FT

Frank Truong

IN Intel: 16 patents #2,580 of 30,777Top 9%
PA Pacesetter: 3 patents #335 of 832Top 45%
B( Biosense Webster (Israel): 2 patents #242 of 493Top 50%
Microsoft: 1 patents #24,826 of 40,388Top 65%
Overall (All Time): #189,674 of 4,157,543Top 5%
22
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12310715 Catheter deflection system with deflection load limiter Ryan Hoitink, Ricardo Padilla 2025-05-27
11855125 Capacitors with nanoislands on conductive plates Srinivas V. Pietambaram, Brandon C. Marin, Jeremy Ecton, Hiroki Tanaka 2023-12-26
11744480 Catheter deflection system with deflection load limiter Ryan Hoitink, Ricardo Padilla 2023-09-05
11737208 Microelectronic assemblies having conductive structures with different thicknesses Brandon C. Marin, Andrew J. Brown, Rahul Jain, Dilan Seneviratne, Praneeth Akkinepally 2023-08-22
11728265 Selective deposition of embedded thin-film resistors for semiconductor packaging Brandon C. Marin, Shivasubramanian Balasubramanian, Dilan Seneviratne, Yonggang Li, Sameer Paital +4 more 2023-08-15
11728077 Magnetic material having coated ferromagnetic filler particles Brandon C. Marin, Shivasubramanian Balasubramanian 2023-08-15
11688692 Embedded multi-die interconnect bridge having a substrate with conductive pathways and a molded material region with through-mold vias Praneeth Akkinepally, Jason M. Gamba, Robert Alan May 2023-06-27
11574874 Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Hiroki Tanaka, Srinivas V. Pietambaram +4 more 2023-02-07
11571876 Dielectric film with pressure sensitive microcapsules of adhesion promoter Praneeth Akkinepally, Dilan Seneviratne 2023-02-07
11462432 Dual side de-bonding in component carriers using photoablation Praneeth Akkinepally, Chelsea M. Groves, Whitney Bryks, Jason M. Gamba, Brandon C. Marin 2022-10-04
11348865 Electronic device including a substrate having interconnects Praneeth Akkinepally, Jieying Kong 2022-05-31
11296186 Package-integrated vertical capacitors and methods of assembling same Brandon C. Marin, Praneeth Akkinepally, Whitney Bryks, Dilan Seneviratne 2022-04-05
11276634 High density package substrate formed with dielectric bi-layer Srinivas V. Pietambaram, Rahul N. Manepalli, David Unruh, Kyu Oh Lee, Junnan Zhao +1 more 2022-03-15
11233009 Embedded multi-die interconnect bridge having a molded region with through-mold vias Praneeth Akkinepally, Jason M. Gamba, Robert Alan May 2022-01-25
11158444 Magnetic material having coated ferromagnetic filler particles Brandon C. Marin, Shivasubramanian Balasubramanian 2021-10-26
10546916 Package-integrated vertical capacitors and methods of assembling same Brandon C. Marin, Praneeth Akkinepally, Whitney Bryks, Dilan Seneviratne 2020-01-28
10111338 Build-up high-aspect ratio opening Dilan Seneviratne 2018-10-23
10068776 Raster-planarized substrate interlayers and methods of planarizing same Praneeth Akkinepally, Shruti R. Jaywant, Dilan Seneviratne 2018-09-04
9744350 Method for the implantation of active fixation medical leads 2017-08-29
8747417 Device and method for the implantation of active fixation medical leads 2014-06-10
8170692 Implant tool for active fixation lead Virote Indravudh, Shimul Sengupta, Jayaram Sundararajan, Elizabeth Nee, Ryan Kenneth Buesseler 2012-05-01
7590973 Systems and methods for gathering, organizing and executing test cases Damon Luke Barry, Greg Veith, Brent R. Jensen 2009-09-15