Liwei Cheng — 8 Patents at Intel

Liwei Cheng has been granted 8 US patents while listed as an inventor at Intel. The first was granted in 2020 and the most recent in April 2025. Liwei Cheng ranks #600,572 of 4,157,543 US inventors in our database (top 14.4%). Patent records list Liwei Cheng in Chandler, AZ, US.

Issued Patents All Time

Showing 1–8 of 8 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12288744	Microelectronic assemblies having conductive structures with different thicknesses on a core substrate	Ji-Yong Park, Kyu Oh Lee, Yikang Deng, Zhichao Zhang, Andrew J. Brown +2 more	2025-04-29
11849790	Apparel fitting simulation based upon a captured two-dimensional human body posture image	Wei-Shan Hu	2023-12-26
11769719	Dual trace thickness for single layer routing	Jonathan L. Rosch, Wei-Lun Kane Jen, Cheng Xu, Andrew J. Brown, Yikang Deng	2023-09-26	$20,953,000
11705389	Vias for package substrates	Andrew J. Brown, Luke Garner, Lauren A. Link, Cheng Xu, Ying Wang +2 more	2023-07-18	$21,060,000
11393762	Formation of tall metal pillars using multiple photoresist layers	Sri Chaitra Jyotsna Chavali, Siddharth K. Alur, Sheng Li	2022-07-19	$11,394,000
11380609	Microelectronic assemblies having conductive structures with different thicknesses on a core substrate	Cheng Xu, Jiwei Sun, Ji-Yong Park, Kyu Oh Lee, Yikang Deng +2 more	2022-07-05	$18,093,000
11120037	Test data integration system and method thereof	Yong Yang, Wanwei Wu, Changqing Xu, Youjun Wang, Genjin Liu	2021-09-14
10741947	Plated through hole socketing coupled to a solder ball to engage with a pin	Amruthavalli Pallavi Alur, Siddharth K. Alur, Lauren A. Link, Jonathan L. Rosch, Sai Vadlamani +1 more	2020-08-11	$37,011,000

Liwei Cheng — 8 Patents

Issued Patents All Time

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