Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431327 | Stroboscopic electron-beam signal image mapping | Xianghong Tong, Martin Von Haartman, Wen-Hsien Chuang, Hyuk-Ju Ryu, Prasoon Joshi +6 more | 2025-09-30 |
| 12234611 | Wall-cloth with a laminated core coated through infiltration and a method for preparing the same | — | 2025-02-25 |
| 11749560 | Cladded metal interconnects | Thomas Marieb, Miriam Reshotko, Christopher J. Jezewski, Flavio Griggio, Rahim Kasim +1 more | 2023-09-05 |
| 9123724 | Methods of forming secured metal gate antifuse structures | Xianghong Tong, Zhanping Chen, Walid M. Hafez, Sarvesh H. Kulkarni, Kevin X. Zhang +2 more | 2015-09-01 |
| 8618613 | Methods of forming secured metal gate antifuse structures | Xianghong Tong, Zhanping Chen, Walid M. Hafez, Sarvesh H. Kulkarni, Kevin X. Zhang +2 more | 2013-12-31 |
| 8242831 | Tamper resistant fuse design | Xianghong Tong, Zhanping Chen, Kevin X. Zhang, Kevin D. Johnson, Jun He | 2012-08-14 |
| 7679145 | Transistor performance enhancement using engineered strains | Jun He, Jose Maiz, Mark Bohr, Martin D. Giles, Guanghai Xu | 2010-03-16 |
| 6878465 | Under bump metallurgy for Lead-Tin bump over copper pad | Peter K. Moon, Madhav Datta | 2005-04-12 |
| 6740427 | Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making same | Madhav Datta, Dave Emory, Tzeun-luh Huang, Subhash M. Joshi, Christine A. King +4 more | 2004-05-25 |
| 6703069 | Under bump metallurgy for lead-tin bump over copper pad | Peter K. Moon, Madhav Datta | 2004-03-09 |