Issued Patents All Time
Showing 25 most recent of 75 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394716 | Integrated circuit interconnect structures with graphene cap | Carl Naylor, Jasmeet S. Chawla, Matthew V. Metz, Sean King, Ramanan V. Chebiam +5 more | 2025-08-19 |
| 12354956 | Cobalt based interconnects and methods of fabrication thereof | Tejaswi K. Indukuri, Ramanan V. Chebiam, Colin T. Carver | 2025-07-08 |
| 12328927 | Low resistance and reduced reactivity approaches for fabricating contacts and the resulting structures | Gilbert Dewey, Nazila Haratipour, Siddharth Chouksey, Arnab Sen Gupta, I-Cheng Tung +2 more | 2025-06-10 |
| 12322699 | Method of forming high density, high shorting margin, and low capacitance interconnects by alternating recessed trenches | Jasmeet S. Chawla | 2025-06-03 |
| 12261114 | Metallization stacks with self-aligned staggered metal lines | Elijah V. Karpov, Manish Chandhok, Nafees Kabir, Matthew V. Metz | 2025-03-25 |
| 12211794 | Integrated circuits and methods for forming thin film crystal layers | Carl Naylor, Ashish Agrawal, Kevin Lin, Abhishek A. Sharma, Mauro J. Kobrinsky +1 more | 2025-01-28 |
| 12170319 | Dual contact process with stacked metal layers | Kevin T. Cook, Anand S. Murthy, Gilbert Dewey, Nazila Haratipour, Ralph T. Troeger +1 more | 2024-12-17 |
| 12165917 | Integrated circuit interconnect structures with ultra-thin metal chalcogenide barrier materials | Carl Naylor | 2024-12-10 |
| 12107085 | Interconnect techniques for electrically connecting source/drain regions of stacked transistors | Aaron D. Lilak, Gilbert Dewey, Cheng-Ying Huang, Ehren Mannebach, Rishabh Mehandru +4 more | 2024-10-01 |
| 12107170 | Transistor channel passivation with 2D crystalline material | Carl Naylor, Abhishek A. Sharma, Mauro J. Kobrinsky, Urusa Alaan, Justin R. Weber | 2024-10-01 |
| 12033896 | Isolation wall stressor structures to improve channel stress and their methods of fabrication | Aaron D. Lilak, Willy Rachmady, Rishabh Mehandru, Gilbert Dewey, Anh Phan | 2024-07-09 |
| 12027458 | Subtractively patterned interconnect structures for integrated circuits | Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Jiun-Ruey Chen +10 more | 2024-07-02 |
| 11888034 | Transistors with metal chalcogenide channel materials | Abhishek A. Sharma, Ashish Agarwal, Urusa Alaan, Kevin Lin, Carl Naylor | 2024-01-30 |
| 11869894 | Metallization structures for stacked device connectivity and their methods of fabrication | Aaron D. Lilak, Anh Phan, Patrick Morrow, Willy Rachmady, Gilbert Dewey +6 more | 2024-01-09 |
| 11862563 | Cobalt based interconnects and methods of fabrication thereof | Tejaswi K. Indukuri, Ramanan V. Chebiam, Colin T. Carver | 2024-01-02 |
| 11830768 | Integrated circuits with line breaks and line bridges within a single interconnect level | Kevin Lin | 2023-11-28 |
| 11830788 | Integrated circuits and methods for forming integrated circuits | Carl Naylor, Ashish Agrawal, Urusa Alaan, Mauro J. Kobrinsky, Kevin Lin +1 more | 2023-11-28 |
| 11749560 | Cladded metal interconnects | Thomas Marieb, Zhiyong Ma, Miriam Reshotko, Flavio Griggio, Rahim Kasim +1 more | 2023-09-05 |
| 11742346 | Interconnect techniques for electrically connecting source/drain regions of stacked transistors | Aaron D. Lilak, Gilbert Dewey, Cheng-Ying Huang, Ehren Mannebach, Rishabh Mehandru +4 more | 2023-08-29 |
| 11670588 | Selectable vias for back end of line interconnects | Ashish Agrawal, Kevin Lin, Abhishek A. Sharma, Carl Naylor, Urusa Alaan | 2023-06-06 |
| 11664305 | Staggered lines for interconnect performance improvement and processes for forming such | Kevin Lin, Manish Chandhok, Miriam Reshotko, Eungnak Han, Gurpreet Singh +2 more | 2023-05-30 |
| 11652067 | Methods of forming substrate interconnect structures for enhanced thin seed conduction | Radek P. Chalupa, Flavio Griggio, Inane Meric, Jiun-Chan Yang | 2023-05-16 |
| 11637185 | Contact stacks to reduce hydrogen in semiconductor devices | Justin R. Weber, Harold W. Kennel, Abhishek A. Sharma, Matthew V. Metz, Tahir Ghani +4 more | 2023-04-25 |
| 11626451 | Magnetic memory device with ruthenium diffusion barrier | Emily Walker, Carl Naylor, Kaan Oguz, Kevin Lin, Tanay Gosavi +6 more | 2023-04-11 |
| 11557536 | Integrated circuits (IC's) with electro-migration (EM)—resistant segments in an interconnect level | Kevin Lin, Manish Chandhok | 2023-01-17 |