| 12494443 |
Substrate integrated thin film capacitors using amorphous high-k dielectrics |
Aleksandar Aleksov, Thomas L. Sounart, Kristof Darmawikarta, Henning Braunisch, Andrew J. Brown |
2025-12-09 |
|
| 12336197 |
In-plane inductors in IC packages |
Brandon C. Marin, Tarek A. Ibrahim, Haifa Hariri, Yikang Deng, Sheng Li +1 more |
2025-06-17 |
|
| 12272484 |
Coreless electronic substrates having embedded inductors |
Srinivas V. Pietambaram, Pooya Tadayon, Kristof Darmawikarta, Tarek A. Ibrahim |
2025-04-08 |
|
| 11881463 |
Coreless organic packages with embedded die and magnetic inductor structures |
Andrew J. Brown, Rahul Jain, Lauren A. Link, Sai Vadlamani |
2024-01-23 |
$52,361,000 |
| 11862552 |
Methods of embedding magnetic structures in substrates |
Sai Vadlamani, Robert Alan May, Rahul Jain, Lauren A. Link, Andrew J. Brown +2 more |
2024-01-02 |
$30,016,000 |
| 11804455 |
Substrate integrated thin film capacitors using amorphous high-k dielectrics |
Aleksandar Aleksov, Thomas L. Sounart, Kristof Darmawikarta, Henning Braunisch, Andrew J. Brown |
2023-10-31 |
$30,374,000 |
| 11651902 |
Patterning of thin film capacitors in organic substrate packages |
Rahul Jain, Andrew J. Brown, Sai Vadlamani, Lauren A. Link |
2023-05-16 |
$11,130,000 |
| 11610706 |
Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates |
Sai Vadlamani, Rahul Jain, Kyu Oh Lee, Sheng Li, Andrew J. Brown +1 more |
2023-03-21 |
$20,076,000 |
| 11574874 |
Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch |
Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Hiroki Tanaka, Srinivas V. Pietambaram +4 more |
2023-02-07 |
$11,877,000 |
| 11552008 |
Asymmetric cored integrated circuit package supports |
Lauren A. Link, Andrew J. Brown, Sai Vadlamani, Ying Wang, Chong Zhang |
2023-01-10 |
$14,061,000 |
| 11495552 |
Substrate integrated thin film capacitors using amorphous high-k dielectrics |
Aleksandar Aleksov, Thomas L. Sounart, Kristof Darmawikarta, Henning Braunisch, Andrew J. Brown |
2022-11-08 |
$15,080,000 |
| 11443885 |
Thin film barrier seed metallization in magnetic-plugged through hole inductor |
Kristof Darmawikarta, Srinivas V. Pietambaram, Sandeep Gaan, Sri Ranga Sai Boyapati, Sameer Paital +2 more |
2022-09-13 |
$14,653,000 |
| 11432405 |
Methods for attaching large components in a package substrate for advanced power delivery |
Rahul Jain, Kyu Oh Lee |
2022-08-30 |
$13,077,000 |
| 11335632 |
Magnetic inductor structures for package devices |
Junnan Zhao, Sai Vadlamani, Ying Wang, Rahul Jain, Andrew J. Brown +3 more |
2022-05-17 |
$14,251,000 |
| 11289263 |
Electronic substrates having embedded magnetic material using photo-imagable dielectric layers |
Sai Vadlamani, Lauren A. Link, Andrew J. Brown |
2022-03-29 |
$28,068,000 |
| 11270959 |
Enabling magnetic films in inductors integrated into semiconductor packages |
Kirstof Darmawikarta, Srinivas V. Pietambaram, Sri Ranga Sai Boyapati, Wei-Lun Kane Jen |
2022-03-08 |
$16,017,000 |
| 11251113 |
Methods of embedding magnetic structures in substrates |
Sai Vadlamani, Robert Alan May, Rahul Jain, Lauren A. Link, Andrew J. Brown +2 more |
2022-02-15 |
$14,138,000 |
| 11205626 |
Coreless organic packages with embedded die and magnetic inductor structures |
Andrew J. Brown, Rahul Jain, Lauren A. Link, Sai Vadlamani |
2021-12-21 |
$33,282,000 |
| 11189409 |
Electronic substrates having embedded dielectric magnetic material to form inductors |
Andrew J. Brown, Lauren A. Link, Sai Vadlamani |
2021-11-30 |
$30,212,000 |
| 10700021 |
Coreless organic packages with embedded die and magnetic inductor structures |
Andrew J. Brown, Rahul Jain, Lauren A. Link, Sai Vadlamani |
2020-06-30 |
$33,333,000 |
