Issued Patents All Time
Showing 26–42 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355459 | Embedding magnetic material, in a cored or coreless semiconductor package | Kyu Oh Lee, Sai Vadlamani, Rahul Jain, Junnan Zhao, Ji-Yong Park +1 more | 2022-06-07 |
| 11335632 | Magnetic inductor structures for package devices | Prithwish Chatterjee, Junnan Zhao, Sai Vadlamani, Ying Wang, Rahul Jain +3 more | 2022-05-17 |
| 11322290 | Techniques for an inductor at a first level interface | Yikang Deng, Kyu Oh Lee, Ji-Yong Park, Srinivas V. Pietambaram, Ying Wang +3 more | 2022-05-03 |
| 11246218 | Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate | Chong Zhang, Ying Wang, Junnan Zhao, Yikang Deng | 2022-02-08 |
| 11217534 | Galvanic corrosion protection for semiconductor packages | Junnan Zhao, Ji-Yong Park, Kyu Oh Lee | 2022-01-04 |
| 11031360 | Techniques for an inductor at a second level interface | Yikang Deng, Kyu Oh Lee, Ji-Yong Park, Srinivas V. Pietambaram, Ying Wang +3 more | 2021-06-08 |
| 10971492 | Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same | Rahul Jain, Seo Young Kim, Kyu Oh Lee, Ji-Yong Park, Sai Vadlamani +1 more | 2021-04-06 |
| 10804188 | Electronic device including a lateral trace | Yikang Deng, Ying Wang, Chong Zhang, Junnan Zhao | 2020-10-13 |
| 10790159 | Semiconductor package substrate with through-hole magnetic core inductor using conductive paste | Chong Zhang, Yikang Deng, Junnan Zhao, Ying Wang | 2020-09-29 |
| 10777514 | Techniques for an inductor at a second level interface | Yikang Deng, Kyu Oh Lee, Ji-Yong Park, Srinivas V. Pietambaram, Ying Wang +3 more | 2020-09-15 |
| 10770344 | Chamferless interconnect vias of semiconductor devices | Yuping Ren, Haigou Huang, Ravi Prakash Srivastava, Zhiguo Sun, Qiang Fang +1 more | 2020-09-08 |
| 10745816 | Transfer of vertically aligned ultra-high density nanowires onto flexible substrates | Kirk Jeremy Ziegler, Jie Liu | 2020-08-18 |
| 10741947 | Plated through hole socketing coupled to a solder ball to engage with a pin | Amruthavalli Pallavi Alur, Siddharth K. Alur, Liwei Cheng, Lauren A. Link, Jonathan L. Rosch +1 more | 2020-08-11 |
| 10643994 | Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same | Rahul Jain, Seo Young Kim, Kyu Oh Lee, Ji-Yong Park, Sai Vadlamani +1 more | 2020-05-05 |
| 10400322 | Fabrication of thermally stable nanocavities and particle-in-cavity nanostructures | Luping Li, Yang Zhao, Kirk Jeremy Ziegler, Justin C. Wong | 2019-09-03 |
| 10373951 | Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same | Rahul Jain, Seo Young Kim, Kyu Oh Lee, Ji-Yong Park, Sai Vadlamani +1 more | 2019-08-06 |
| 10209017 | Cryogenic heat transfer by a nanoporous surface | Hong Hu, Jacob N. Chung, Kirk Jeremy Ziegler, Yang Zhao | 2019-02-19 |