei-Lun Kane Jen | 2022-03-08 |
| 11251113 | Methods of embedding magnetic structures in substrates | Sai Vadlamani, Robert Alan May, Rahul Jain, Lauren A. Link, Andrew J. Brown +2 more | 2022-02-15 |
| 11205626 | Coreless organic packages with embedded die and magnetic inductor structures | Andrew J. Brown, Rahul Jain, Lauren A. Link, Sai Vadlamani | 2021-12-21 |
| 11189409 | Electronic substrates having embedded dielectric magnetic material to form inductors | Andrew J. Brown, Lauren A. Link, Sai Vadlamani | 2021-11-30 |
| 10700021 | Coreless organic packages with embedded die and magnetic inductor structures | Andrew J. Brown, Rahul Jain, Lauren A. Link, Sai Vadlamani | 2020-06-30 |