| 12334447 |
Lithographically defined vertical interconnect access (VIA) for a bridge die first level interconnect (FLI) |
Kristof Darmawikarta, Tarek A. Ibrahim, Rahul Jain, Haobo Chen |
2025-06-17 |
|
| 12327773 |
Package with underfill containment barrier |
Rahul Jain, Kyu Oh Lee, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more |
2025-06-10 |
|
| 12224253 |
Magnetic inductor device and method |
Xin Ning, Brandon C. Marin, Kyu Oh Lee, Numair Ahmed, Brent Williams +3 more |
2025-02-11 |
|
| 12062551 |
High density organic interconnect structures |
Sri Chaitra Jyotsna Chavali, Lilia May, Amanda E. Schuckman |
2024-08-13 |
$26,861,000 |
| 11935805 |
Package with underfill containment barrier |
Rahul Jain, Kyu Oh Lee, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more |
2024-03-19 |
$28,784,000 |
| 11664290 |
Package with underfill containment barrier |
Rahul Jain, Kyu Oh Lee, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more |
2023-05-30 |
$16,378,000 |
| 11631595 |
High density organic interconnect structures |
Sri Chaitra Jyotsna Chavali, Lilia May, Amanda E. Schuckman |
2023-04-18 |
$32,873,000 |
| 11508636 |
Multi-layer solution based deposition of dielectrics for advanced substrate architectures |
Andrew J. Brown, Ji-Yong Park, Cheng Xu, Amruthavalli Pallavi Alur |
2022-11-22 |
$12,862,000 |
| 11393762 |
Formation of tall metal pillars using multiple photoresist layers |
Sri Chaitra Jyotsna Chavali, Liwei Cheng, Sheng Li |
2022-07-19 |
$11,394,000 |
| 11196165 |
Low z-height, ultra-low dielectric constant air cavity based and multi-core/highly asymmetric antenna substrate architectures for electrical performance improvements in 5G mm-wave applications |
Sri Chaitra Jyotsna Chavali, Sheng Li |
2021-12-07 |
$28,128,000 |
| 11195727 |
High density organic interconnect structures |
Sri Chaitra Jyotsna Chavali, Lilia May, Amanda E. Schuckman |
2021-12-07 |
$28,128,000 |
| 11158558 |
Package with underfill containment barrier |
Rahul Jain, Kyu Oh Lee, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more |
2021-10-26 |
$21,268,000 |
| 11075130 |
Package substrate having polymer-derived ceramic core |
Lisa Ying Ying Chen, Lauren A. Link, Robert Alan May, Amruthavalli Pallavi Alur, Kristof Darmawikarta +3 more |
2021-07-27 |
$27,337,000 |
| 10903137 |
Electrical interconnections with improved compliance due to stress relaxation and method of making |
Sri Chaitra Jyotsna Chavali |
2021-01-26 |
$50,999,000 |
| 10741947 |
Plated through hole socketing coupled to a solder ball to engage with a pin |
Amruthavalli Pallavi Alur, Liwei Cheng, Lauren A. Link, Jonathan L. Rosch, Sai Vadlamani +1 more |
2020-08-11 |
$37,011,000 |
| 10727184 |
Microelectronic device including non-homogeneous build-up dielectric |
Srinivas V. Pietambaram |
2020-07-28 |
$26,273,000 |
| 10685850 |
High density organic interconnect structures |
Sri Chaitra Jyotsna Chavali, Lilia May, Amanda E. Schuckman |
2020-06-16 |
$36,850,000 |
| 10553453 |
Systems and methods for semiconductor packages using photoimageable layers |
Sri Chaitra Jyotsna Chavali, Amanda E. Schuckman, Amruthavalli P. Alur, Islam A. Salama, Yikang Deng +1 more |
2020-02-04 |
$21,361,000 |
| 10424530 |
Electrical interconnections with improved compliance due to stress relaxation and method of making |
Sri Chaitra Jyotsna Chavali |
2019-09-24 |
$28,939,000 |
| 10384431 |
Methods for forming a substrate structure for an electrical component and an apparatus for applying pressure to an electrically insulating laminate located on a core substrate |
Ji-Yong Park, Sri Chaitra Jyotsna Chavali, Kyu Oh Lee |
2019-08-20 |
$17,708,000 |
| 10020262 |
High resolution solder resist material for silicon bridge application |
Sheng Li, Wei-Lun Kane Jen |
2018-07-10 |
$30,438,000 |
| 9728500 |
Integrated circuit surface layer with adhesion-functional group |
Sri Chaitra Jyotsna Chavali, Robert Alan May, Whitney Bryks |
2017-08-08 |
$11,912,000 |
