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USPTO Patent Rankings Data through Dec 31, 2025
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Whitney Bryks — 12 Patents

Intel: 12 patents #3,451 of 30,777Top 15%
Tempe, AZ: #234 of 2,648 inventorsTop 9%
Arizona: #3,054 of 32,909 inventorsTop 10%
Overall (All Time): #396,045 of 4,157,543Top 10%
12 Patents All Time
Whitney Bryks has been granted 12 US patents while listed as an inventor at Intel. The first was granted in 2017 and the most recent in October 2025. Whitney Bryks ranks #396,045 of 4,157,543 US inventors in our database (top 9.5%). Patent records list Whitney Bryks in Tempe, AZ, US.

Patents per Year

Patents granted per year, 2017 to 2025Bar chart with a peak of 6 patents in 2025.peak 62017: 2 patents20172020: 1 patents20202022: 2 patents20222023: 1 patents20232025: 6 patents2025

Issued Patents All Time

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12449600 Position controlled waveguides and methods of manufacturing the same Jeremy Ecton, Leonel Arana, Haobo Chen, Benjamin Duong, Changhua Liu +2 more 2025-10-21
12442979 Optical waveguide formed within in a glass layer Bainye Francoise ANGOUA, Ala Omer, Sarah Blythe, Junxin Wang, Dilan Seneviratne +1 more 2025-10-14
12439826 Integrated MEMS resonator and method Mohamed A. Abdelmoneum, Eduardo Alban, Brent Carlton, Tarek A. Ibrahim, Nasser A. Kurd +3 more 2025-10-07
12374482 Carrier chuck comprising a plurality of magnets and methods of forming and using thereof Yosef KORNBLUTH, Ravindranadh Eluri, Aaditya Anand CANDADAI, Srinivas V. Pietambaram 2025-07-29
12266581 Electronic substrates having heterogeneous dielectric layers Joshua Stacey, Sarah Blythe, Peumie Abeyratne Kuragama, Junxin Wang 2025-04-01
12214579 Dry film lamination with dynamic feedback control Joshua Stacey, Yosef KORNBLUTH 2025-02-04
11804420 Core-shell particles for magnetic packaging Brandon C. Marin 2023-10-31 $30,374,000
11462432 Dual side de-bonding in component carriers using photoablation Frank Truong, Praneeth Akkinepally, Chelsea M. Groves, Jason M. Gamba, Brandon C. Marin 2022-10-04 $13,460,000
11296186 Package-integrated vertical capacitors and methods of assembling same Brandon C. Marin, Praneeth Akkinepally, Dilan Seneviratne, Frank Truong 2022-04-05 $18,322,000
10546916 Package-integrated vertical capacitors and methods of assembling same Brandon C. Marin, Praneeth Akkinepally, Dilan Seneviratne, Frank Truong 2020-01-28 $38,246,000
9799593 Semiconductor package substrate having an interfacial layer Bainye Francoise ANGOUA, Dilan Seneviratne 2017-10-24 $10,797,000
9728500 Integrated circuit surface layer with adhesion-functional group Siddharth K. Alur, Sri Chaitra Jyotsna Chavali, Robert Alan May 2017-08-08 $11,912,000

Frequent Collaborators

Brandon C. Marin5 shared
Dilan Seneviratne4 shared
Praneeth Akkinepally3 shared
Srinivas V. Pietambaram3 shared
Frank Truong3 shared
Sarah Blythe2 shared

Nearby-Ranked Inventors

John Patrick Hickey, III12
Gregory Lutter12
Josselin Xavier COUPARD12
Xuan Li12
Nandana Mihindukulasooriya12
Keiichi Matsuda12
Robert Imig12
Peter Mage12
Sze Ping Ching12