Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272082 | Method and system for constructing bone model, medium and device | Mingjun Fu, Wei Chai, Yuan Zhang, Mingmin Ren, Linshuai He +3 more | 2025-04-08 |
| 12074183 | Semiconductor packaging method and semiconductor package device | — | 2024-08-27 |
| 11990398 | Semiconductor package device having chip substrate with pads around photosensitive region | — | 2024-05-21 |
| 11990432 | Semiconductor packaging method and semiconductor package device | — | 2024-05-21 |
| 11948911 | Semiconductor packaging method and semiconductor package device | — | 2024-04-02 |
| 11948960 | Semiconductor packaging method and semiconductor package device | — | 2024-04-02 |
| 11926709 | Method for recycling waste polyester | Huayu Fang, Enbin Zhu, Dubin Wang, Jincheng Chen, Tianyuan Li +3 more | 2024-03-12 |
| 11655351 | Method for recycling waste polyester with continuous alcoholysis and transesterification | Huayu Fang, Enbin Zhu, Dubin Wang, Jincheng Chen, Tianyuan Li +3 more | 2023-05-23 |
| 11572452 | Method for recycling continuous alcoholysis of waste polyester material | Huayu Fang, Enbin Zhu, Dubin Wang, Jincheng Chen, Tianyuan Li +3 more | 2023-02-07 |
| 8952512 | Wafer-level package structure of light emitting diode and manufacturing method thereof | Junjie Li, Wenbin Wang, Qiuhong Zou, Wei-Chung Wang | 2015-02-10 |
| 8445919 | Wafer-level package structure of light emitting diode and manufacturing method thereof | Junjie Li, Wenbin Wang, Qiuhong Zou, Wei-Chung Wang | 2013-05-21 |
| 8174090 | Packaging structure | Zhiqi Wang, Qiuhong Zou, Youjun Wang, Wei-Chung Wang | 2012-05-08 |
| 7795074 | WLCSP target and method for forming the same | Mingda Shao, Wei-Chung Wang, Hanyu Li, Xiaohua Huang | 2010-09-14 |
| 7781250 | Wafer level chip size package for MEMS devices and method for fabricating the same | Zhiqi Wang, Qinqin Xu, Wei-Chung Wang | 2010-08-24 |
| 7755155 | Packaging structure and method for fabricating the same | Guoping YU, Zhiqi Wang, Wei-Chung Wang, Quihong Zou | 2010-07-13 |
| 7663213 | Wafer level chip size packaged chip device with a double-layer lead structure and method of fabricating the same | Youjun Wang, Qinqin Xu, Qingwei Wang, Wei-Chung Wang | 2010-02-16 |
| 7394152 | Wafer level chip size packaged chip device with an N-shape junction inside and method of fabricating the same | Youjun Wang, Qinqin Xu, Qingwei Wang, Wei-Chung Wang | 2008-07-01 |