Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8952512 | Wafer-level package structure of light emitting diode and manufacturing method thereof | Junjie Li, Wenbin Wang, Guoqing Yu, Wei-Chung Wang | 2015-02-10 |
| 8445919 | Wafer-level package structure of light emitting diode and manufacturing method thereof | Junjie Li, Wenbin Wang, Guoqing Yu, Wei-Chung Wang | 2013-05-21 |
| 8174090 | Packaging structure | Zhiqi Wang, Guoqing Yu, Youjun Wang, Wei-Chung Wang | 2012-05-08 |