ZG

Zhiming Geng

CC China Wafer Level Csp Co.: 1 patents #16 of 26Top 65%
Overall (All Time): #2,735,531 of 4,157,543Top 70%
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Patent #TitleCo-InventorsDate
11049899 Encapsulation structure of image sensing chip, and encapsulation method therefor Zhiqi Wang 2021-06-29