Issued Patents All Time
Showing 25 most recent of 66 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12327773 | Package with underfill containment barrier | Rahul Jain, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more | 2025-06-10 |
| 12288744 | Microelectronic assemblies having conductive structures with different thicknesses on a core substrate | Ji-Yong Park, Yikang Deng, Zhichao Zhang, Liwei Cheng, Andrew J. Brown +2 more | 2025-04-29 |
| 12224264 | Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate | Rahul Jain, Ji-Yong Park | 2025-02-11 |
| 12224253 | Magnetic inductor device and method | Xin Ning, Brandon C. Marin, Siddharth K. Alur, Numair Ahmed, Brent Williams +3 more | 2025-02-11 |
| 12154715 | Methods to selectively embed magnetic materials in substrate and corresponding structures | Cheng Xu, Junnan Zhao, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more | 2024-11-26 |
| 11942406 | Semiconductor packages with embedded interconnects | Dilan Seneviratne, Ravindranadh Eluri | 2024-03-26 |
| 11935805 | Package with underfill containment barrier | Rahul Jain, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more | 2024-03-19 |
| 11901115 | Substrate assembly with encapsulated magnetic feature | Rahul Jain, Sai Vadlamani, Cheng Xu, Ji-Yong Park, Junnan Zhao +1 more | 2024-02-13 |
| 11862552 | Methods of embedding magnetic structures in substrates | Sai Vadlamani, Prithwish Chatterjee, Robert Alan May, Rahul Jain, Lauren A. Link +2 more | 2024-01-02 |
| 11842981 | Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate | Rahul Jain, Ji-Yong Park | 2023-12-12 |
| 11735537 | Methods to embed magnetic material as first layer on coreless substrates and corresponding structures | Cheng Xu, Junnan Zhao, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more | 2023-08-22 |
| 11664290 | Package with underfill containment barrier | Rahul Jain, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more | 2023-05-30 |
| 11651885 | Magnetic core inductors | Junnan Zhao, Ying Wang, Cheng Xu, Sheng Li, Yikang Deng | 2023-05-16 |
| 11610706 | Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates | Sai Vadlamani, Prithwish Chatterjee, Rahul Jain, Sheng Li, Andrew J. Brown +1 more | 2023-03-21 |
| 11581271 | Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrate | Rahul Jain, Islam A. Salama, Amruthavalli Pallavi Alur, Wei-Lun Kane Jen, Yongki Min +1 more | 2023-02-14 |
| 11557489 | Cavity structures in integrated circuit package supports | Rahul Jain, Sai Vadlamani, Junnan Zhao, Ji-Yong Park, Cheng Xu | 2023-01-17 |
| 11521914 | Microelectronic assemblies having a cooling channel | Zhimin Wan, Cheng Xu, Yikang Deng, Junnan Zhao, Ying Wang +3 more | 2022-12-06 |
| 11502017 | Effective heat conduction from hotspot to heat spreader through package substrate | Cheng Xu, Zhimin Wan, Lingtao Liu, Yikang Deng, Junnan Zhao +1 more | 2022-11-15 |
| 11482471 | Thermal management solutions for integrated circuit packages | Cheng Xu, Junnan Zhao, Zhimin Wan, Ying Wang, Yikang Deng +3 more | 2022-10-25 |
| 11450471 | Methods to selectively embed magnetic materials in substrate and corresponding structures | Cheng Xu, Junnan Zhao, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more | 2022-09-20 |
| 11443892 | Substrate assembly with encapsulated magnetic feature | Rahul Jain, Sai Vadlamani, Cheng Xu, Ji-Yong Park, Junnan Zhao +1 more | 2022-09-13 |
| 11432405 | Methods for attaching large components in a package substrate for advanced power delivery | Rahul Jain, Prithwish Chatterjee | 2022-08-30 |
| 11417614 | Methods to embed magnetic material as first layer on coreless substrates and corresponding structures | Cheng Xu, Junnan Zhao, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more | 2022-08-16 |
| 11410921 | Methods to incorporate thin film capacitor sheets (TFC-S) in the build-up films | Rahul Jain | 2022-08-09 |
| 11393745 | Semiconductor packages with embedded interconnects | Dilan Seneviratne, Ravindranadh Eluri | 2022-07-19 |