ZW

Zhiqi Wang

CC China Wafer Level Csp Co.: 27 patents #1 of 26Top 4%
BC Bestechnic (Shanghai) Co.: 2 patents #17 of 33Top 55%
Fujitsu Limited: 2 patents #10,930 of 24,456Top 45%
CT Chongqing University Of Science And Technology: 1 patents #1 of 41Top 3%
Huawei: 1 patents #8,196 of 15,535Top 55%
Overall (All Time): #102,211 of 4,157,543Top 3%
34
Patents All Time

Issued Patents All Time

Showing 1–25 of 34 patents

Patent #TitleCo-InventorsDate
D1006331 Hair dryer holder 2023-11-28
11581909 Device and method for wireless transmission Weifeng Tong, Liang Zhang 2023-02-14
11323143 Device and method for wireless transmission Weifeng Tong, Liang Zhang 2022-05-03
11137346 Wavelength-modulable spectrum generator, and system and method for measuring concentration of gas component based thereon Dedong Tang, Xiaoyuan Sun, Xubin Dong, Hongjie Yang 2021-10-05
11049899 Encapsulation structure of image sensing chip, and encapsulation method therefor Zhiming Geng 2021-06-29
10817700 Optical fingerprint recognition chip package and packaging method Guoliang Xie, Hanqing Hu 2020-10-27
10763293 Image sensing chip package and image sensing chip packaging method 2020-09-01
10685917 Semiconductor device and manufacture method of the same 2020-06-16
10680033 Chip packaging method and chip package 2020-06-09
10659297 Negotiation mode processing method and intelligent network device Fei Liu, Dapeng Chen, Jinli Du 2020-05-19
10541186 Chip package and chip packaging method Guoliang Xie, Hanqing Hu 2020-01-21
10541262 Image sensing chip packaging structure and packaging method Zhuowei Wang, Guoliang Xie 2020-01-21
10541264 Package-on-package structure and package-on-package method 2020-01-21
10529758 Packaging method and packaging structure Qiong Yu, Wei-Chung Wang 2020-01-07
10497728 Fingerprint sensing chip packaging method and fingerprint sensing chip package Yuanfei Liu, Hongjun Liu 2019-12-03
10490583 Packaging structure and packaging method Fangyuan Hong 2019-11-26
10418296 Semiconductor chip package structure and packaging method therefor Xianglong Liu, Yuanhao Xu 2019-09-17
10325946 Packaging method and package structure for image sensing chip Zhuowei Wang, Guoliang Xie 2019-06-18
10283483 Packaging method and package structure for image sensing chip Zhuowei Wang, Guoliang Xie 2019-05-07
10276540 Chip packaging method and chip packaging structure Ying Yang, Wei-Chung Wang 2019-04-30
10133907 Fingerprint recognition chip packaging structure and packaging method Qiong Yu, Wei-Chung Wang 2018-11-20
10126151 Wafer-level chip package structure and packaging method Qiong Yu, Wei-Chung Wang 2018-11-13
10108837 Fingerprint recognition chip packaging structure and packaging method Qiong Yu, Wei-Chung Wang 2018-10-23
10096643 Fingerprint recognition chip packaging structure and packaging method Qiong Yu, Wei-Chung Wang 2018-10-09
10090217 Chip packaging method and package structure Qiong Yu, Wei-Chung Wang 2018-10-02