Issued Patents All Time
Showing 25 most recent of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12327773 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more | 2025-06-10 |
| 12327797 | Microelectronic structures including glass cores | Srinivas V. Pietambaram, Tarek A. Ibrahim, Gang Duan, Bharat P. Penmecha | 2025-06-10 |
| 12327814 | Electronic substrate core having an embedded laser stop to control depth of an ultra-deep cavity | Brandon C. Marin, Omkar G. Karhade, Tolga Acikalin | 2025-06-10 |
| 12154715 | Methods to selectively embed magnetic materials in substrate and corresponding structures | Cheng Xu, Kyu Oh Lee, Junnan Zhao, Rahul Jain, Ji-Yong Park +1 more | 2024-11-26 |
| 12057252 | Electronic substrates having embedded inductors | Benjamin Duong, Michael Garelick, Darko Grujicic, Tarek A. Ibrahim, Brandon C. Marin +1 more | 2024-08-06 |
| 11935805 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more | 2024-03-19 |
| 11901115 | Substrate assembly with encapsulated magnetic feature | Kyu Oh Lee, Rahul Jain, Cheng Xu, Ji-Yong Park, Junnan Zhao +1 more | 2024-02-13 |
| 11881463 | Coreless organic packages with embedded die and magnetic inductor structures | Andrew J. Brown, Rahul Jain, Prithwish Chatterjee, Lauren A. Link | 2024-01-23 |
| 11862552 | Methods of embedding magnetic structures in substrates | Prithwish Chatterjee, Robert Alan May, Rahul Jain, Lauren A. Link, Andrew J. Brown +2 more | 2024-01-02 |
| 11735537 | Methods to embed magnetic material as first layer on coreless substrates and corresponding structures | Cheng Xu, Kyu Oh Lee, Junnan Zhao, Rahul Jain, Ji-Yong Park +1 more | 2023-08-22 |
| 11664290 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more | 2023-05-30 |
| 11651902 | Patterning of thin film capacitors in organic substrate packages | Rahul Jain, Andrew J. Brown, Prithwish Chatterjee, Lauren A. Link | 2023-05-16 |
| 11610706 | Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates | Prithwish Chatterjee, Rahul Jain, Kyu Oh Lee, Sheng Li, Andrew J. Brown +1 more | 2023-03-21 |
| 11557489 | Cavity structures in integrated circuit package supports | Rahul Jain, Junnan Zhao, Ji-Yong Park, Kyu Oh Lee, Cheng Xu | 2023-01-17 |
| 11552008 | Asymmetric cored integrated circuit package supports | Lauren A. Link, Andrew J. Brown, Prithwish Chatterjee, Ying Wang, Chong Zhang | 2023-01-10 |
| 11450471 | Methods to selectively embed magnetic materials in substrate and corresponding structures | Cheng Xu, Kyu Oh Lee, Junnan Zhao, Rahul Jain, Ji-Yong Park +1 more | 2022-09-20 |
| 11443892 | Substrate assembly with encapsulated magnetic feature | Kyu Oh Lee, Rahul Jain, Cheng Xu, Ji-Yong Park, Junnan Zhao +1 more | 2022-09-13 |
| 11417614 | Methods to embed magnetic material as first layer on coreless substrates and corresponding structures | Cheng Xu, Kyu Oh Lee, Junnan Zhao, Rahul Jain, Ji-Yong Park +1 more | 2022-08-16 |
| 11355459 | Embedding magnetic material, in a cored or coreless semiconductor package | Kyu Oh Lee, Rahul Jain, Junnan Zhao, Ji-Yong Park, Cheng Xu +1 more | 2022-06-07 |
| 11335632 | Magnetic inductor structures for package devices | Prithwish Chatterjee, Junnan Zhao, Ying Wang, Rahul Jain, Andrew J. Brown +3 more | 2022-05-17 |
| 11289263 | Electronic substrates having embedded magnetic material using photo-imagable dielectric layers | Prithwish Chatterjee, Lauren A. Link, Andrew J. Brown | 2022-03-29 |
| 11251113 | Methods of embedding magnetic structures in substrates | Prithwish Chatterjee, Robert Alan May, Rahul Jain, Lauren A. Link, Andrew J. Brown +2 more | 2022-02-15 |
| 11244912 | Semiconductor package having a coaxial first layer interconnect | Aleksandar Aleksov, Rahul Jain, Kyu Oh Lee, Kristof Darmawikarta, Robert Alan May +2 more | 2022-02-08 |
| 11205626 | Coreless organic packages with embedded die and magnetic inductor structures | Andrew J. Brown, Rahul Jain, Prithwish Chatterjee, Lauren A. Link | 2021-12-21 |
| 11189409 | Electronic substrates having embedded dielectric magnetic material to form inductors | Andrew J. Brown, Prithwish Chatterjee, Lauren A. Link | 2021-11-30 |