| 12374482 |
Carrier chuck comprising a plurality of magnets and methods of forming and using thereof |
Yosef KORNBLUTH, Ravindranadh Eluri, Aaditya Anand CANDADAI, Srinivas V. Pietambaram |
2025-07-29 |
| 12266581 |
Electronic substrates having heterogeneous dielectric layers |
Joshua Stacey, Sarah Blythe, Peumie Abeyratne Kuragama, Junxin Wang |
2025-04-01 |
| 12214579 |
Dry film lamination with dynamic feedback control |
Joshua Stacey, Yosef KORNBLUTH |
2025-02-04 |
| 11804420 |
Core-shell particles for magnetic packaging |
Brandon C. Marin |
2023-10-31 |
| 11462432 |
Dual side de-bonding in component carriers using photoablation |
Frank Truong, Praneeth Akkinepally, Chelsea M. Groves, Jason M. Gamba, Brandon C. Marin |
2022-10-04 |
| 11296186 |
Package-integrated vertical capacitors and methods of assembling same |
Brandon C. Marin, Praneeth Akkinepally, Dilan Seneviratne, Frank Truong |
2022-04-05 |
| 10546916 |
Package-integrated vertical capacitors and methods of assembling same |
Brandon C. Marin, Praneeth Akkinepally, Dilan Seneviratne, Frank Truong |
2020-01-28 |
| 9799593 |
Semiconductor package substrate having an interfacial layer |
Bainye Francoise ANGOUA, Dilan Seneviratne |
2017-10-24 |
| 9728500 |
Integrated circuit surface layer with adhesion-functional group |
Siddharth K. Alur, Sri Chaitra Jyotsna Chavali, Robert Alan May |
2017-08-08 |