| 12506059 |
Vertically spaced intra-level interconnect line metallization for integrated circuit devices |
Keh-I Lin, Sukru YEMENICIOGLU, Richard E. Schenker, Mauro J. Kobrinsky |
2025-12-23 |
|
| 12446204 |
SRAM with P-type access transistors and complementary field-effect transistor technology |
Charles Augustine, Seenivasan Subramaniam, Muhammad M. Khellah |
2025-10-14 |
|
| 12369399 |
Gate-to-gate isolation for stacked transistor architecture via selective dielectric deposition structure |
Willy Rachmady, Sudipto Naskar, Cheng-Ying Huang, Gilbert Dewey, Marko Radosavljevic +2 more |
2025-07-22 |
|
| 12342614 |
Asymmetric gate structures and contacts for stacked transistors |
Cheng-Ying Huang, Arunshankar Venkataraman, Sean T. Ma, Willy Rachmady, Nicole K. Thomas +2 more |
2025-06-24 |
|
| 12310044 |
Vertical integration scheme and circuit elements architecture for area scaling of semiconductor devices |
Rishabh Mehandru, Ranjith Kumar, Cory E. Weber, Seiyon Kim, Stephen M. Cea +1 more |
2025-05-20 |
|
| 12288810 |
Backside contact structures and fabrication for metal on both sides of devices |
Rishabh Mehandru, Aaron D. Lilak, Kimin Jun |
2025-04-29 |
|
| 12255137 |
Sideways vias in isolation areas to contact interior layers in stacked devices |
Ehren Mannebach, Aaron D. Lilak, Hui Jae Yoo, Anh Phan, Willy Rachmady +3 more |
2025-03-18 |
|
| 12224202 |
Forming an oxide volume within a fin |
Cheng-Ying Huang, Gilbert Dewey, Jack T. Kavalieros, Aaron D. Lilak, Ehren Mannebach +3 more |
2025-02-11 |
|
| 12199143 |
Gate-all-around integrated circuit structures having removed substrate |
Biswajeet Guha, Mauro J. Kobrinsky, Oleg Golonzka, Tahir Ghani |
2025-01-14 |
|
| 12176323 |
Microelectronic assemblies |
Adel A. Elsherbini, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan +3 more |
2024-12-24 |
$17,261,000 |
| 12148806 |
Stacked source-drain-gate connection and process for forming such |
Ehren Mannebach, Aaron D. Lilak, Hui Jae Yoo, Anh Phan, Willy Rachmady +2 more |
2024-11-19 |
$25,575,000 |
| 12107085 |
Interconnect techniques for electrically connecting source/drain regions of stacked transistors |
Aaron D. Lilak, Gilbert Dewey, Cheng-Ying Huang, Christopher J. Jezewski, Ehren Mannebach +4 more |
2024-10-01 |
$20,560,000 |
| 12100623 |
Vertically stacked finFETs and shared gate patterning |
Aaron D. Lilak, Sean T. Ma, Justin R. Weber, Rishabh Mehandru, Stephen M. Cea +1 more |
2024-09-24 |
$33,787,000 |
| 12100762 |
Wrap-around source/drain method of making contacts for backside metals |
Kimin Jun, Il-Seok Son, Donald W. Nelson |
2024-09-24 |
$33,787,000 |
| 12100761 |
Wrap-around source/drain method of making contacts for backside metals |
Kimin Jun, Il-Seok Son, Donald W. Nelson |
2024-09-24 |
$33,787,000 |
| 12080605 |
Backside contacts for semiconductor devices |
Aaron D. Lilak, Ehren Mannebach, Anh Phan, Richard E. Schenker, Stephanie A. Bojarski +4 more |
2024-09-03 |
$14,017,000 |
| 12057494 |
Stacked transistors |
Rishabh Mehandru, Aaron D. Lilak |
2024-08-06 |
$17,070,000 |
| 12051723 |
PN-body-tied field effect transistors |
Aaron D. Lilak, Kerryann Marrietta Foley, Sayed Hasan, Willy Rachmady |
2024-07-30 |
$27,313,000 |
| 12020929 |
Epitaxial layer with substantially parallel sides |
Cheng-Ying Huang, Gilbert Dewey, Jack T. Kavalieros, Aaron D. Lilak, Ehren Mannebach +3 more |
2024-06-25 |
$22,163,000 |
| 11996411 |
Stacked forksheet transistors |
Cheng-Ying Huang, Gilbert Dewey, Anh Phan, Nicole K. Thomas, Urusa Alaan +8 more |
2024-05-28 |
$30,739,000 |
| 11996362 |
Integrated circuit device with crenellated metal trace layout |
Mauro J. Kobrinsky, Mark Bohr, Tahir Ghani, Rishabh Mehandru, Ranjith Kumar |
2024-05-28 |
$30,739,000 |
| 11990899 |
Multi-level spin logic |
Sasikanth Manipatruni, Ian A. Young, Dmitri E. Nikonov, Uygar E. Avci, Anurag Chaudhry |
2024-05-21 |
$18,840,000 |
| 11948874 |
Vertically spaced intra-level interconnect line metallization for integrated circuit devices |
Kevin Lin, Sukru YEMENICIOGLU, Richard E. Schenker, Mauro J. Kobrinsky |
2024-04-02 |
$34,819,000 |
| 11948831 |
Apparatus with multi-wafer based device and method for forming such |
Anup Pancholi, Prashant Majhi, Paul B. Fischer |
2024-04-02 |
$34,819,000 |
| 11942526 |
Integrated circuit contact structures |
Glenn A. Glass, Anand S. Murthy, Rishabh Mehandru |
2024-03-26 |
$33,708,000 |
