Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12310715 | Catheter deflection system with deflection load limiter | Ryan Hoitink, Ricardo Padilla | 2025-05-27 |
| 11855125 | Capacitors with nanoislands on conductive plates | Srinivas V. Pietambaram, Brandon C. Marin, Jeremy Ecton, Hiroki Tanaka | 2023-12-26 |
| 11744480 | Catheter deflection system with deflection load limiter | Ryan Hoitink, Ricardo Padilla | 2023-09-05 |
| 11737208 | Microelectronic assemblies having conductive structures with different thicknesses | Brandon C. Marin, Andrew J. Brown, Rahul Jain, Dilan Seneviratne, Praneeth Akkinepally | 2023-08-22 |
| 11728265 | Selective deposition of embedded thin-film resistors for semiconductor packaging | Brandon C. Marin, Shivasubramanian Balasubramanian, Dilan Seneviratne, Yonggang Li, Sameer Paital +4 more | 2023-08-15 |
| 11728077 | Magnetic material having coated ferromagnetic filler particles | Brandon C. Marin, Shivasubramanian Balasubramanian | 2023-08-15 |
| 11688692 | Embedded multi-die interconnect bridge having a substrate with conductive pathways and a molded material region with through-mold vias | Praneeth Akkinepally, Jason M. Gamba, Robert Alan May | 2023-06-27 |
| 11574874 | Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch | Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Hiroki Tanaka, Srinivas V. Pietambaram +4 more | 2023-02-07 |
| 11571876 | Dielectric film with pressure sensitive microcapsules of adhesion promoter | Praneeth Akkinepally, Dilan Seneviratne | 2023-02-07 |
| 11462432 | Dual side de-bonding in component carriers using photoablation | Praneeth Akkinepally, Chelsea M. Groves, Whitney Bryks, Jason M. Gamba, Brandon C. Marin | 2022-10-04 |
| 11348865 | Electronic device including a substrate having interconnects | Praneeth Akkinepally, Jieying Kong | 2022-05-31 |
| 11296186 | Package-integrated vertical capacitors and methods of assembling same | Brandon C. Marin, Praneeth Akkinepally, Whitney Bryks, Dilan Seneviratne | 2022-04-05 |
| 11276634 | High density package substrate formed with dielectric bi-layer | Srinivas V. Pietambaram, Rahul N. Manepalli, David Unruh, Kyu Oh Lee, Junnan Zhao +1 more | 2022-03-15 |
| 11233009 | Embedded multi-die interconnect bridge having a molded region with through-mold vias | Praneeth Akkinepally, Jason M. Gamba, Robert Alan May | 2022-01-25 |
| 11158444 | Magnetic material having coated ferromagnetic filler particles | Brandon C. Marin, Shivasubramanian Balasubramanian | 2021-10-26 |
| 10546916 | Package-integrated vertical capacitors and methods of assembling same | Brandon C. Marin, Praneeth Akkinepally, Whitney Bryks, Dilan Seneviratne | 2020-01-28 |
| 10111338 | Build-up high-aspect ratio opening | Dilan Seneviratne | 2018-10-23 |
| 10068776 | Raster-planarized substrate interlayers and methods of planarizing same | Praneeth Akkinepally, Shruti R. Jaywant, Dilan Seneviratne | 2018-09-04 |
| 9744350 | Method for the implantation of active fixation medical leads | — | 2017-08-29 |
| 8747417 | Device and method for the implantation of active fixation medical leads | — | 2014-06-10 |
| 8170692 | Implant tool for active fixation lead | Virote Indravudh, Shimul Sengupta, Jayaram Sundararajan, Elizabeth Nee, Ryan Kenneth Buesseler | 2012-05-01 |
| 7590973 | Systems and methods for gathering, organizing and executing test cases | Damon Luke Barry, Greg Veith, Brent R. Jensen | 2009-09-15 |