Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11687209 | Display method and apparatus for displaying display effects | Chen CHEN, Ran Tao | 2023-06-27 |
| 11640683 | Stroke special effect program file package generating method and apparatus, and stroke special effect generating method and apparatus | Zhanpeng Li | 2023-05-02 |
| 11521389 | Method for generating special effect program file package, method for generating special effect, electronic device, and storage medium | Zhanpeng Li | 2022-12-06 |
| 11461870 | Image processing method and device, and electronic device | Mingyang Huang | 2022-10-04 |
| 11368746 | Method and device for generating special effect program file package, method and device for generating special effect, and electronic device | Zhanpeng Li | 2022-06-21 |
| 11288796 | Image processing method, terminal device, and computer storage medium | Wentao Liu, Chen QIAN, Chen CHEN | 2022-03-29 |
| 11270408 | Method and apparatus for generating special deformation effect program file package, and method and apparatus for generating special deformation effects | Dayu Yue | 2022-03-08 |
| 11113560 | Body contour key point detection methods, apparatuses, and devices | Wentao Liu, Chen QIAN | 2021-09-07 |
| 11037348 | Method and apparatus for displaying business object in video image and electronic device | Jianping Shi, Qing Luan, Lei Wang | 2021-06-15 |
| 7781250 | Wafer level chip size package for MEMS devices and method for fabricating the same | Zhiqi Wang, Guoqing Yu, Wei-Chung Wang | 2010-08-24 |
| 7663213 | Wafer level chip size packaged chip device with a double-layer lead structure and method of fabricating the same | Guoqing Yu, Youjun Wang, Qingwei Wang, Wei-Chung Wang | 2010-02-16 |
| 7394152 | Wafer level chip size packaged chip device with an N-shape junction inside and method of fabricating the same | Guoqing Yu, Youjun Wang, Qingwei Wang, Wei-Chung Wang | 2008-07-01 |