| 12481108 |
Faraday rotator interconnect as a through-via configuration in a patch architecture |
Brandon C. Marin, Divya Pratap, Hisato Tanaka, Nitin A. Deshpande, Omkar G. Karhade +5 more |
2025-11-25 |
|
| 12327797 |
Microelectronic structures including glass cores |
Srinivas V. Pietambaram, Tarek A. Ibrahim, Gang Duan, Bharat P. Penmecha |
2025-06-10 |
|
| 12327814 |
Electronic substrate core having an embedded laser stop to control depth of an ultra-deep cavity |
Brandon C. Marin, Omkar G. Karhade, Tolga Acikalin |
2025-06-10 |
|
| 12327773 |
Package with underfill containment barrier |
Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more |
2025-06-10 |
|
| 12154715 |
Methods to selectively embed magnetic materials in substrate and corresponding structures |
Cheng Xu, Kyu Oh Lee, Junnan Zhao, Rahul Jain, Ji-Yong Park +1 more |
2024-11-26 |
$26,820,000 |
| 12057252 |
Electronic substrates having embedded inductors |
Benjamin Duong, Michael Garelick, Darko Grujicic, Tarek A. Ibrahim, Brandon C. Marin +1 more |
2024-08-06 |
$17,070,000 |
| 11935805 |
Package with underfill containment barrier |
Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more |
2024-03-19 |
$28,784,000 |
| 11901115 |
Substrate assembly with encapsulated magnetic feature |
Kyu Oh Lee, Rahul Jain, Cheng Xu, Ji-Yong Park, Junnan Zhao +1 more |
2024-02-13 |
$18,546,000 |
| 11881463 |
Coreless organic packages with embedded die and magnetic inductor structures |
Andrew J. Brown, Rahul Jain, Prithwish Chatterjee, Lauren A. Link |
2024-01-23 |
$52,361,000 |
| 11862552 |
Methods of embedding magnetic structures in substrates |
Prithwish Chatterjee, Robert Alan May, Rahul Jain, Lauren A. Link, Andrew J. Brown +2 more |
2024-01-02 |
$30,016,000 |
| 11735537 |
Methods to embed magnetic material as first layer on coreless substrates and corresponding structures |
Cheng Xu, Kyu Oh Lee, Junnan Zhao, Rahul Jain, Ji-Yong Park +1 more |
2023-08-22 |
$16,803,000 |
| 11664290 |
Package with underfill containment barrier |
Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more |
2023-05-30 |
$16,378,000 |
| 11651902 |
Patterning of thin film capacitors in organic substrate packages |
Rahul Jain, Andrew J. Brown, Prithwish Chatterjee, Lauren A. Link |
2023-05-16 |
$11,130,000 |
| 11610706 |
Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates |
Prithwish Chatterjee, Rahul Jain, Kyu Oh Lee, Sheng Li, Andrew J. Brown +1 more |
2023-03-21 |
$20,076,000 |
| 11557489 |
Cavity structures in integrated circuit package supports |
Rahul Jain, Junnan Zhao, Ji-Yong Park, Kyu Oh Lee, Cheng Xu |
2023-01-17 |
$13,997,000 |
| 11552008 |
Asymmetric cored integrated circuit package supports |
Lauren A. Link, Andrew J. Brown, Prithwish Chatterjee, Ying Wang, Chong Zhang |
2023-01-10 |
$14,061,000 |
| 11450471 |
Methods to selectively embed magnetic materials in substrate and corresponding structures |
Cheng Xu, Kyu Oh Lee, Junnan Zhao, Rahul Jain, Ji-Yong Park +1 more |
2022-09-20 |
$15,654,000 |
| 11443892 |
Substrate assembly with encapsulated magnetic feature |
Kyu Oh Lee, Rahul Jain, Cheng Xu, Ji-Yong Park, Junnan Zhao +1 more |
2022-09-13 |
$14,653,000 |
| 11417614 |
Methods to embed magnetic material as first layer on coreless substrates and corresponding structures |
Cheng Xu, Kyu Oh Lee, Junnan Zhao, Rahul Jain, Ji-Yong Park +1 more |
2022-08-16 |
$17,788,000 |
| 11355459 |
Embedding magnetic material, in a cored or coreless semiconductor package |
Kyu Oh Lee, Rahul Jain, Junnan Zhao, Ji-Yong Park, Cheng Xu +1 more |
2022-06-07 |
$12,864,000 |
| 11335632 |
Magnetic inductor structures for package devices |
Prithwish Chatterjee, Junnan Zhao, Ying Wang, Rahul Jain, Andrew J. Brown +3 more |
2022-05-17 |
$14,251,000 |
| 11289263 |
Electronic substrates having embedded magnetic material using photo-imagable dielectric layers |
Prithwish Chatterjee, Lauren A. Link, Andrew J. Brown |
2022-03-29 |
$28,068,000 |
| 11251113 |
Methods of embedding magnetic structures in substrates |
Prithwish Chatterjee, Robert Alan May, Rahul Jain, Lauren A. Link, Andrew J. Brown +2 more |
2022-02-15 |
$14,138,000 |
| 11244912 |
Semiconductor package having a coaxial first layer interconnect |
Aleksandar Aleksov, Rahul Jain, Kyu Oh Lee, Kristof Darmawikarta, Robert Alan May +2 more |
2022-02-08 |
$27,206,000 |
| 11205626 |
Coreless organic packages with embedded die and magnetic inductor structures |
Andrew J. Brown, Rahul Jain, Prithwish Chatterjee, Lauren A. Link |
2021-12-21 |
$33,282,000 |
