Issued Patents All Time
Showing 25 most recent of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12288744 | Microelectronic assemblies having conductive structures with different thicknesses on a core substrate | Ji-Yong Park, Kyu Oh Lee, Yikang Deng, Zhichao Zhang, Liwei Cheng +2 more | 2025-04-29 |
| 12154715 | Methods to selectively embed magnetic materials in substrate and corresponding structures | Kyu Oh Lee, Junnan Zhao, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more | 2024-11-26 |
| 12087746 | Microelectronic assemblies having an integrated capacitor | Chong Zhang, Junnan Zhao, Ying Wang, Meizi Jiao | 2024-09-10 |
| 12026106 | Dynamic compression for multiprocessor platforms and interconnects | Keqiang Wu, Zhidong Yu, Samuel Ortiz, Weiting Chen | 2024-07-02 |
| 11901115 | Substrate assembly with encapsulated magnetic feature | Kyu Oh Lee, Rahul Jain, Sai Vadlamani, Ji-Yong Park, Junnan Zhao +1 more | 2024-02-13 |
| 11894282 | Vented lids for integrated circuit packages | Zhimin Wan, Sergio Antonio Chan Arguedas, Peng Li, Chandra Mohan Jha, Aravindha R. Antoniswamy +2 more | 2024-02-06 |
| 11830809 | Magnetic structures in integrated circuit package supports | Ying Wang, Yikang Deng, Junnan Zhao, Andrew J. Brown, Kaladhar Radhakrishnan | 2023-11-28 |
| 11769719 | Dual trace thickness for single layer routing | Jonathan L. Rosch, Wei-Lun Kane Jen, Liwei Cheng, Andrew J. Brown, Yikang Deng | 2023-09-26 |
| 11735537 | Methods to embed magnetic material as first layer on coreless substrates and corresponding structures | Kyu Oh Lee, Junnan Zhao, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more | 2023-08-22 |
| 11721677 | Microelectronic assemblies having an integrated capacitor | Chong Zhang, Junnan Zhao, Ying Wang, Meizi Jiao | 2023-08-08 |
| 11705389 | Vias for package substrates | Andrew J. Brown, Luke Garner, Liwei Cheng, Lauren A. Link, Ying Wang +2 more | 2023-07-18 |
| 11696407 | Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate | Chong Zhang, Ying Wang, Junnan Zhao, Yikang Deng | 2023-07-04 |
| 11651885 | Magnetic core inductors | Junnan Zhao, Ying Wang, Kyu Oh Lee, Sheng Li, Yikang Deng | 2023-05-16 |
| 11646254 | Electronic device including a lateral trace | Yikang Deng, Ying Wang, Chong Zhang, Junnan Zhao | 2023-05-09 |
| 11557579 | Microelectronic assemblies having an integrated capacitor | Chong Zhang, Junnan Zhao, Ying Wang, Meizi Jiao | 2023-01-17 |
| 11557489 | Cavity structures in integrated circuit package supports | Rahul Jain, Sai Vadlamani, Junnan Zhao, Ji-Yong Park, Kyu Oh Lee | 2023-01-17 |
| 11521914 | Microelectronic assemblies having a cooling channel | Zhimin Wan, Yikang Deng, Junnan Zhao, Ying Wang, Chong Zhang +3 more | 2022-12-06 |
| 11508636 | Multi-layer solution based deposition of dielectrics for advanced substrate architectures | Andrew J. Brown, Ji-Yong Park, Siddharth K. Alur, Amruthavalli Pallavi Alur | 2022-11-22 |
| 11502017 | Effective heat conduction from hotspot to heat spreader through package substrate | Zhimin Wan, Lingtao Liu, Yikang Deng, Junnan Zhao, Chandra Mohan Jha +1 more | 2022-11-15 |
| 11482471 | Thermal management solutions for integrated circuit packages | Junnan Zhao, Zhimin Wan, Ying Wang, Yikang Deng, Chong Zhang +3 more | 2022-10-25 |
| 11450471 | Methods to selectively embed magnetic materials in substrate and corresponding structures | Kyu Oh Lee, Junnan Zhao, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more | 2022-09-20 |
| 11443892 | Substrate assembly with encapsulated magnetic feature | Kyu Oh Lee, Rahul Jain, Sai Vadlamani, Ji-Yong Park, Junnan Zhao +1 more | 2022-09-13 |
| 11417614 | Methods to embed magnetic material as first layer on coreless substrates and corresponding structures | Kyu Oh Lee, Junnan Zhao, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more | 2022-08-16 |
| 11387224 | Phase change material in substrate cavity | Zhimin Wan, Yikang Deng, Junnan Zhao, Chong Zhang, Chandra Mohan Jha +2 more | 2022-07-12 |
| 11380609 | Microelectronic assemblies having conductive structures with different thicknesses on a core substrate | Jiwei Sun, Ji-Yong Park, Kyu Oh Lee, Yikang Deng, Zhichao Zhang +2 more | 2022-07-05 |