Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
YW

Ying Wang — 91 Patents

Qualcomm: 51 patents #481 of 12,104Top 4%
Intel: 21 patents #1,927 of 30,777Top 7%
BUBeijing Jiaotong University: 2 patents #20 of 218Top 10%
JCJing-Jin Electric Technologies Co.: 1 patents #42 of 82Top 55%
SLSiemens Healthcare Limited: 1 patents #950 of 1,907Top 50%
TRTahoe Research: 1 patents #81 of 215Top 40%
Overall (All Time): #17,516 of 4,157,543Top 1%
91 Patents All Time
Ying Wang has been granted 91 US patents while listed as an inventor at Qualcomm. The first was granted in 2011 and the most recent in December 2025. Ying Wang ranks #17,516 of 4,157,543 US inventors in our database (top 0.42%). Patent records list Ying Wang in Beijing, CA, CN.

Issued Patents All Time

Showing 1–25 of 91 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12507974 Systems and methods for correcting motion artifacts in images Jinpeng Tian 2025-12-30
12495993 Systems, devices and methods for analyte sensor insertion Vivek S. Rao, Louis G. Pace, Hyun Cho, Benjamin J. Feldman, Tuan Nguyen 2025-12-16
12483954 Method and apparatus for configuring channel resource Huaisong Zhu, Yaoyao Zhu, Zhi Ge, Rulong Zheng 2025-11-25
12464041 Industrial automation with 5G and beyond Joachim Sachs, Abdulrahman Alabbasi, Malin Andersson, Niklas Andgart, Ola Angelsmark +59 more 2025-11-04
12446062 Method and base station for resource allocation Huaisong Zhu, Zhi Ge 2025-10-14
12363605 High priority route selection descriptor (RSD) selection timer Li Tan, Chaofeng HUI, Tom Chin, Shailesh Maheshwari 2025-07-15
12294952 Transmission power configuration Wei Yang, Jing Jiang, Gabi Sarkis, Wanshi Chen, Xiao Feng Wang 2025-05-06
12281451 Top-down construction-type assembly construction method for paved road surface Jiesheng Zhang, Yangjie Jiang, Fengchun Dong, Wu Huang, Anhui Wang +9 more 2025-04-22
12131258 Joint pruning and quantization scheme for deep neural networks Yadong Lu, Tijmen Pieter Frederik BLANKEVOORT, Christos LOUIZOS, Matthias REISSER, Jilei Hou 2024-10-29 $22,162,000
12114356 Fallback procedures for two-step random access procedures Jing Lei, Linhai HE, Hung Dinh LY, Seyong Park, Naga Bhushan +2 more 2024-10-08 $22,809,000
12087746 Microelectronic assemblies having an integrated capacitor Chong Zhang, Cheng Xu, Junnan Zhao, Meizi Jiao 2024-09-10 $16,964,000
12068856 Group feedback techniques in wireless systems Gabi Sarkis, Jing Lei, Seyong Park, Naga Bhushan, Chih-Ping Li +2 more 2024-08-20 $15,229,000
12057937 Adjusting M for polar codes rate matching design Liangming WU, Changlong XU, Jian Li, Jing Jiang, Wei Yang 2024-08-06 $15,639,000
11956733 Power control design for non-orthogonal multiple access Jing Lei, Tingfang Ji, Peter Gaal, Xiao Feng Wang, Joseph Binamira Soriaga +5 more 2024-04-09 $17,363,000
11896412 Computed tomography system and method and device controlling the position of the x-ray tube thereof Jin Ding, Jian Zhang, Jia Peng Zhu 2024-02-13 $43,642,000
11894282 Vented lids for integrated circuit packages Zhimin Wan, Sergio Antonio Chan Arguedas, Peng Li, Chandra Mohan Jha, Aravindha R. Antoniswamy +2 more 2024-02-06 $35,892,000
11830809 Magnetic structures in integrated circuit package supports Yikang Deng, Junnan Zhao, Andrew J. Brown, Cheng Xu, Kaladhar Radhakrishnan 2023-11-28 $31,872,000
11789047 Steady state fault current calculation method for modular multilevel converter Jinghan He, Meng Li, Yiping Luo, Xiaojun Wang, Yin Xu +5 more 2023-10-17
11765771 Fallback procedures for two-step random access procedures Jing Lei, Linhai HE, Hung Dinh LY, Seyong Park, Naga Bhushan +2 more 2023-09-19 $10,581,000
11728952 Channel quality indicator (CQI) reporting for ultra-reliable low latency communications (URLLC) Gabi Sarkis, Jing Jiang, Wanshi Chen, Wei Yang, Chih-Ping Li 2023-08-15 $7,580,000
11721677 Microelectronic assemblies having an integrated capacitor Chong Zhang, Cheng Xu, Junnan Zhao, Meizi Jiao 2023-08-08 $22,376,000
11705389 Vias for package substrates Andrew J. Brown, Luke Garner, Liwei Cheng, Lauren A. Link, Cheng Xu +2 more 2023-07-18 $21,060,000
11696407 Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate Chong Zhang, Junnan Zhao, Cheng Xu, Yikang Deng 2023-07-04
11694134 Optimization method and device of crew replanning for high-speed railway in typical scenarios Jinchuan ZHANG, Jianrui Miao, Lingyun Meng, Xinyue Xu 2023-07-04
11651885 Magnetic core inductors Junnan Zhao, Cheng Xu, Kyu Oh Lee, Sheng Li, Yikang Deng 2023-05-16 $11,130,000