| 12327773 |
Package with underfill containment barrier |
Rahul Jain, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more |
2025-06-10 |
|
| 12288744 |
Microelectronic assemblies having conductive structures with different thicknesses on a core substrate |
Ji-Yong Park, Yikang Deng, Zhichao Zhang, Liwei Cheng, Andrew J. Brown +2 more |
2025-04-29 |
|
| 12224264 |
Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate |
Rahul Jain, Ji-Yong Park |
2025-02-11 |
|
| 12224253 |
Magnetic inductor device and method |
Xin Ning, Brandon C. Marin, Siddharth K. Alur, Numair Ahmed, Brent Williams +3 more |
2025-02-11 |
|
| 12154715 |
Methods to selectively embed magnetic materials in substrate and corresponding structures |
Cheng Xu, Junnan Zhao, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more |
2024-11-26 |
$26,820,000 |
| 11942406 |
Semiconductor packages with embedded interconnects |
Dilan Seneviratne, Ravindranadh Eluri |
2024-03-26 |
$33,708,000 |
| 11935805 |
Package with underfill containment barrier |
Rahul Jain, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more |
2024-03-19 |
$28,784,000 |
| 11901115 |
Substrate assembly with encapsulated magnetic feature |
Rahul Jain, Sai Vadlamani, Cheng Xu, Ji-Yong Park, Junnan Zhao +1 more |
2024-02-13 |
$18,546,000 |
| 11862552 |
Methods of embedding magnetic structures in substrates |
Sai Vadlamani, Prithwish Chatterjee, Robert Alan May, Rahul Jain, Lauren A. Link +2 more |
2024-01-02 |
$30,016,000 |
| 11842981 |
Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate |
Rahul Jain, Ji-Yong Park |
2023-12-12 |
$45,136,000 |
| 11735537 |
Methods to embed magnetic material as first layer on coreless substrates and corresponding structures |
Cheng Xu, Junnan Zhao, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more |
2023-08-22 |
$16,803,000 |
| 11664290 |
Package with underfill containment barrier |
Rahul Jain, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more |
2023-05-30 |
$16,378,000 |
| 11651885 |
Magnetic core inductors |
Junnan Zhao, Ying Wang, Cheng Xu, Sheng Li, Yikang Deng |
2023-05-16 |
$11,130,000 |
| 11610706 |
Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates |
Sai Vadlamani, Prithwish Chatterjee, Rahul Jain, Sheng Li, Andrew J. Brown +1 more |
2023-03-21 |
$20,076,000 |
| 11581271 |
Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrate |
Rahul Jain, Islam A. Salama, Amruthavalli Pallavi Alur, Wei-Lun Kane Jen, Yongki Min +1 more |
2023-02-14 |
$12,790,000 |
| 11557489 |
Cavity structures in integrated circuit package supports |
Rahul Jain, Sai Vadlamani, Junnan Zhao, Ji-Yong Park, Cheng Xu |
2023-01-17 |
$13,997,000 |
| 11521914 |
Microelectronic assemblies having a cooling channel |
Zhimin Wan, Cheng Xu, Yikang Deng, Junnan Zhao, Ying Wang +3 more |
2022-12-06 |
$14,727,000 |
| 11502017 |
Effective heat conduction from hotspot to heat spreader through package substrate |
Cheng Xu, Zhimin Wan, Lingtao Liu, Yikang Deng, Junnan Zhao +1 more |
2022-11-15 |
$16,955,000 |
| 11482471 |
Thermal management solutions for integrated circuit packages |
Cheng Xu, Junnan Zhao, Zhimin Wan, Ying Wang, Yikang Deng +3 more |
2022-10-25 |
$11,792,000 |
| 11450471 |
Methods to selectively embed magnetic materials in substrate and corresponding structures |
Cheng Xu, Junnan Zhao, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more |
2022-09-20 |
$15,654,000 |
| 11443892 |
Substrate assembly with encapsulated magnetic feature |
Rahul Jain, Sai Vadlamani, Cheng Xu, Ji-Yong Park, Junnan Zhao +1 more |
2022-09-13 |
$14,653,000 |
| 11432405 |
Methods for attaching large components in a package substrate for advanced power delivery |
Rahul Jain, Prithwish Chatterjee |
2022-08-30 |
$13,077,000 |
| 11417614 |
Methods to embed magnetic material as first layer on coreless substrates and corresponding structures |
Cheng Xu, Junnan Zhao, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more |
2022-08-16 |
$17,788,000 |
| 11410921 |
Methods to incorporate thin film capacitor sheets (TFC-S) in the build-up films |
Rahul Jain |
2022-08-09 |
$13,688,000 |
| 11393745 |
Semiconductor packages with embedded interconnects |
Dilan Seneviratne, Ravindranadh Eluri |
2022-07-19 |
$11,394,000 |
