| 12482744 |
Subtractively patterned interconnect structures for integrated circuits |
Keh-I Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Jianxin Chen +10 more |
2025-11-25 |
|
| 12394716 |
Integrated circuit interconnect structures with graphene cap |
Carl Naylor, Jasmeet S. Chawla, Matthew V. Metz, Sean King, Ramanan V. Chebiam +5 more |
2025-08-19 |
|
| 12354956 |
Cobalt based interconnects and methods of fabrication thereof |
Tejaswi K. Indukuri, Ramanan V. Chebiam, Colin T. Carver |
2025-07-08 |
|
| 12328927 |
Low resistance and reduced reactivity approaches for fabricating contacts and the resulting structures |
Gilbert Dewey, Nazila Haratipour, Siddharth Chouksey, Arnab Sen Gupta, I-Cheng Tung +2 more |
2025-06-10 |
|
| 12322699 |
Method of forming high density, high shorting margin, and low capacitance interconnects by alternating recessed trenches |
Jasmeet S. Chawla |
2025-06-03 |
|
| 12261114 |
Metallization stacks with self-aligned staggered metal lines |
Elijah V. Karpov, Manish Chandhok, Nafees Kabir, Matthew V. Metz |
2025-03-25 |
|
| 12211794 |
Integrated circuits and methods for forming thin film crystal layers |
Carl Naylor, Ashish Agrawal, Kevin Lin, Abhishek A. Sharma, Mauro J. Kobrinsky +1 more |
2025-01-28 |
|
| 12170319 |
Dual contact process with stacked metal layers |
Kevin T. Cook, Anand S. Murthy, Gilbert Dewey, Nazila Haratipour, Ralph T. Troeger +1 more |
2024-12-17 |
$33,648,000 |
| 12165917 |
Integrated circuit interconnect structures with ultra-thin metal chalcogenide barrier materials |
Carl Naylor |
2024-12-10 |
$13,394,000 |
| 12107085 |
Interconnect techniques for electrically connecting source/drain regions of stacked transistors |
Aaron D. Lilak, Gilbert Dewey, Cheng-Ying Huang, Ehren Mannebach, Rishabh Mehandru +4 more |
2024-10-01 |
$20,560,000 |
| 12107170 |
Transistor channel passivation with 2D crystalline material |
Carl Naylor, Abhishek A. Sharma, Mauro J. Kobrinsky, Urusa Alaan, Justin R. Weber |
2024-10-01 |
$20,560,000 |
| 12033896 |
Isolation wall stressor structures to improve channel stress and their methods of fabrication |
Aaron D. Lilak, Willy Rachmady, Rishabh Mehandru, Gilbert Dewey, Anh Phan |
2024-07-09 |
$24,938,000 |
| 12027458 |
Subtractively patterned interconnect structures for integrated circuits |
Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Jiun-Ruey Chen +10 more |
2024-07-02 |
$27,114,000 |
| 11888034 |
Transistors with metal chalcogenide channel materials |
Abhishek A. Sharma, Ashish Agarwal, Urusa Alaan, Kevin Lin, Carl Naylor |
2024-01-30 |
$30,721,000 |
| 11869894 |
Metallization structures for stacked device connectivity and their methods of fabrication |
Aaron D. Lilak, Anh Phan, Patrick Morrow, Willy Rachmady, Gilbert Dewey +6 more |
2024-01-09 |
$30,329,000 |
| 11862563 |
Cobalt based interconnects and methods of fabrication thereof |
Tejaswi K. Indukuri, Ramanan V. Chebiam, Colin T. Carver |
2024-01-02 |
|
| 11830788 |
Integrated circuits and methods for forming integrated circuits |
Carl Naylor, Ashish Agrawal, Urusa Alaan, Mauro J. Kobrinsky, Kevin Lin +1 more |
2023-11-28 |
$31,872,000 |
| 11830768 |
Integrated circuits with line breaks and line bridges within a single interconnect level |
Kevin Lin |
2023-11-28 |
$31,872,000 |
| 11749560 |
Cladded metal interconnects |
Thomas Marieb, Zhiyong Ma, Miriam Reshotko, Flavio Griggio, Rahim Kasim +1 more |
2023-09-05 |
$19,899,000 |
| 11742346 |
Interconnect techniques for electrically connecting source/drain regions of stacked transistors |
Aaron D. Lilak, Gilbert Dewey, Cheng-Ying Huang, Ehren Mannebach, Rishabh Mehandru +4 more |
2023-08-29 |
$19,273,000 |
| 11670588 |
Selectable vias for back end of line interconnects |
Ashish Agrawal, Kevin Lin, Abhishek A. Sharma, Carl Naylor, Urusa Alaan |
2023-06-06 |
$21,341,000 |
| 11664305 |
Staggered lines for interconnect performance improvement and processes for forming such |
Kevin Lin, Manish Chandhok, Miriam Reshotko, Eungnak Han, Gurpreet Singh +2 more |
2023-05-30 |
$16,378,000 |
| 11652067 |
Methods of forming substrate interconnect structures for enhanced thin seed conduction |
Radek P. Chalupa, Flavio Griggio, Inane Meric, Jiun-Chan Yang |
2023-05-16 |
$11,130,000 |
| 11637185 |
Contact stacks to reduce hydrogen in semiconductor devices |
Justin R. Weber, Harold W. Kennel, Abhishek A. Sharma, Matthew V. Metz, Tahir Ghani +4 more |
2023-04-25 |
$19,274,000 |
| 11626451 |
Magnetic memory device with ruthenium diffusion barrier |
Emily Walker, Carl Naylor, Kaan Oguz, Kevin Lin, Tanay Gosavi +6 more |
2023-04-11 |
$27,486,000 |
