Issued Patents All Time
Showing 26–50 of 196 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12199067 | Scalable embedded silicon bridge via pillars in lithographically defined vias, and methods of making same | Adel A. Elsherbini, Henning Braunisch, Javier Soto Gonzalez | 2025-01-14 |
| 12199018 | Direct bonding in microelectronic assemblies | Adel A. Elsherbini, Krishna Bharath, Han Wui Then, Kimin Jun, Aleksandar Aleksov +3 more | 2025-01-14 |
| 12199048 | Heterogeneous nested interposer package for IC chips | Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman, Srinivas V. Pietambaram, Bharat P. Penmecha | 2025-01-14 |
| 12183961 | Methods for conductively coating millimeter waveguides | Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Sasha N. Oster, Adel A. Elsherbini +3 more | 2024-12-31 |
| 12176323 | Microelectronic assemblies | Adel A. Elsherbini, Henning Braunisch, Aleksandar Aleksov, Johanna M. Swan, Patrick Morrow +3 more | 2024-12-24 |
| 12165962 | Hermetic sealing structures in microelectronic assemblies having direct bonding | Aleksandar Aleksov, Mohammad Enamul Kabir, Adel A. Elsherbini, Johanna M. Swan, Feras Eid | 2024-12-10 |
| 12142510 | Carrier for microelectronic assemblies having direct bonding | Johanna M. Swan, Adel A. Elsherbini, Michael Baker, Aleksandar Aleksov, Feras Eid | 2024-11-12 |
| 12119317 | Singulation of microelectronic components with direct bonding interfaces | Bhaskar Jyoti Krishnatreya, Nagatoshi Tsunoda, Sairam Agraharam | 2024-10-15 |
| 12113048 | Microelectronic assemblies | Adel A. Elsherbini, Feras Eid, Johanna M. Swan | 2024-10-08 |
| 12107060 | Microelectronic assemblies with inductors in direct bonding regions | Adel A. Elsherbini, Zhiguo Qian, Gerald Pasdast, Mohammad Enamul Kabir, Han Wui Then +5 more | 2024-10-01 |
| 12080652 | Microelectronic assemblies with communication networks | Adel A. Elsherbini, Amr Elshazly, Arun Chandrasekhar, Johanna M. Swan | 2024-09-03 |
| 12062631 | Microelectronic assemblies with inductors in direct bonding regions | Adel A. Elsherbini, Krishna Bharath, Kevin P. O'Brien, Kimin Jun, Han Wui Then +5 more | 2024-08-13 |
| 12057402 | Direct bonding in microelectronic assemblies | Aleksandar Aleksov, Adel A. Elsherbini, Johanna M. Swan, Feras Eid, Randy B. Osborne +1 more | 2024-08-06 |
| 12014990 | Composite interposer structure and method of providing same | Adel A. Elsherbini, Johanna M. Swan, Gerald Pasdast | 2024-06-18 |
| 11990448 | Direct bonding in microelectronic assemblies | Feras Eid, Adel A. Elsherbini, Aleksandar Aleksov, Johanna M. Swan | 2024-05-21 |
| 11984439 | Microelectronic assemblies | Adel A. Elsherbini, Georgios Dogiamis, Zhiguo Qian, Johanna M. Swan | 2024-05-14 |
| 11967580 | Microelectronic assemblies with communication networks | Adel A. Elsherbini, Amr Elshazly, Arun Chandrasekhar, Johanna M. Swan | 2024-04-23 |
| 11955434 | Ultra small molded module integrated with die by module-on-wafer assembly | Yoshihiro Tomita, Eric J. Li, Javier A. Falcon, Joshua D. Heppner | 2024-04-09 |
| 11916020 | Microelectronic assemblies with communication networks | Adel A. Elsherbini, Amr Elshazly, Arun Chandrasekhar, Johanna M. Swan | 2024-02-27 |
| 11916006 | Microelectronic assemblies having an integrated voltage regulator chiplet | Adel A. Elsherbini, Kaladhar Radhakrishnan, Krishna Bharath, Johanna M. Swan | 2024-02-27 |
| 11901330 | Microelectronic assemblies | Adel A. Elsherbini, Johanna M. Swan, Arun Chandrasekhar | 2024-02-13 |
| 11881457 | Semiconductor packaging with high density interconnects | Adel A. Elsherbini, Johanna M. Swan, Henning Braunisch, Krishna Bharath, Javier Soto Gonzalez +1 more | 2024-01-23 |
| 11870163 | Antenna package using ball attach array to connect antenna and base substrates | Jimin Yao, Robert L. Sankman, Sri Chaitra Jyotsna Chavali, William J. Lambert, Zhichao Zhang | 2024-01-09 |
| 11830831 | Semiconductor package including a modular side radiating waveguide launcher | Georgios Dogiamis, Sasha N. Oster, Johanna M. Swan, Adel A. Elsherbini, Telesphor Kamgaing +1 more | 2023-11-28 |
| 11824018 | Heterogeneous nested interposer package for IC chips | Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman, Srinivas V. Pietambaram, Bharat P. Penmecha | 2023-11-21 |