Issued Patents All Time
Showing 25 most recent of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10037956 | Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same | Dave Emory, Subhash M. Joshi, Susanne Menezes, Doowon Suh | 2018-07-31 |
| 8952550 | Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same | Dave Emory, Subhash M. Joshi, Susanne Menezes, Doowon Suh | 2015-02-10 |
| 8299604 | Bonded metal and ceramic plates for thermal management of optical and electronic devices | Mark McMaster | 2012-10-30 |
| 8254422 | Microheat exchanger for laser diode cooling | Brandon Leong, Mark McMaster | 2012-08-28 |
| 7836597 | Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system | Mark McMaster, Rick Brewer, Peng Zhou, Paul Tsao, Girish Upadhaya +1 more | 2010-11-23 |
| 7250678 | Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same | Dave Emory, Subhash M. Joshi, Susanne Menezes, Doowon Suh | 2007-07-31 |
| 7196001 | Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same | Dave Emory, Subhash M. Joshi, Susanne Menezes, Doowon Suh | 2007-03-27 |
| 6977224 | Method of electroless introduction of interconnect structures | Valery M. Dubin, Christopher D. Thomas, Paul McGregor | 2005-12-20 |
| 6917106 | Selective ball-limiting metallurgy etching processes for fabrication of electroplated tin bumps | — | 2005-07-12 |
| 6878465 | Under bump metallurgy for Lead-Tin bump over copper pad | Peter K. Moon, Zhiyong Ma | 2005-04-12 |
| 6853076 | Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same | Dave Emory, Subhash M. Joshi, Susanne Menezes, Doowon Suh | 2005-02-08 |
| 6750133 | Selective ball-limiting metallurgy etching processes for fabrication of electroplated tin bumps | — | 2004-06-15 |
| 6740427 | Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making same | Dave Emory, Tzeun-luh Huang, Subhash M. Joshi, Christine A. King, Zhiyong Ma +4 more | 2004-05-25 |
| 6703069 | Under bump metallurgy for lead-tin bump over copper pad | Peter K. Moon, Zhiyong Ma | 2004-03-09 |
| 6696758 | Interconnect structures and a method of electroless introduction of interconnect structures | Valery M. Dubin, Christopher D. Thomas, Paul McGregor | 2004-02-24 |
| 6656750 | Method for testing chips on flat solder bumps | Peter A. Gruber, Judith M. Rubino, Carlos J. Sambucetti, George F. Walker | 2003-12-02 |
| 6258703 | Reflow of low melt solder tip C4's | John M. Cotte, Sung Kwon Kang | 2001-07-10 |
| 6238589 | Methods for monitoring components in the TiW etching bath used in the fabrication of C4s | Emanuel I. Cooper, Thomas Edward Dinan, Thomas S. Kanarsky, Michael B. Pike, Ravindra V. Shenoy | 2001-05-29 |
| 6228246 | Removal of metal skin from a copper-Invar-copper laminate | Raymond T. Galasco, Lawrence P. Lehman, Roy H. Magnuson, Robin A. Susko, Robert D. Topa | 2001-05-08 |
| 6224690 | Flip-Chip interconnections using lead-free solders | Panayotis Andricacos, Hariklia Deligianni, Wilma Jean Horkans, Sung Kwon Kang, Keith Kwietniak +4 more | 2001-05-01 |
| 6103096 | Apparatus and method for the electrochemical etching of a wafer | Daniel C. Edelstein, Cyprian Emeka Uzoh | 2000-08-15 |
| 6030728 | High performance lithium polymer electrolyte battery | John M. Cotte | 2000-02-29 |
| 5989751 | High energy density, flexible lithium primary batteries | John M. Cotte | 1999-11-23 |
| 5939223 | Lithium polymer electrolyte battery for sub-ambient temperature applications | John M. Cotte, Ravindra V. Shenoy | 1999-08-17 |
| 5937320 | Barrier layers for electroplated SnPb eutectic solder joints | Panayotis Andricacos, Wilma Jean Horkans, Sung Kwon Kang, Keith Kwietniak | 1999-08-10 |