| 12288744 |
Microelectronic assemblies having conductive structures with different thicknesses on a core substrate |
Ji-Yong Park, Kyu Oh Lee, Yikang Deng, Zhichao Zhang, Liwei Cheng +2 more |
2025-04-29 |
|
| 12154715 |
Methods to selectively embed magnetic materials in substrate and corresponding structures |
Kyu Oh Lee, Junnan Zhao, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more |
2024-11-26 |
$26,820,000 |
| 12087746 |
Microelectronic assemblies having an integrated capacitor |
Chong Zhang, Junnan Zhao, Ying Wang, Meizi Jiao |
2024-09-10 |
$16,964,000 |
| 12026106 |
Dynamic compression for multiprocessor platforms and interconnects |
Keqiang Wu, Zhidong Yu, Samuel Ortiz, Weiting Chen |
2024-07-02 |
$27,114,000 |
| 11901115 |
Substrate assembly with encapsulated magnetic feature |
Kyu Oh Lee, Rahul Jain, Sai Vadlamani, Ji-Yong Park, Junnan Zhao +1 more |
2024-02-13 |
$18,546,000 |
| 11894282 |
Vented lids for integrated circuit packages |
Zhimin Wan, Sergio Antonio Chan Arguedas, Peng Li, Chandra Mohan Jha, Aravindha R. Antoniswamy +2 more |
2024-02-06 |
$35,892,000 |
| 11830809 |
Magnetic structures in integrated circuit package supports |
Ying Wang, Yikang Deng, Junnan Zhao, Andrew J. Brown, Kaladhar Radhakrishnan |
2023-11-28 |
$31,872,000 |
| 11769719 |
Dual trace thickness for single layer routing |
Jonathan L. Rosch, Wei-Lun Kane Jen, Liwei Cheng, Andrew J. Brown, Yikang Deng |
2023-09-26 |
$20,953,000 |
| 11735537 |
Methods to embed magnetic material as first layer on coreless substrates and corresponding structures |
Kyu Oh Lee, Junnan Zhao, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more |
2023-08-22 |
$16,803,000 |
| 11721677 |
Microelectronic assemblies having an integrated capacitor |
Chong Zhang, Junnan Zhao, Ying Wang, Meizi Jiao |
2023-08-08 |
$22,376,000 |
| 11705389 |
Vias for package substrates |
Andrew J. Brown, Luke Garner, Liwei Cheng, Lauren A. Link, Ying Wang +2 more |
2023-07-18 |
$21,060,000 |
| 11696407 |
Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate |
Chong Zhang, Ying Wang, Junnan Zhao, Yikang Deng |
2023-07-04 |
|
| 11651885 |
Magnetic core inductors |
Junnan Zhao, Ying Wang, Kyu Oh Lee, Sheng Li, Yikang Deng |
2023-05-16 |
$11,130,000 |
| 11646254 |
Electronic device including a lateral trace |
Yikang Deng, Ying Wang, Chong Zhang, Junnan Zhao |
2023-05-09 |
|
| 11557579 |
Microelectronic assemblies having an integrated capacitor |
Chong Zhang, Junnan Zhao, Ying Wang, Meizi Jiao |
2023-01-17 |
$13,997,000 |
| 11557489 |
Cavity structures in integrated circuit package supports |
Rahul Jain, Sai Vadlamani, Junnan Zhao, Ji-Yong Park, Kyu Oh Lee |
2023-01-17 |
$13,997,000 |
| 11521914 |
Microelectronic assemblies having a cooling channel |
Zhimin Wan, Yikang Deng, Junnan Zhao, Ying Wang, Chong Zhang +3 more |
2022-12-06 |
$14,727,000 |
| 11508636 |
Multi-layer solution based deposition of dielectrics for advanced substrate architectures |
Andrew J. Brown, Ji-Yong Park, Siddharth K. Alur, Amruthavalli Pallavi Alur |
2022-11-22 |
$12,862,000 |
| 11502017 |
Effective heat conduction from hotspot to heat spreader through package substrate |
Zhimin Wan, Lingtao Liu, Yikang Deng, Junnan Zhao, Chandra Mohan Jha +1 more |
2022-11-15 |
$16,955,000 |
| 11482471 |
Thermal management solutions for integrated circuit packages |
Junnan Zhao, Zhimin Wan, Ying Wang, Yikang Deng, Chong Zhang +3 more |
2022-10-25 |
$11,792,000 |
| 11450471 |
Methods to selectively embed magnetic materials in substrate and corresponding structures |
Kyu Oh Lee, Junnan Zhao, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more |
2022-09-20 |
$15,654,000 |
| 11443892 |
Substrate assembly with encapsulated magnetic feature |
Kyu Oh Lee, Rahul Jain, Sai Vadlamani, Ji-Yong Park, Junnan Zhao +1 more |
2022-09-13 |
$14,653,000 |
| 11417614 |
Methods to embed magnetic material as first layer on coreless substrates and corresponding structures |
Kyu Oh Lee, Junnan Zhao, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more |
2022-08-16 |
$17,788,000 |
| 11387224 |
Phase change material in substrate cavity |
Zhimin Wan, Yikang Deng, Junnan Zhao, Chong Zhang, Chandra Mohan Jha +2 more |
2022-07-12 |
$13,106,000 |
| 11380609 |
Microelectronic assemblies having conductive structures with different thicknesses on a core substrate |
Jiwei Sun, Ji-Yong Park, Kyu Oh Lee, Yikang Deng, Zhichao Zhang +2 more |
2022-07-05 |
$18,093,000 |
