| 12154715 |
Methods to selectively embed magnetic materials in substrate and corresponding structures |
Cheng Xu, Kyu Oh Lee, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more |
2024-11-26 |
$26,820,000 |
| 12087746 |
Microelectronic assemblies having an integrated capacitor |
Chong Zhang, Cheng Xu, Ying Wang, Meizi Jiao |
2024-09-10 |
$16,964,000 |
| 11901115 |
Substrate assembly with encapsulated magnetic feature |
Kyu Oh Lee, Rahul Jain, Sai Vadlamani, Cheng Xu, Ji-Yong Park +1 more |
2024-02-13 |
$18,546,000 |
| 11894282 |
Vented lids for integrated circuit packages |
Zhimin Wan, Sergio Antonio Chan Arguedas, Peng Li, Chandra Mohan Jha, Aravindha R. Antoniswamy +2 more |
2024-02-06 |
$35,892,000 |
| 11830809 |
Magnetic structures in integrated circuit package supports |
Ying Wang, Yikang Deng, Andrew J. Brown, Cheng Xu, Kaladhar Radhakrishnan |
2023-11-28 |
$31,872,000 |
| 11735537 |
Methods to embed magnetic material as first layer on coreless substrates and corresponding structures |
Cheng Xu, Kyu Oh Lee, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more |
2023-08-22 |
$16,803,000 |
| 11721677 |
Microelectronic assemblies having an integrated capacitor |
Chong Zhang, Cheng Xu, Ying Wang, Meizi Jiao |
2023-08-08 |
$22,376,000 |
| 11696407 |
Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate |
Chong Zhang, Ying Wang, Cheng Xu, Yikang Deng |
2023-07-04 |
|
| 11651885 |
Magnetic core inductors |
Ying Wang, Cheng Xu, Kyu Oh Lee, Sheng Li, Yikang Deng |
2023-05-16 |
$11,130,000 |
| 11646254 |
Electronic device including a lateral trace |
Yikang Deng, Ying Wang, Cheng Xu, Chong Zhang |
2023-05-09 |
|
| 11557579 |
Microelectronic assemblies having an integrated capacitor |
Chong Zhang, Cheng Xu, Ying Wang, Meizi Jiao |
2023-01-17 |
$13,997,000 |
| 11557489 |
Cavity structures in integrated circuit package supports |
Rahul Jain, Sai Vadlamani, Ji-Yong Park, Kyu Oh Lee, Cheng Xu |
2023-01-17 |
$13,997,000 |
| 11521914 |
Microelectronic assemblies having a cooling channel |
Zhimin Wan, Cheng Xu, Yikang Deng, Ying Wang, Chong Zhang +3 more |
2022-12-06 |
$14,727,000 |
| 11502017 |
Effective heat conduction from hotspot to heat spreader through package substrate |
Cheng Xu, Zhimin Wan, Lingtao Liu, Yikang Deng, Chandra Mohan Jha +1 more |
2022-11-15 |
$16,955,000 |
| 11495555 |
Magnetic bilayer structure for a cored or coreless semiconductor package |
Yikang Deng, Jonathan L. Rosch, Andrew J. Brown |
2022-11-08 |
$15,080,000 |
| 11482471 |
Thermal management solutions for integrated circuit packages |
Cheng Xu, Zhimin Wan, Ying Wang, Yikang Deng, Chong Zhang +3 more |
2022-10-25 |
$11,792,000 |
| 11450471 |
Methods to selectively embed magnetic materials in substrate and corresponding structures |
Cheng Xu, Kyu Oh Lee, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more |
2022-09-20 |
$15,654,000 |
| 11443885 |
Thin film barrier seed metallization in magnetic-plugged through hole inductor |
Kristof Darmawikarta, Srinivas V. Pietambaram, Sandeep Gaan, Sri Ranga Sai Boyapati, Prithwish Chatterjee +2 more |
2022-09-13 |
$14,653,000 |
| 11443892 |
Substrate assembly with encapsulated magnetic feature |
Kyu Oh Lee, Rahul Jain, Sai Vadlamani, Cheng Xu, Ji-Yong Park +1 more |
2022-09-13 |
$14,653,000 |
| 11417614 |
Methods to embed magnetic material as first layer on coreless substrates and corresponding structures |
Cheng Xu, Kyu Oh Lee, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more |
2022-08-16 |
$17,788,000 |
| 11387224 |
Phase change material in substrate cavity |
Cheng Xu, Zhimin Wan, Yikang Deng, Chong Zhang, Chandra Mohan Jha +2 more |
2022-07-12 |
$13,106,000 |
| 11355459 |
Embedding magnetic material, in a cored or coreless semiconductor package |
Kyu Oh Lee, Sai Vadlamani, Rahul Jain, Ji-Yong Park, Cheng Xu +1 more |
2022-06-07 |
$12,864,000 |
| 11335632 |
Magnetic inductor structures for package devices |
Prithwish Chatterjee, Sai Vadlamani, Ying Wang, Rahul Jain, Andrew J. Brown +3 more |
2022-05-17 |
$14,251,000 |
| 11322290 |
Techniques for an inductor at a first level interface |
Cheng Xu, Yikang Deng, Kyu Oh Lee, Ji-Yong Park, Srinivas V. Pietambaram +3 more |
2022-05-03 |
$16,346,000 |
| 11276634 |
High density package substrate formed with dielectric bi-layer |
Srinivas V. Pietambaram, Rahul N. Manepalli, David Unruh, Frank Truong, Kyu Oh Lee +1 more |
2022-03-15 |
$18,336,000 |
