| 11749560 |
Cladded metal interconnects |
Zhiyong Ma, Miriam Reshotko, Christopher J. Jezewski, Flavio Griggio, Rahim Kasim +1 more |
2023-09-05 |
$19,899,000 |
| 8421225 |
Three-dimensional stacked substrate arrangements |
Shriram Ramanathan, Patrick Morrow, Scott List, Michael Chan, Mauro J. Kobrinsky +3 more |
2013-04-16 |
$28,862,000 |
| 8203208 |
Three-dimensional stacked substrate arrangements |
Shriram Ramanathan, Patrick Morrow, Scott List, Michael Chan, Mauro J. Kobrinsky +3 more |
2012-06-19 |
$20,138,000 |
| 7973407 |
Three-dimensional stacked substrate arrangements |
Shriram Ramanathan, Patrick Morrow, Scott List, Michael Chan, Mauro J. Kobrinsky +3 more |
2011-07-05 |
$27,745,000 |
| 7220674 |
Copper alloys for interconnections having improved electromigration characteristics and methods of making same |
Paul McGregor, Carolyn Block, Shu Jin |
2007-05-22 |
$18,006,000 |
| 6977220 |
Copper alloys for interconnections having improved electromigration characteristics and methods of making same |
Paul McGregor, Carolyn Block, Shu Jin |
2005-12-20 |
$37,307,000 |
| 6838299 |
Forming defect prevention trenches in dicing streets |
Rose Mulligan, Jun He, Susanne Menezes, Steven Towle |
2005-01-04 |
$23,080,000 |
| 6800554 |
Copper alloys for interconnections having improved electromigration characteristics and methods of making same |
Paul McGregor, Carolyn Block, Shu Jin |
2004-10-05 |
$22,015,000 |
| 6794755 |
Surface alteration of metal interconnect in integrated circuits for electromigration and adhesion improvement |
Jose Maiz, Xiaorong Morrow, Carolyn Block, Jihperng Leu, Paul McGregor +2 more |
2004-09-21 |
$17,403,000 |
| 6777810 |
Interconnection alloy for integrated circuits |
Donald S. Gardner |
2004-08-17 |
$19,443,000 |
| 6740427 |
Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making same |
Madhav Datta, Dave Emory, Tzeun-luh Huang, Subhash M. Joshi, Christine A. King +4 more |
2004-05-25 |
$32,256,000 |
| 6646340 |
Thermally coupling electrically decoupling cooling device for integrated circuits |
Timothy L. Deeter, Daniel James Murray, Daniel Pantuso, Sarangapani Sista |
2003-11-11 |
$43,556,000 |
| 6525419 |
Thermally coupling electrically decoupling cooling device for integrated circuits |
Timothy L. Deeter, Daniel James Murray, Daniel Pantuso, Sarangapani Sista |
2003-02-25 |
$39,445,000 |
| 6309956 |
Fabricating low K dielectric interconnect systems by using dummy structures to enhance process |
Chien Chiang, David B. Fraser, Anne S. Mack, Jin Lee, Sing-Mo Tzeng +3 more |
2001-10-30 |
$145,735,000 |
| 6303464 |
Method and structure for reducing interconnect system capacitance through enclosed voids in a dielectric layer |
Eng T. Gaw, Quat Vu, David B. Fraser, Chien Chiang, Ian A. Young |
2001-10-16 |
$231,350,000 |
| 6100709 |
Silicon wafer testing rig and a method for testing a silicon wafer wherein the silicon wafer is bent into a dome shape |
Krishna Seshan, Donald L. Scharfetter |
2000-08-08 |
$246,908,000 |
| 5909635 |
Cladding of an interconnect for improved electromigration performance |
Donald S. Gardner, Quat Vu |
1999-06-01 |
$142,810,000 |
