Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418296 | Semiconductor chip package structure and packaging method therefor | Zhiqi Wang, Xianglong Liu | 2019-09-17 |
| 7005474 | Epoxy polyester, its emulsion and its preparation as well as water-base coatings containing the emusion | Fuchang Liu, Wenlin Liu, Peimin Hou | 2006-02-28 |