Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334447 | Lithographically defined vertical interconnect access (VIA) for a bridge die first level interconnect (FLI) | Kristof Darmawikarta, Tarek A. Ibrahim, Rahul Jain, Haobo Chen | 2025-06-17 |
| 12327773 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more | 2025-06-10 |
| 12224253 | Magnetic inductor device and method | Xin Ning, Brandon C. Marin, Kyu Oh Lee, Numair Ahmed, Brent Williams +3 more | 2025-02-11 |
| 12062551 | High density organic interconnect structures | Sri Chaitra Jyotsna Chavali, Lilia May, Amanda E. Schuckman | 2024-08-13 |
| 11935805 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more | 2024-03-19 |
| 11664290 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more | 2023-05-30 |
| 11631595 | High density organic interconnect structures | Sri Chaitra Jyotsna Chavali, Lilia May, Amanda E. Schuckman | 2023-04-18 |
| 11508636 | Multi-layer solution based deposition of dielectrics for advanced substrate architectures | Andrew J. Brown, Ji-Yong Park, Cheng Xu, Amruthavalli Pallavi Alur | 2022-11-22 |
| 11393762 | Formation of tall metal pillars using multiple photoresist layers | Sri Chaitra Jyotsna Chavali, Liwei Cheng, Sheng Li | 2022-07-19 |
| 11195727 | High density organic interconnect structures | Sri Chaitra Jyotsna Chavali, Lilia May, Amanda E. Schuckman | 2021-12-07 |
| 11196165 | Low z-height, ultra-low dielectric constant air cavity based and multi-core/highly asymmetric antenna substrate architectures for electrical performance improvements in 5G mm-wave applications | Sri Chaitra Jyotsna Chavali, Sheng Li | 2021-12-07 |
| 11158558 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more | 2021-10-26 |
| 11075130 | Package substrate having polymer-derived ceramic core | Lisa Ying Ying Chen, Lauren A. Link, Robert Alan May, Amruthavalli Pallavi Alur, Kristof Darmawikarta +3 more | 2021-07-27 |
| 10903137 | Electrical interconnections with improved compliance due to stress relaxation and method of making | Sri Chaitra Jyotsna Chavali | 2021-01-26 |
| 10741947 | Plated through hole socketing coupled to a solder ball to engage with a pin | Amruthavalli Pallavi Alur, Liwei Cheng, Lauren A. Link, Jonathan L. Rosch, Sai Vadlamani +1 more | 2020-08-11 |
| 10727184 | Microelectronic device including non-homogeneous build-up dielectric | Srinivas V. Pietambaram | 2020-07-28 |
| 10685850 | High density organic interconnect structures | Sri Chaitra Jyotsna Chavali, Lilia May, Amanda E. Schuckman | 2020-06-16 |
| 10553453 | Systems and methods for semiconductor packages using photoimageable layers | Sri Chaitra Jyotsna Chavali, Amanda E. Schuckman, Amruthavalli P. Alur, Islam A. Salama, Yikang Deng +1 more | 2020-02-04 |
| 10424530 | Electrical interconnections with improved compliance due to stress relaxation and method of making | Sri Chaitra Jyotsna Chavali | 2019-09-24 |
| 10384431 | Methods for forming a substrate structure for an electrical component and an apparatus for applying pressure to an electrically insulating laminate located on a core substrate | Ji-Yong Park, Sri Chaitra Jyotsna Chavali, Kyu Oh Lee | 2019-08-20 |
| 10020262 | High resolution solder resist material for silicon bridge application | Sheng Li, Wei-Lun Kane Jen | 2018-07-10 |
| 9728500 | Integrated circuit surface layer with adhesion-functional group | Sri Chaitra Jyotsna Chavali, Robert Alan May, Whitney Bryks | 2017-08-08 |