| 8299617 |
Method and apparatus for forming metal-metal oxide etch stop/barrier for integrated circuit interconnects |
Jihperng Leu, Markus Kuhn, Jose Maiz |
2012-10-30 |
| 7727892 |
Method and apparatus for forming metal-metal oxide etch stop/barrier for integrated circuit interconnects |
Jihperng Leu, Markus Kuhn, Jose Maiz |
2010-06-01 |
| 7456490 |
Sealing porous dielectrics with silane coupling reagents |
Grant Kloster, Chih-I Wu |
2008-11-25 |
| 7339271 |
Metal-metal oxide etch stop/barrier for integrated circuit interconnects |
Jihperng Leu, Markus Kuhn, Jose Maiz |
2008-03-04 |
| 7122481 |
Sealing porous dielectrics with silane coupling reagents |
Grant Kloster, Chih-I Wu |
2006-10-17 |
| 6794755 |
Surface alteration of metal interconnect in integrated circuits for electromigration and adhesion improvement |
Jose Maiz, Thomas Marieb, Carolyn Block, Jihperng Leu, Paul McGregor +2 more |
2004-09-21 |
| 6661094 |
Semiconductor device having a dual damascene interconnect spaced from a support structure |
Patrick Morrow |
2003-12-09 |
| 6448177 |
Method of making a semiconductor device having a dual damascene interconnect spaced from a support structure |
Patrick Morrow |
2002-09-10 |