YW

Youjun Wang

CC China Wafer Level Csp Co.: 3 patents #6 of 26Top 25%
PC Petal Cloud Technology Co.: 2 patents #2 of 48Top 5%
SP State Grid Beijing Electric Power: 1 patents #3 of 64Top 5%
SC State Grid Corporation Of China: 1 patents #289 of 1,453Top 20%
WI Wistron: 1 patents #959 of 2,107Top 50%
📍 Dongguan, CN: #208 of 2,387 inventorsTop 9%
Overall (All Time): #482,358 of 4,157,543Top 15%
10
Patents All Time

Issued Patents All Time

Showing 1–10 of 10 patents

Patent #TitleCo-InventorsDate
12309467 Video splitting method and electronic device Wenbo Wei, Zhigang Guo 2025-05-20
11902636 Video splitting method and electronic device Wenbo Wei, Zhigang Guo 2024-02-13
11120037 Test data integration system and method thereof Yong Yang, Wanwei Wu, Changqing Xu, Liwei Cheng, Genjin Liu 2021-09-14
D818764 Mixer 2018-05-29
D818761 Mixer 2018-05-29
D815738 Electrosurgical pencil Jingqi Ye, Zuokai Yin, Chaohui Tang, Chengfa Liu, Yin Su 2018-04-17
9256981 Method and device for processing geological information Bin Shu, Chao-Hsun Yang, Kai Zhang, Yong Wang, Zhishan Ren +8 more 2016-02-09
8174090 Packaging structure Zhiqi Wang, Guoqing Yu, Qiuhong Zou, Wei-Chung Wang 2012-05-08
7663213 Wafer level chip size packaged chip device with a double-layer lead structure and method of fabricating the same Guoqing Yu, Qinqin Xu, Qingwei Wang, Wei-Chung Wang 2010-02-16
7394152 Wafer level chip size packaged chip device with an N-shape junction inside and method of fabricating the same Guoqing Yu, Qinqin Xu, Qingwei Wang, Wei-Chung Wang 2008-07-01