Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12288744 | Microelectronic assemblies having conductive structures with different thicknesses on a core substrate | Ji-Yong Park, Kyu Oh Lee, Yikang Deng, Zhichao Zhang, Andrew J. Brown +2 more | 2025-04-29 |
| 11849790 | Apparel fitting simulation based upon a captured two-dimensional human body posture image | Wei-Shan Hu | 2023-12-26 |
| 11769719 | Dual trace thickness for single layer routing | Jonathan L. Rosch, Wei-Lun Kane Jen, Cheng Xu, Andrew J. Brown, Yikang Deng | 2023-09-26 |
| 11705389 | Vias for package substrates | Andrew J. Brown, Luke Garner, Lauren A. Link, Cheng Xu, Ying Wang +2 more | 2023-07-18 |
| 11393762 | Formation of tall metal pillars using multiple photoresist layers | Sri Chaitra Jyotsna Chavali, Siddharth K. Alur, Sheng Li | 2022-07-19 |
| 11380609 | Microelectronic assemblies having conductive structures with different thicknesses on a core substrate | Cheng Xu, Jiwei Sun, Ji-Yong Park, Kyu Oh Lee, Yikang Deng +2 more | 2022-07-05 |
| 11120037 | Test data integration system and method thereof | Yong Yang, Wanwei Wu, Changqing Xu, Youjun Wang, Genjin Liu | 2021-09-14 |
| 10741947 | Plated through hole socketing coupled to a solder ball to engage with a pin | Amruthavalli Pallavi Alur, Siddharth K. Alur, Lauren A. Link, Jonathan L. Rosch, Sai Vadlamani +1 more | 2020-08-11 |