HH

Hanqing Hu

CC China Wafer Level Csp Co.: 2 patents #11 of 26Top 45%
Overall (All Time): #1,896,922 of 4,157,543Top 50%
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Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
10817700 Optical fingerprint recognition chip package and packaging method Zhiqi Wang, Guoliang Xie 2020-10-27
10541186 Chip package and chip packaging method Zhiqi Wang, Guoliang Xie 2020-01-21