Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
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Paul McGregor — 12 Patents

Intel: 7 patents #5,443 of 30,777Top 20%
OMOutset Medical: 4 patents #7 of 38Top 20%
ARArcscan: 1 patents #10 of 20Top 50%
Golden, CO: #110 of 1,256 inventorsTop 9%
Colorado: #3,808 of 40,980 inventorsTop 10%
Overall (All Time): #396,045 of 4,157,543Top 10%
12 Patents All Time
Paul McGregor has been granted 12 US patents while listed as an inventor at Intel. The first was granted in 2004 and the most recent in April 2022. Paul McGregor ranks #396,045 of 4,157,543 US inventors in our database (top 9.5%). Patent records list Paul McGregor in Golden, CO, US.

Issued Patents All Time

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
11305040 Dialysis system and methods Michael E. Hogard, Gopi Lingam, Dean Hu, Balaji Maniam, James Ritson +2 more 2022-04-19 $22,998,000
9579440 Dialysis system and methods Michael E. Hogard, Gopi Lingam, Dean Hu, Balaji Maniam, James Ritson +2 more 2017-02-28
9504777 Dialysis system and methods Michael E. Hogard, Gopi Lingam, Dean Hu, Balaji Maniam, James Ritson +2 more 2016-11-29
9402945 Dialysis system and methods Michael E. Hogard, Gopi Lingam, Dean Hu, Balaji Maniam, James Ritson +2 more 2016-08-02
8496588 Procedures for an ultrasonic arc scanning apparatus George J. Eilers, J. David Stienmier, Wes Weber, Eric Osmann, Randy P. Rasmussen +1 more 2013-07-30
7438794 Method of copper electroplating to improve gapfill David Jentz, Ramesh Viswanathan, Valery M. Dubin, Rajiv Rastogi 2008-10-21 $17,085,000
7220674 Copper alloys for interconnections having improved electromigration characteristics and methods of making same Thomas Marieb, Carolyn Block, Shu Jin 2007-05-22 $18,006,000
6977220 Copper alloys for interconnections having improved electromigration characteristics and methods of making same Thomas Marieb, Carolyn Block, Shu Jin 2005-12-20 $37,307,000
6977224 Method of electroless introduction of interconnect structures Valery M. Dubin, Christopher D. Thomas, Madhav Datta 2005-12-20 $37,307,000
6800554 Copper alloys for interconnections having improved electromigration characteristics and methods of making same Thomas Marieb, Carolyn Block, Shu Jin 2004-10-05 $22,015,000
6794755 Surface alteration of metal interconnect in integrated circuits for electromigration and adhesion improvement Jose Maiz, Xiaorong Morrow, Thomas Marieb, Carolyn Block, Jihperng Leu +2 more 2004-09-21 $17,403,000
6696758 Interconnect structures and a method of electroless introduction of interconnect structures Valery M. Dubin, Christopher D. Thomas, Madhav Datta 2004-02-24 $44,165,000