YL

Yuanfei Liu

CC China Wafer Level Csp Co.: 1 patents #16 of 26Top 65%
Overall (All Time): #4,152,763 of 4,157,543Top 100%
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Patent #TitleCo-InventorsDate
10497728 Fingerprint sensing chip packaging method and fingerprint sensing chip package Zhiqi Wang, Hongjun Liu 2019-12-03