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Guoping YU

CC China Wafer Level Csp Co.: 1 patents #16 of 26Top 65%
📍 Tongji, CN: #32 of 62 inventorsTop 55%
Overall (All Time): #3,295,420 of 4,157,543Top 80%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7755155 Packaging structure and method for fabricating the same Zhiqi Wang, Guoqing Yu, Wei-Chung Wang, Quihong Zou 2010-07-13