Issued Patents All Time
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748162 | Chip to wafer package with top electrodes and method of forming | Junjie Li, Ying Yang, Qiong Yu, Wei-Chung Wang | 2017-08-29 |
| 9601531 | Wafer-level packaging structure for image sensors with packaging cover dike structures corresponding to scribe line regions | Qiong Yu, Wei-Chung Wang | 2017-03-21 |
| 9299735 | Image sensor package structure and method | Qiong Yu, Wei-Chung Wang | 2016-03-29 |
| 9231018 | Wafer level packaging structure for image sensors and wafer level packaging method for image sensors | Qiong Yu, Wei-Chung Wang | 2016-01-05 |
| 8472556 | Amplifier device and predistortion control method | Zhan Shi, Hui Li, Jian Zhou, Gang Sun | 2013-06-25 |
| 8421533 | Adaptive digital predistortion device and method | Gang Sun, Jianmin Zhou, Zhan Shi, Hui Li | 2013-04-16 |
| 8174090 | Packaging structure | Guoqing Yu, Qiuhong Zou, Youjun Wang, Wei-Chung Wang | 2012-05-08 |
| 7781250 | Wafer level chip size package for MEMS devices and method for fabricating the same | Guoqing Yu, Qinqin Xu, Wei-Chung Wang | 2010-08-24 |
| 7755155 | Packaging structure and method for fabricating the same | Guoping YU, Guoqing Yu, Wei-Chung Wang, Quihong Zou | 2010-07-13 |