Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11305040 | Dialysis system and methods | Michael E. Hogard, Gopi Lingam, Dean Hu, Balaji Maniam, James Ritson +2 more | 2022-04-19 |
| 9579440 | Dialysis system and methods | Michael E. Hogard, Gopi Lingam, Dean Hu, Balaji Maniam, James Ritson +2 more | 2017-02-28 |
| 9504777 | Dialysis system and methods | Michael E. Hogard, Gopi Lingam, Dean Hu, Balaji Maniam, James Ritson +2 more | 2016-11-29 |
| 9402945 | Dialysis system and methods | Michael E. Hogard, Gopi Lingam, Dean Hu, Balaji Maniam, James Ritson +2 more | 2016-08-02 |
| 8496588 | Procedures for an ultrasonic arc scanning apparatus | George J. Eilers, J. David Stienmier, Wes Weber, Eric Osmann, Randy P. Rasmussen +1 more | 2013-07-30 |
| 7438794 | Method of copper electroplating to improve gapfill | David Jentz, Ramesh Viswanathan, Valery M. Dubin, Rajiv Rastogi | 2008-10-21 |
| 7220674 | Copper alloys for interconnections having improved electromigration characteristics and methods of making same | Thomas Marieb, Carolyn Block, Shu Jin | 2007-05-22 |
| 6977220 | Copper alloys for interconnections having improved electromigration characteristics and methods of making same | Thomas Marieb, Carolyn Block, Shu Jin | 2005-12-20 |
| 6977224 | Method of electroless introduction of interconnect structures | Valery M. Dubin, Christopher D. Thomas, Madhav Datta | 2005-12-20 |
| 6800554 | Copper alloys for interconnections having improved electromigration characteristics and methods of making same | Thomas Marieb, Carolyn Block, Shu Jin | 2004-10-05 |
| 6794755 | Surface alteration of metal interconnect in integrated circuits for electromigration and adhesion improvement | Jose Maiz, Xiaorong Morrow, Thomas Marieb, Carolyn Block, Jihperng Leu +2 more | 2004-09-21 |
| 6696758 | Interconnect structures and a method of electroless introduction of interconnect structures | Valery M. Dubin, Christopher D. Thomas, Madhav Datta | 2004-02-24 |