Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040276 | Device and method of very high density routing used with embedded multi-die interconnect bridge | Robert Alan May, Wei-Lun Kane Jen, Islam A. Salama, Kristof Darmawikarta | 2024-07-16 |
| 12014989 | Device and method of very high density routing used with embedded multi-die interconnect bridge | Robert Alan May, Wei-Lun Kane Jen, Islam A. Salama, Kristof Darmawikarta | 2024-06-18 |
| 11769719 | Dual trace thickness for single layer routing | Wei-Lun Kane Jen, Cheng Xu, Liwei Cheng, Andrew J. Brown, Yikang Deng | 2023-09-26 |
| 11508662 | Device and method of very high density routing used with embedded multi-die interconnect bridge | Robert Alan May, Wei-Lun Kane Jen, Islam A. Salama, Kristof Darmawikarta | 2022-11-22 |
| 11495555 | Magnetic bilayer structure for a cored or coreless semiconductor package | Yikang Deng, Andrew J. Brown, Junnan Zhao | 2022-11-08 |
| 11276618 | Bi-layer prepreg for reduced dielectric thickness | Andrew J. Brown | 2022-03-15 |
| 10741947 | Plated through hole socketing coupled to a solder ball to engage with a pin | Amruthavalli Pallavi Alur, Siddharth K. Alur, Liwei Cheng, Lauren A. Link, Sai Vadlamani +1 more | 2020-08-11 |
| 10734358 | Multi-packaging for single-socketing | Amruthavalli Pallavi Alur, Arun Chandrasekhar, Shawna M. Liff | 2020-08-04 |
| 10535590 | Multi-layer solder resists for semiconductor device package surfaces and methods of assembling same | — | 2020-01-14 |