Issued Patents All Time
Showing 25 most recent of 196 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424543 | Selective interconnects in back-end-of-line metallization stacks of integrated circuitry | Adel A. Elsherbini, Johanna M. Swan | 2025-09-23 |
| 12424589 | Contiguous shield structures in microelectronic assemblies having hybrid bonding | Beomseok Choi, Adel A. Elsherbini, Han Wui Then, Johanna M. Swan | 2025-09-23 |
| 12417978 | Microelectronic assemblies having backside die-to-package interconnects | Adel A. Elsherbini, Kimin Jun, Johanna M. Swan, Han Wui Then | 2025-09-16 |
| 12412881 | Microelectronic assemblies | Adel A. Elsherbini, Johanna M. Swan, Arun Chandrasekhar | 2025-09-09 |
| 12406962 | Power delivery through capacitor-dies in a multi-layered microelectronic assembly | Adel A. Elsherbini, William J. Lambert, Krishna Bharath, Nicolas Butzen, Georgios Dogiamis +4 more | 2025-09-02 |
| 12406914 | Ultra-thin, hyper-density semiconductor packages | Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Sanka Ganesan +4 more | 2025-09-02 |
| 12389728 | Micro-LED displays including solder structures and methods | Thomas L. Sounart, Khaled Ahmed, Anup Pancholi | 2025-08-12 |
| 12381182 | Direct bonding in microelectronic assemblies | Feras Eid, Adel A. Elsherbini, Aleksandar Aleksov, Johanna M. Swan | 2025-08-05 |
| 12362284 | Composite interposer structure and method of providing same | Adel A. Elsherbini, Johanna M. Swan, Gerald Pasdast | 2025-07-15 |
| 12341114 | Microelectronic assemblies having a hybrid bonded interposer for die-to-die fan-out scaling | Georgios Dogiamis, Qiang Yu, Adel A. Elsherbini | 2025-06-24 |
| 12327827 | Microelectronic assemblies | Adel A. Elsherbini, Johanna M. Swan, Arun Chandrasekhar | 2025-06-10 |
| 12327775 | Thermal performance in hybrid bonded 3D die stacks | Feras Eid, Adel A. Elsherbini, Johanna M. Swan, Aleksandar Aleksov, Julien Sebot | 2025-06-10 |
| 12327801 | Robust mold integrated substrate | Jimin Yao, Kyle Yazzie | 2025-06-10 |
| 12315794 | Skip level vias in metallization layers for integrated circuit devices | Adel A. Elsherbini, Mauro J. Kobrinsky, Johanna M. Swan, Gerald Pasdast, Sathya Narasimman Tiagaraj | 2025-05-27 |
| 12315840 | Microelectronic assemblies | Adel A. Elsherbini, Johanna M. Swan | 2025-05-27 |
| 12300579 | Liquid cooled interposer for integrated circuit stack | Georgios Dogiamis, Qiang Yu, Feras Eid, Adel A. Elsherbini, Kimin Jun +1 more | 2025-05-13 |
| 12300666 | Microelectronic assemblies with communication networks | Adel A. Elsherbini, Amr Elshazly, Arun Chandrasekhar, Johanna M. Swan | 2025-05-13 |
| 12300626 | Microelectronic assemblies | Adel A. Elsherbini, Johanna M. Swan | 2025-05-13 |
| 12288746 | Skip level vias in metallization layers for integrated circuit devices | Adel A. Elsherbini, Mauro J. Kobrinsky, Johanna M. Swan, Gerald Pasdast, Sathya Narasimman Tiagaraj | 2025-04-29 |
| 12272656 | Heterogeneous nested interposer package for IC chips | Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman, Srinivas V. Pietambaram, Bharat P. Penmecha | 2025-04-08 |
| 12266682 | Capacitors and resistors at direct bonding interfaces in microelectronic assemblies | Adel A. Elsherbini, Mohammad Enamul Kabir, Zhiguo Qian, Gerald Pasdast, Kimin Jun +3 more | 2025-04-01 |
| 12266840 | Waveguide interconnects for semiconductor packages and related methods | Georgios Dogiamis, Johanna M. Swan, Adel A. Elsherbini, Beomseok Choi, Qiang Yu | 2025-04-01 |
| 12224261 | Mixed hybrid bonding structures and methods of forming the same | Adel A. Elsherbini, Johanna M. Swan, Nagatoshi Tsunoda, Jimin Yao | 2025-02-11 |
| 12205902 | High-density interconnects for integrated circuit packages | Veronica Strong, Aleksandar Aleksov, Henning Braunisch, Brandon M. Rawlings, Johanna M. Swan | 2025-01-21 |
| 12199018 | Direct bonding in microelectronic assemblies | Adel A. Elsherbini, Krishna Bharath, Han Wui Then, Kimin Jun, Aleksandar Aleksov +3 more | 2025-01-14 |